• Title/Summary/Keyword: 3D Thermal Information

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Temperature transients of piston of a Camless S.I Engine using different combustion boundary condition treatments

  • Gill, KanwarJabar Singh;Singh, Khushpreet;Cho, H.M.;Chauhan, Bhupendra Singh
    • Journal of Energy Engineering
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    • v.23 no.3
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    • pp.221-230
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    • 2014
  • Simplified finite element model of spark ignition (SI) engine to analyse combustion heat transfer is presented. The model was discredited with 3D thermal elements of global length 5 mm. The fuel type is petrol. Internal nodal temperature of cylinder body is defined as 21000C to represent occurrence of gasoline combustion. Material information and isotropic material properties are taken from published report. The heat transfer analysis is done for the instant of combustion. The model is validated by comparing the computed maximum temperature at the piston surface with the published result. The computed temperature gradient at the crucial parts are plotted and discussed. It has been found that the critical top surface suffered from thermal and the materials used to construct the engine parts strongly influenced the temperature distribution in the engine. The model is capable to analyze heat transfer in the engine reasonably and efficiently.

A Study on the Best Applicationsof Infra-Red(IR) Sensors Mounted on the Unmanned Aerial Vehicles(UAV) in Agricultural Crops Field (무인기 탑재 열화상(IR) 센서의 농작물 대상 최적 활용 방안 연구)

  • Ho-Woong Shon;Tae-Hoon Kim;Hee-Woo Lee
    • Journal of the Korean Society of Industry Convergence
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    • v.26 no.6_2
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    • pp.1073-1082
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    • 2023
  • Thermal sensors, also called thermal infrared wavelength sensors, measure temperature based on the intensity of infrared signals that reach the sensor. The infrared signals recognized by the sensor include infrared wavelength(0.7~3.0㎛) and radiant infrared wavelength(3.0~100㎛). Infrared(IR) wavelengths are divided into five bands: near infrared(NIR), shortwave infrared(SWIR), midwave infrared(MWIR), longwave infrared(LWIR), and far infrared(FIR). Most thermal sensors use the LWIR to capture images. Thermal sensors measure the temperature of the target in a non-contact manner, and the data can be affected by the sensor's viewing angle between the target and the sensor, the amount of atmospheric water vapor (humidity), air temperature, and ground conditions. In this study, the characteristics of three thermal imaging sensor models that are widely used for observation using unmanned aerial vehicles were evaluated, and the optimal application field was determined.

High Efficiency AMOLED using Hybrid of Small Molecule and Polymer Materials Patterned by Laser Transfer

  • Chin, Byung-Doo;Suh, Min-Chul;Kim, Mu-Hyun;Kang, Tae-Min;Yang, Nam-Choul;Song, Myung-Won;Lee, Seong-Taek;Kwon, Jang-Hyuk;Chung, Ho-Kyoon;Wolk, Martin B.;Bellmann, Erika;Baetzold, John P.
    • Journal of Information Display
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    • v.4 no.3
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    • pp.1-5
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    • 2003
  • Laser-Induced Thermal Imaging (LITI) is a laser addressed patterning process and has unique advantages such as high-resolution patterning with over all position accuracy of the imaged stripes of within 2.5 micrometer and scalability to large-size mother glass. This accuracy is accomplished by real-time error correction and a high-resolution stage control system that includes laser interferometers. Here the new concept of hybrid system that complement the merits of small molecule and polymer to be used as an OLED; our system can realize easy processing of light emitting polymers and high luminance efficiency of small molecules. LITI process enables the stripes to be patlerned with excellent thickness uniformity and multi-stacking of various functional layers without having to use any type of fine metal shadow mask. In this study, we report a full-color hybrid OLED using the multi-layered structure consisting of small molecules and polymers.

Development of Gas Type Identification Deep-learning Model through Multimodal Method (멀티모달 방식을 통한 가스 종류 인식 딥러닝 모델 개발)

  • Seo Hee Ahn;Gyeong Yeong Kim;Dong Ju Kim
    • KIPS Transactions on Software and Data Engineering
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    • v.12 no.12
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    • pp.525-534
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    • 2023
  • Gas leak detection system is a key to minimize the loss of life due to the explosiveness and toxicity of gas. Most of the leak detection systems detect by gas sensors or thermal imaging cameras. To improve the performance of gas leak detection system using single-modal methods, the paper propose multimodal approach to gas sensor data and thermal camera data in developing a gas type identification model. MultimodalGasData, a multimodal open-dataset, is used to compare the performance of the four models developed through multimodal approach to gas sensors and thermal cameras with existing models. As a result, 1D CNN and GasNet models show the highest performance of 96.3% and 96.4%. The performance of the combined early fusion model of 1D CNN and GasNet reached 99.3%, 3.3% higher than the existing model. We hoped that further damage caused by gas leaks can be minimized through the gas leak detection system proposed in the study.

Coplanar Waveguides Fabricated on Oxidized Porous Silicon Air-Bridge for MMIC Application (다공질 실리콘 산화막 Air-Bridge 기판 위에 제작된 MMIC용 공면 전송선)

  • 박정용;이종현
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.5
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    • pp.285-289
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    • 2003
  • This paper proposes a 10 ${\mu}{\textrm}{m}$ thick oxide air-bridge structure which can be used as a substrate for RF circuits. The structure was fabricated by anodic reaction, complex oxidation and rnicrornachining technology using TMAH etching. High quality films were obtained by combining low temperature thermal oxidation (50$0^{\circ}C$, 1 hr at $H_2O$/O$_2$) and rapid thermal oxidation (RTO) process (105$0^{\circ}C$, 2 min). This structure is mechanically stable because of thick oxide layer up to 10 ${\mu}{\textrm}{m}$ and is expected to solve the problem of high dielectric loss of silicon substrate in RF region. The properties of the transmission line formed on the oxidized porous silicon (OPS) air-bridge were investigated and compared with those of the transmission line formed on the OPS layers. The insertion loss of coplanar waveguide (CPW) on OPS air-bridge was (about 1 dB) lower than that of CPW on OPS layers. Also, the return loss of CPW on OPS air-bridge was less than about - 20 dB at measured frequency region for 2.2 mm. Therefore, this technology is very promising for extending the use of CMOS circuitry to higher RF frequencies.

Thermal Issues in 3D IC

  • Sin, In-Seop;Kim, Sang-Min;Baek, Seung-Hun;Seo, Mun-Jun;Yu, Ri-Eun;Sin, Yeong-Su
    • The Magazine of the IEIE
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    • v.36 no.9
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    • pp.40-50
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    • 2009
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Structure Design and Thermal Analysis of Cryogenic Cooling System for a 1500 A, 400 mH Class HTS DC Reactor (1500 A, 400 mH급 초전도 직류 리액터용 극저온 냉각 시스템 구조 설계 및 열 해석)

  • Quan, Dao-Van;Le, Tat-Thang;Sung, Hae-Jin;Park, Min-Won;Yu, In-Keun
    • Journal of Korea Society of Industrial Information Systems
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    • v.23 no.1
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    • pp.31-41
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    • 2018
  • This paper discusses a structure design and thermal analysis of cryogenic conduction cooling system for a high current HTS DC reactor. Dimensions of the conduction cooling system parts including HTS magnets, bobbin structures, current leads, support bars, and thermal exchangers were calculated and drawn using a 3D CAD program. A finite element method model was built for determining the optimal design parameters and analyzing the thermo-mechanical characteristics. The operating current and inductance of the reactor magnet were 1,500 A, 400 mH, respectively. The thermal load of the HTS DC reactor was analyzed for determining the cooling capacity of the cryo-cooler. Hence, we carried out the operating test of conduction cooling system of the 1st stage area with high current flow. The cooper bars was cooled down to 40 K and HTS leads operated stably. As a experiment result, the total heat load of the 1st stage area is 190 W. The study results can be effectively utilized for the design and fabrication of a commercial HTS DC reactor.

Building Integrated Vegetation Systems into the New Sainsbury's Building Based on BIM

  • Lee, Dong-Kyu
    • Journal of KIBIM
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    • v.4 no.2
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    • pp.25-32
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    • 2014
  • Today, there is a growing need of environment-friendly buildings, so-called 'green', facilities, and energy saving buildings to decrease environmental pollutants released into cities by construction activities. Green-Building Information Modeling (Green-BIM) is a purpose-built solution which supports to forecast energy consumption of 3-D model of a building by augmenting its primary 3-D measurements (width, height and depth) with many more dimensions (e.g. time, costs, social impacts and environmental consequences) throughout a series of sequential phases in the lifecycle of a building. The current study was carried out in order to integrate vegetation systems (particularly green roof and green wall systems) and investigate thermal performance of the new Sainsbury's building which will be built on Melton road, Leicester, United Kingdom. Within this scope, a 3-D building model of the news Sainsbury's building was first developed in $Autodesk^{(R)}$ $Revit^{(R)}$ and this model was then simulated in $Autodesk^{(R)}$ $Ecotect^{(R)}$once weather data of the construction site was obtained from $Autodesk^{(R)}$ Green Building $Studio^{(R)}$. This study primarily analyzed data from (1) solar radiation, (2) heat gains and losses, and (3) heating and cooling loads simulation to evaluate thermal performance of the building integrated with vegetation system or conventionally available envelops. The results showed that building integrated vegetation system can potentially reduce internal solar gains on the building rooftops by creating a 'bioshade'. Heat gains and losses through roofs and walls were markedly diminished by offering greater insulation on the building. Annual energy loads for heating and cooling were significantly reduced by vegetation more significantly through the green roof system in comparison to green wall system.

Heat Conduction Analysis and Improvement of a High-Power Optical Semiconductor Source Using Graphene Layers (그래핀을 적용한 고출력 반도체 광원의 열특성 분석)

  • Ji, Byeong-Gwan;O, Beom-Hoan
    • Korean Journal of Optics and Photonics
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    • v.26 no.3
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    • pp.168-171
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    • 2015
  • The heat flow characteristics of a high-power optical semiconductor source have been analyzed using a 3D CFD commercial tool, and the thermal resistance values for each of the layers revealed the places for thermal bottlenecks to be improved. As the heat source of a LD (Laser Diode) has a small volume and a narrow surface, the effective thermal cross-sectional area near it is also quite small. It was possible to expand the cross-sectional area effectively by using graphene layers on the TIM (Thermal Interface Material) layers of a LD chip. The effective values of heat resistance for the layers are compared to confirm the improvement effect of the graphene layers before and after, which can be considered to expand the thermal cross section of the heat transfer path.

Development of three-dimensional thermal oxidation simulator (3차원 산화 시뮬레이터 개발)

  • 이제희;윤상호;광태영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.2
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    • pp.38-45
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    • 1997
  • In this paper, the three-dimensional stress effect of thermal oxide is simulated. We developed a three-dimensional finite element numerical simulator including three-dimensional adaptive mesh generator that is able to refine and eliminate nearby moving boundary of oxide, and oxidation solver with stress model. To investigate the behavior of thermal oxidation the simulations of thermal oxidation for island and hole structures are carried out assuming silicon wafer of <100> direction, temperature of $1000^{\circ}C$, oxidation time of 60min, wet ambient, initial oxide thickness of $300\AA$, and nitride thickness of $2, 000\AA$. The main effect of deformation at the corner area of oxide is due to distribution of oxidant, but the deformation of oxide is affected by the stressin theoxide. In the island structure which is the structure mostly covered with nitride and a coner is opended to oxidation, oxidation is reduced at the coner by compressive stress. In the hole structure which is the structure mostly opedned to oxide and a coner is convered with nitride, however, oxidation is increased at the coner by tensile stress.

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