Effect of Post-Annealing Conditions on Interfacial Adhesion Energy of Cu-Cu Bonding for 3-D IC Integration |
Jang, Eun-Jung
(School of Materials Science and Engineering, Andong National University)
Pfeiffer, Sarah (EV Group) Kim, Bi-Oh (EV Group) Mtthias, Thorsten (EV Group) Hyun, Seung-Min (Division of Nano-Mechanical Systems Research, Korea Institute of Machinery & Materials) Lee, Hak-Joo (Division of Nano-Mechanical Systems Research, Korea Institute of Machinery & Materials) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
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