• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1753-1755
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• 1996

This paper presents an analysis of the 3D microwave oven considering its forming. The results were compared with experimental data. Finite Element Method(FEM) using edge clement is employed for the analysis. For solving the large sparse system matrix equation was solved using the parallelized QMR method. Analysis of the 3d cavity has troublesome difficulties such as spurious solutions, too many memory and long computation time. We overcome this difficulties by using edge clement for spurious solutions and the parallelized QMR method by the aid of Paralle Virtual Machine(PVM) for the memory and computation time.

• Journal of Ginseng Research
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• v.48 no.1
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• pp.59-67
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• 2024

Background: Alzheimer's disease (AD) has memory impairment associated with aggregation of amyloid plaques and neurofibrillary tangles in the brain. Although anti-amyloid β (Aβ) protein antibody and chemical drugs can be prescribed in the clinic, they show adverse effects or low effectiveness. Therefore, the development of a new drug is necessarily needed. We focused on the cognitive function of Panax ginseng and tried to find active ingredient(s). We isolated panaxcerol D, a kind of glycosyl glyceride, from the non-saponin fraction of P. ginseng extract. Methods: We explored effects of acute or sub-chronic administration of panaxcerol D on cognitive function in scopolamine- or Aβ_25-35 peptide-treated mice measured by several behavioral tests. After behavioral tests, we tried to unveil the underlying mechanism of panaxcerol D on its cognitive function by Western blotting. Results: We found that pananxcerol D reversed short-term, long-term and object recognition memory impairments. The decreased extracellular signal-regulated kinases (ERK) or Ca²⁺/calmodulin-dependent protein kinase II (CaMKII) in scopolamine-treated mice was normalized by acute administration of panaxcerol D. Glial fibrillary acidic protein (GFAP), caspase 3, NF-kB p65, synaptophysin and brainderived neurotrophic factor (BDNF) expression levels in Aβ_25-35 peptide-treated mice were modulated by sub-chronic administration of panaxcerol D. Conclusion: Pananxcerol D could improve memory impairments caused by cholinergic blockade or Aβ accumulation through increased phosphorylation level of ERK or its anti-inflammatory effect. Thus, panaxcerol D as one of non-saponin compounds could be used as an active ingredient of P. ginseng for improving cognitive function.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.4
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• pp.229-236
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• 2005

This paper presents a system level architecture evaluation technique that leverages transaction level modeling but also significantly extends it to the realm of system level performance evaluation. A major issue lies with the modeling effort. To reduce the modeling effort the proposed technique develops the concept of worst case scenarios. Since the memory controller is often found to be an important component that critically affects the system performance and thus needs optimization, the paper further addresses how to evaluate and optimize the memory controllers, focusing on the test environment and the methodology. The paper also presents an industrial case study using a real state-of-the-art design. In the case study, it is reported that the proposed technique has helped successfully find the performance bottleneck and provide appropriate feedback on time.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.357-360
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• 2002

This paper is proposed about an efficient pipelined architecture for 3D graphics accelerator to reduce Cache miss ratio. Because cache miss takes a considerable time, about 20∼30 cycle, we reduce cache miss ratio to use pre-fetch. As a result of simulation, we figure out that the miss ratio of cache depends on the size of tile, cache memory and auxiliary cache memory. We can save 6.6% cache miss ratio maximumly.

• Journal of information and communication convergence engineering
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• v.12 no.3
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• pp.186-192
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• 2014

Monolithic three-dimensional integrated chips (3D ICs) are an emerging technology that offers an integration density that is some orders of magnitude higher than the conventional through-silicon-via (TSV)-based 3D ICs. This is due to a sequential integration process that enables extremely small monolithic inter-tier vias (MIVs). For a monolithic 3D memory, we first explore the static random-access memory (SRAM) design. Next, for digital logic, we explore several design styles. The first is transistor-level, which is a design style unique to monolithic 3D ICs that are enabled by the ultra-high-density of MIVs. We also explore gate-level and block-level design styles, which are available for TSV-based 3D ICs. For each of these design styles, we present techniques to obtain the graphic database system (GDS) layouts, and perform a signoff-quality performance and power analysis. We also discuss various challenges facing monolithic 3D ICs, such as achieving 50% footprint reduction over two-dimensional (2D) ICs, routing congestion, power delivery network design, and thermal issues. Finally, we present design techniques to overcome these challenges.

• Journal of KIISE:Computing Practices and Letters
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• v.7 no.5
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• pp.498-509
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• 2001

Collaborative systems allow users, who may be far removed from each other geographically, to do collaborative work such as 3D animation, computer game, and industrial design in a single virtual space. This paper describes our experience to develop a collaborative system framework that aims at expanding the some functions of a stand-alone visual modeling tool, called 3D Studio Max, into those of the distributed collaborative working environments. The paper mainly deals with design and implementation of a 3D shared-object Plug-In with respect to the 3D Studio Max Plug-In Software Development Kit in the distributed collaborative system developed by the authors. There are two major functions of the proposed scheme; one is to write 3D object-information to the shared memory after extracting it from the 3D Studio Max, the other is to create 3D objects after retrieving them from the shared memory. Also, the proposed scheme provides a simple way of storing 3D objects that have variable size, by means of shared memory which located in between the collaborative system clients and 3D studio Max. One of the remarkable virtures of the Plug-In is to reduce a considerable amount of shared object data which in consequence can mitigate the network overhead. This can be achieved by the fact that the system is able to extract a minimum amount of 3D objects that are required to transmit. Also, using the proposed scheme, user can facilitate 3D Studio Max into distributed collaborative working environments. This, in consequence give many benefits such as saving time as well as eliminating space constraints in the course of 3D modeling when we are under industrial design process.

• Science of Emotion and Sensibility
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• v.14 no.1
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• pp.117-126
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• 2011

This study investigates the physical properties and manufacturing method of shape memory fabric for emotional garment made by polypropylene. For this purpose, polypropylene(PP) POY and SDY were texturized using low temperature and constant length heat treatment texturing technologies, respectively. The shape memory fabrics made using these texturized PP yarns were woven with two kinds of PET and PTT shape memory yarns on the air-jet loom and the various physical properties of four kinds of shape memory fabrics were measured and discussed. The tenacity and breaking strain of PP texturized yarns treated by low temperature and constant length heat treatment showed high weaving efficiency and the wet thermal shrinkage of PP textured yarns was shown less than 1.5%, dry thermal shrinkage was ranged between 3% and 5%, which means thermal stability compared to the PTT textured yarn with high thermal shrinkage, 5~8%. The shape memory characteristics of PP shape memory fabrics measured by Toray method showed five grade as same value as PTT shape memory fabric. The heat keeping property of the PP shape memory fabric showed 56% higher value than that of PTT shape memory fabric. The water repellency of PP shape memory fabric measured by spray method showed five grade as same value as PTT shape memory fabric treated with water repellent agent. Especially, shape memory properties of PP shape memory fabric measured by 3-D image and camera measurement methods showed similar characteristics to the PTT shape memory fabric.

• Fashion & Textile Research Journal
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• v.24 no.6
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• pp.812-824
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• 2022

This study proposes to develop a 3D printed re-entrant(RE) strip by shape memory thermoplastic polyurethane that can be deformed and recovered by thermal stimulation. The most suitable 3D printing infill density condition and temperature condition during shape recovery for mechanical behavior were confirmed. As the poisson's ratio indicated, the higher the recovery temperature, the closer the poisson's ratio to zero and the better the auxetic properties. After recovery testing for five minutes, it appeared that the shape recovery ratio was the highest at 70℃. The temperature range when the shape recovery ratio appeared to be more than 90% was a recovery temperature of more than 50℃ and 60℃ when deformed under a constant load of 100 gf and 300 gf, respectively. This indicated that further deformation occurred after maximum recovery when recovered at a temperature of 80℃, which is above the glass transition temperature range. As for REstrip by infill density, a shape recovery properties of 100% was superior than 50%. Additionally, as the re-entrant structure exhibited a shape recovery ratio of more than 90%, and exhibited auxetic properties. It was confirmed that the infill density condition of 100% and the temperature condition of 70℃ are suitable for REstrips for applying the actuator.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.89-110
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• 2005

A new 3D integration technology using wafer-to-wafer and chip-to-wafer stacking method was described. It was demonstrated that 3D microprocessor, 3D shared memory, 3D image processing chip and 3D artificial retina chip fabricated using 3D integration technology were successfully operated. The possibility of applying 3D image processing chip and 3D artificial retina chip to Robot's eye was investigated. The possibility of implanting 3D artificial retina chip into human eye was investigated.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.31 no.1
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• pp.41-48
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• 2013

The aim of the present study is to design a memory-efficient octree for querying large 3D point cloud. The aim has been fulfilled by omitting variables for minimum bounding hexahedral (MBH) of each octree node expressed in C++ language and by passing the re-estimated MBH from parent nodes to child nodes. More efficiency has been reported by two-fold processes of generating pseudo and regular trees to declare an array for all anticipated nodes, instead of using new operator to declare each child node. Experiments were conducted by constructing tree structures and querying neighbor points out of real point cloud composed of more than 18 million points. Compared with conventional methods using MBH information defined in each node, the suggested methods have proved themselves, in spite of existing trade-off between speed and memory efficiency, to be more memory-efficient than the comparative ones and to be practical alternatives applicable to large 3D point cloud.