• 제목/요약/키워드: 3-Dimensional Technology

검색결과 3,645건 처리시간 0.034초

3차원 프린팅(3DP) 공정을 기반으로 한 임의형상제작(SFF) 시스템 개발에 관한 연구 (A Study on the Development of SFF System based on 3DP Process)

  • 이원희;김정수;이민철;김동수
    • 한국정밀공학회지
    • /
    • 제23권7호
    • /
    • pp.168-176
    • /
    • 2006
  • Nowadays, Three dimensional printing (3DP) technique that is one of solid freeform fabrication (SFF) technology has been notable issue, and has been applied by various fields. The SFF system can fabricate three dimensional objects of solid freeform with high speed and low cost using ink jet printing technology. In this research, a SFF system to analyze 3DP process technology is developed. We applied sliding mode control with sliding perturbation observer (SMCSPO) algorithm and minimized position error to the developed SFF system. We analyzed and optimized process variables such as jetted volume, layer thickness, powder bed and so on experimentally. Also. the dimensional error of a developed SFF system is evaluated. Finally, the feasibility of application to bio manufacturing is presented through successful fabrication of teeth and cranium model.

3차원 형상기반 기계상 측정 시스템 개발에 관한 연구 (A Study on the Development of On Machine Measuring System using 3-Dimensional solid model)

  • 구본권;류제구;김세윤
    • 한국소성가공학회:학술대회논문집
    • /
    • 한국소성가공학회 2002년도 금형가공 심포지엄
    • /
    • pp.3-10
    • /
    • 2002
  • In this study on machine measuring system based on solid feature was developed. This system was applied with injection mold using 3 dimensional solid modeler for verification. Developed program include pre-processor, main processor, and post processor. In pre-processor there are functions which check intersection, simulate motion of probe and calculate measuring time. Main processor generates measuring path and output NC code in Unigraphics. In post-processor functions that include evaluation of undercut or overcut and display of measuring procedure are offered. In addition analysis module for quality control of measured data on manufactured product was developed with geometric and dimensional tolerance concept. As the result developed program could get stability of system, precision of product, rapidity and cost down of manufacturing process compared with before measuring process.

  • PDF

입체 형상 분석을 위한 3차원 계측시스템의 활용 -WBS와 RapidForm 2004를 중심으로- (Applications of Three-Dimensional Measurement System for Shape Analysis -Focused on WBS and RapidForm 2004-)

  • 이명희;정희경
    • 복식
    • /
    • 제55권5호
    • /
    • pp.55-64
    • /
    • 2005
  • The concern with three-dimensional measurement has been growing in recent years. And over the last few years, several studies have been made on three-dimensional measurement. Some of the studies using a three-dimensional measurement have focused on type of form of human body and evaluation of fitness. But there has been no study about applications of three-dimensional measurement system for shape analysis. So, the purpose of this study was to investigate about application of three-dimensional mea-surement system lot shape analysis. The instrument and tools for three-dimensional measurement was Whole Body 3D scanner(model name: Exyma-WBS2H). Analysis program used in experiment is Rapid Form 2004 PPI (INUS technology, Int, Korea). The following results were obtained; 1. The point data using three-dimensional measurement system built 3D model. 2. The three-dimensional data were used to analyze length and curvature of shape. 3. The shape using three-dimensional measurement system could be used in variety field.

HYPERSURFACES IN A 6-DIMENSIONAL SPHERE

  • Hashimoto, Hideya;Funabashi, Shoichi
    • 대한수학회지
    • /
    • 제34권1호
    • /
    • pp.23-42
    • /
    • 1997
  • A 6-dimensional sphere considered as a homogeneous space $G_2/SU(3)$ where $G_2$ is the group of automorphism of the octonians O. From this representation, we can define an almost comlex structure on a 6-dimensional sphere by making use of the vector cross product of the octonians. Also it is known that a homogeneous space $G_2/U(2)$ coincides with the Grassmann manifold of oriented 2-planes of a 7-dimensional Euclidean space.

  • PDF

Fabrication of three-dimensional electrical patterns by swollen-off process: An evolution of the lift-off process

  • Mansouri, Mariam S.;An, Boo Hyun;Shibli, Hamda Al;Yassi, Hamad Al;Alkindi, Tawaddod Saif;Lee, Ji Sung;Kim, Young Keun;Ryu, Jong Eun;Choi, Daniel S.
    • Current Applied Physics
    • /
    • 제18권11호
    • /
    • pp.1235-1239
    • /
    • 2018
  • We present a novel process to fabricate three-dimensional (3D) metallic patterns from 3D printed polymeric structures utilizing different hygroscopic swelling behavior of two different polymeric materials. 3D patterns are printed with two different polymers as cube shape. The surface of the 3D printed polymeric structures is plated with nickel by an electroless plating method. The nickel patterns on the surface of the 3D printed cube shape structure are formed by removing sacrificial layers using the difference in the rate of hygroscopic swelling between two printing polymer materials. The hygroscopic behavior on the interfaced structure was modeled with COMSOL Multiphysics. The surface and electrical properties of the fabricated three-dimensional patterns were analyzed and characterized.

3차원 집적 회로 소자 특성 (Characteristics of 3-Dimensional Integration Circuit Device)

  • 박용욱
    • 한국전자통신학회논문지
    • /
    • 제8권1호
    • /
    • pp.99-104
    • /
    • 2013
  • 소형화된 고기능성 휴대용 전자기기의 수요 급증에 따라 기존에 사용되던 수평구조의 2차원 회로의 크기를 줄이는 것은, 전기 배선의 신호지연 증가로 한계에 도달했다. 이러한 문제를 해결하기 위해 회로들을 수직으로 적층한 뒤, 수평구조의 긴 신호배선을 짧은 수직 배선으로 만들어 신호지연을 최소화하는 3차원 집적 회로 적층기술이 새롭게 제안되었다. 본 연구에서는 차세대 반도체 소자의 회로 집적도를 비약적으로 증가시킬 수 있고, 현재 문제점으로 대두 되고 있는 선로의 증가, 소비전력, 소자의 소형화, 다기능 회로 문제를 동시에 해결 할 수 있는 3차원 구조를 갖는 회로소자에 대한 특성을 연구하였다.

3차원 레이저 스캐너를 이용한 인쇄롤 가공에 관한 연구 (Study on Printing Roll Manufacturing by using 3 Dimensional Laser Scanner)

  • 강희신;노지환;손현기
    • 한국레이저가공학회지
    • /
    • 제16권4호
    • /
    • pp.17-23
    • /
    • 2013
  • The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

  • PDF

3차원 자유곡면식을 이용한 LED 비대칭 렌즈 설계 및 성능 비교 분석 (Analysis of Performance on Asymmetric LED Lens Design Using Three-Dimensional Free-Form Surface Expression)

  • 이창수;이수영;현동훈
    • 한국생산제조학회지
    • /
    • 제26권3호
    • /
    • pp.328-336
    • /
    • 2017
  • The exit surface of a lens is designed using a three-dimensional free-form expression in order to easily modify a curved surface. This enables the design of numerical values and mathematical things using three-dimensional free-form expression, and enhances precision because it can be fine-tuned via numerical control. The standard of "Classification of Luminaire Light Distribution" for outdoor lighting fixtures by IESNA is adopted in order to examine the correlation between three-dimensional free-form surface expression and lighting performance. The variation of light distribution type and range is analyzed using the values of maximum light intensity and 50% light intensity. The actual tolerance occurs owing to parameters such as the thickness of the lens, the distance between LEDs, and the movement of the center of the incident surface; the effects of changes in these parameters on the performance are compared and analyzed.

Optimized Entity Attribute Value Model: A Search Efficient Re-presentation of High Dimensional and Sparse Data

  • Paul, Razan;Latiful Hoque, Abu Sayed Md.
    • Interdisciplinary Bio Central
    • /
    • 제3권3호
    • /
    • pp.9.1-9.5
    • /
    • 2011
  • Entity Attribute Value (EAV) is the widely used solution to represent high dimensional and sparse data, but EAV is not search efficient for knowledge extraction. In this paper, we have proposed a search efficient data model: Optimized Entity Attribute Value (OEAV) for physical representation of high dimensional and sparse data as an alternative of widely used EAV. We have implemented both EAV and OEAV models in a data warehousing en-vironment and performed different relational and warehouse queries on both the models. The experimental results show that OEAV is dramatically search efficient and occupy less storage space compared to EAV.

3차원 패키징을 위한 TSV의 다양한 Cu 충전 기술 (Various Cu Filling Methods of TSV for Three Dimensional Packaging)

  • 노명훈;이준형;김원중;정재필;김형태
    • Journal of Welding and Joining
    • /
    • 제31권3호
    • /
    • pp.11-16
    • /
    • 2013
  • Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.