• Ceramist
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• v.12 no.3
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• pp.7-13
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.12-16
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• 2001

• Journal of the Korean Society of Industry Convergence
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• v.26 no.6_2
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• pp.1145-1153
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• 2023

This study presents the development of pointcloud data integration technology in construction sites via drone photogrammetry and MMS LiDAR. The integration of pointcloud data from drones and MMS technology can provide precise and accurate 3D digital maps of construction sites, which can benefit the development of smart construction and BIM. The advantages of using both drones and MMS technology for pointcloud data acquisition in construction sites are discussed, along with the limitations and challenges of using drone photogrammetry and MMS LiDAR for pointcloud data integration. The results of this study can contribute to the advancement of pointcloud data integration technology in construction sites and improve the efficiency and accuracy of construction projects.

• The KIPS Transactions:PartD
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• v.18D no.3
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• pp.149-156
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• 2011

Recently, enterprise systems require the necessity of integration for data sharing and cooperation. As a methodology for integration, Service-Oriented Architecture for service integration and Master Data for integration of data, which is used for service, were appeared. This paper suggests a method that operates BP(Business Process) efficiently. We make XMDR(eXtended Meta Data Registry) as knowledge-repository to support the BP and construct data hubs to operate it. XMDR manages MDM(Master Data Management) to integrate the data, resolves heterogeneity between the data and provides relationship to the business efficiently. This is composed of MDR(Meta Data Registry), ontology and BR(Business Relations). MDR describes relationship between meta data to solve structured heterogeneity. Ontology describes semantic heterogeneity and relationship between data. BR describes relationship between tasks. XMDR data hub supports the management of master data and interaction of different process effectively.

• Microbiology and Biotechnology Letters
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• v.23 no.5
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• pp.536-543
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• 1995

Multicopy integration vector is a very useful vector system in that they can be integrated into chromosomal DNA in several copies and stably maintained under non-selective conditions. To develop a multicopy integration vector system in the yeast Yarrowia lipolytica, P-type ribosomal DNA was cloned from Y lipolytica. A HindIII-BglII fragment of the cloned rDNA and a promoterless URA3 gene were inserted into pGEM1, generating multicopy integration vectors, pMIYL-1 and pMIYL-2. The rDNA fragment is for targeted homologous recombination between the vector and the chromosomal DNA of Y. lipolytica, and the promoterless URA3 gene is a defective selection marker for inducing multicopy integration. pMIYL-1 and pMIYL-2 have an unique restriction enzyme site, KpnI, and two unique restriction enzyme sites, KpnI and EcoRI, repectively, which can be used for targeting of the vectors into the rDNA of Y. lipolytica chromosomal DNA. After transformation of the vectors into Y. lipolytica, copy number and stability were analyzed by Southern hybridization. The vectors were found to be present in less than 5 copies per cell and were stably maintained during growth in non-selective media.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.71-78
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• 2012

This paper describes trends in conventional scaling compared with advanced technologies such as 3D integration (3DI) and bumpless through-silicon via (TSV) processes, as well as the characteristics of CMOS (Complementary Metal Oxide Semiconductor) Logic device after thinning the wafers to less than $10{\mu}m$. Each module process including thinning, stacking, and TSV, is optimized for 3D Wafer-on-Wafer (WOW) application. Optimization results are discussed with valuable data in detail. Since vertical wiring of bumpless TSV can be connected directly to the upper and lower substrates by self-alignment, bumps are not necessary when TSV interconnects are used.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.521-522
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• 2012

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.2
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• pp.76-82
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• 2003

The robust stack storage node and sufficient cell capacitance for high performance is indispensable for 90 nm DRAM capacitor. For the first time, we successfully demonstrated MIS capacitor process integration for 90 nm DRAM technology. Novel cell layout and integration technology of 90 nm DRAM capacitor is proposed and developed, and it can be extended to the next generation DRAM. Diamond-shaped OCS with 1.8 um stack height is newly developed for large capacitor area with better stability. Furthermore, the novel $Al_2O_3/HfO_2$ dielectric material with equivalent oxide thickness (EOT) of 25 ${\AA}$ is adopted for obtaining sufficient cell capacitance. The reliable cell capacitance and leakage current of MIS capacitor is obtained with ~26 fF/cell and < 1 fA/ceil by $Al_2O_3/HfO_2$ dielectric material, respectively.

• Nuclear Engineering and Technology
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• v.56 no.8
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• pp.3188-3198
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• 2024

Efficient and secure decommissioning of nuclear facilities demands advanced technologies. In this context, gamma-ray detection and imaging are crucial in identifying radioactive hotspots and monitoring radiation levels. Our study is dedicated to developing a gamma-ray detection system tailored for integration into robotic platforms for nuclear decommissioning, offering a safe and automated solution for this intricate task and ensuring the safety of human operators by mitigating radiation exposure and streamlining hotspot localization. Our approach integrates a Compton camera based 3D reconstruction algorithm with a single Timepix3 detector. This eliminates the need for a second detector and significantly reduces system weight and cost. Additionally, combining a 3D camera with the setup enhances hotspot visualization and interpretation, rendering it an ideal solution for practical nuclear decommissioning applications. In a proof-of-concept measurement utilizing a 137Cs source, our system accurately localized and visualized the source in 3D with an angular error of 1° and estimated the activity with a 3% relative error. This promising result underscores the system's potential for deployment in real-world decommissioning settings. Future endeavors will expand the technology's applications in authentic decommissioning scenarios and optimize its integration with robotic platforms. The outcomes of our study contribute to heightened safety and accuracy for nuclear decommissioning works through the advancement of cost-effective and efficient gamma-ray detection systems.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.12
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• pp.17-23
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• 1997

A 3-D vision system is developed to evaluate blanks' line up and monitor gap and thickness difference between blanks in tailored blank welding system. A structured lighting method is used for 3-D vision recognition. Images of sheared portion in blanks are irregular according to roughness of blank surface, shape of sheared geometry and blurring. It is difficult to get accurate and reliable informations in the case of using binary image processing or contour detection techniques in real time for such images. We propoe a new energy integration method robust to blurring and changes of illumination. The method is computationally simple, and uses feature restoration concept, different to another digital image restoration methods which aim image itself restoration and may be used in conventional applications using structured line lighting technique. Experimental results show this system measuring repeatability is .+-. pixel for gap and thickness difference in static and dynamic tests. The data are expected to be useful for preview gap control.