• The Journal of Advanced Prosthodontics
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• v.10 no.1
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• pp.43-49
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• 2018

PURPOSE. The purpose of this in vitro study is to examine the effects of a nano-structured alumina coating on the adhesion between resin cements and zirconia ceramics using a four-point bending test. MATERIALS AND METHODS. 100 pairs of zirconium bar specimens were prepared with dimensions of $25mm{\times}2mm{\times}5mm$ and cementation surfaces of $5mm{\times}2mm$. The samples were divided into 5 groups of 20 pairs each. The groups are as follows: Group I (C) - Control with no surface modification, Group II (APA) - airborne-particle-abrasion with $110{\mu}m$ high-purity aluminum oxide ($Al_2O_3$) particles, Group III (ROC) - airborne-particle-abrasion with $110{\mu}m$ silica modified aluminum oxide ($Al_2O_3+SiO_2$) particles, Group IV (TCS) - tribochemical silica coated with $Al_2O_3$ particles, and Group V (AlC) - nano alumina coating. The surface modifications were assessed on two samples selected from each group by atomic force microscopy and scanning electron microscopy. The samples were cemented with two different self-adhesive resin cements. The bending bond strength was evaluated by mechanical testing. RESULTS. According to the ANOVA results, surface treatments, different cement types, and their interactions were statistically significant (P<.05). The highest flexural bond strengths were obtained in nano-structured alumina coated zirconia surfaces (50.4 MPa) and the lowest values were obtained in the control group (12.00 MPa), both of which were cemented using a self-adhesive resin cement. CONCLUSION. The surface modifications tested in the current study affected the surface roughness and flexural bond strength of zirconia. The nano alumina coating method significantly increased the flexural bond strength of zirconia ceramics.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Journal of Ocean Engineering and Technology
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• v.13 no.3 s.33
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• pp.49-56
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• 1999

Welding is a reliable process and is mainly adopted for fabricating heavy structures. Recently, transverse cracks in the weld metal is serious problem, and they affect cost, efficiency, safety and joint reliability for various welded structures. In this view of point, this study investigated the potential factors for weld metal transverse crack. The main results obtained are as follows; 1) The content of diffusible hydrogen in the commercial flux cored are welding wire was remarkable change by manufacturer. 2) The diffusible hydrogen content was thd main factor for weld metal transverse cracks. 3) Weld metal was immune to transverse cracking under the condition of low diffusible hydrogen content of high restraint condition. 4) The factors for weld metal transverse crack would be the content of diffusible hydrogen and restraint of weld joint.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.11a
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• pp.27.2-27.2
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• 2008

• Journal of Welding and Joining
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• v.28 no.3
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• pp.79-85
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• 2010

Hardfacing is one of the frequently applying method to increase surface hardness in hot forging die. Recently, hardfacing receives great attention due to it's repair availability and low cost. In hot forging die, crack resistance and thermal shock resistance have been considered as major properties, However there are few studies for the assessment of these properties. So, it is necessary to establish the assessment method for crack resistance and thermal shock resistance in hardfacing for hot forging die. In this study, flux cored arc welding was applied to make hardfacing welds. Three point bending test was carried out to assess hardfacing weld's crack resistance, and high temperature bending test using salt bath was developed for thermal shock resistance. Consequently, it was possible to assess crack resistance and thermal shock resistance of hardfacing welds for hot forging die quantitatively.

• Journal of the Korean Ceramic Society
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• v.39 no.7
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• pp.675-679
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• 2002

To produce a strengthened glass, single ion exchange properties such as three-point bend strength and residual stress were investigated in soda-lime-silicate substrate glass for display use. The present work showed that the maximum value of strength was 62.5${\times}$10$\sub$6/ kg/㎡ after, the two-step single ion exchange process at 470$^{\circ}C$ for 1 h and 450$^{\circ}C$ for 24 h. As the result of the fracture analysis after bending test, the residual stress on the fractured surface of the strengthened glass increased the flexibility by means of absorbing the elastic deformation energy in the glass. Also, the effects of absorbing the elastic deformation energy were analysed by curvature change, number of multiple crack branches and brittleness.

• The Journal of Advanced Prosthodontics
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• v.3 no.3
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• pp.136-139
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• 2011

PURPOSE. A new light curing urethane dimethacrylate and a cold curing resin with simpler and faster laboratory procedures may have even improved flexural properties. This study investigated the 3-point flexural strengths and flexural moduli of two alternate base materials. MATERIALS AND METHODS. A cold curing resin (Weropress) and a light curing urethane dimethacrylate base material (Eclipse). Along with Eclipse and Weropress, a high impact resin (Lucitone199) and three conventional base materials (QC 20, Meliodent and Paladent 20) were tested. A 3-point bending test was used to determine the flexural strengths and flexural moduli. The mean displacement, maximum load, flexural modulus and flexural strength values and standard deviations for each group were analyzed by means of one-way analysis of variance (ANOVA) (with mean difference significant at the 0.05 level). Post hoc analyses (Scheffe test) were carried out to determine the differences between the groups at a confidence level of 95%. RESULTS. Flexural strength, displacement and force maximum load values of Eclipse were significantly different from other base materials. Displacement values of QC 20 were significantly different from Lucitone 199 and Weropress. CONCLUSION. The flexural properties and simpler processing technique of Eclipse system presents an advantageous alternative to conventional base resins and Weropress offers another simple laboratory technique.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.6
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• pp.145-151
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• 2014

The glass used for mobile display windows is required to have high strength. Chemical strengthening by means of ion exchange is widely used glass. The depth of the layer and the compressed stress are affected by tempering temperature and time. The purpose of this study is to investigate the range of DOL and CS, which to less breakage during reliability tests such as the ball drop test, hole drop test, 3-point bending test, drop test, and tumble test with Soda-lime Glass.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1549-1556
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• 2011

Tensile and creep tests were performed at various temperatures to investigate the mechanical properties of plastics used in automotive instrument panels. Mechanical properties such as Young's modulus and Poisson's ratios changed markedly with the test temperature. Three-point bending creep tests were performed for three kinds of plastics under four loading conditions. Coefficients in the time-hardening power law creep equation were obtained from the experiment, and the creep behavior was represented by a simple expression. The results of finite element creep analysis showed good agreement with the experimental results, while the difference between the numerical and experimental results increased with the load.

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.