Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2005.09a
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- Pages.89-110
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- 2005
A New Smart Stacking Technology for 3D-LSIs
Abstract
A new 3D integration technology using wafer-to-wafer and chip-to-wafer stacking method was described. It was demonstrated that 3D microprocessor, 3D shared memory, 3D image processing chip and 3D artificial retina chip fabricated using 3D integration technology were successfully operated. The possibility of applying 3D image processing chip and 3D artificial retina chip to Robot's eye was investigated. The possibility of implanting 3D artificial retina chip into human eye was investigated.
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