• Composites Research
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• v.30 no.2
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• pp.77-83
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• 2017

Liquid silicon infiltration, which is one of the methods of producing fiber reinforced ceramic composites, has several advantages such as low fabrication cost and good shape formability. In order to confirm LSI process feasibility of SiC fiber, $SiC_f/SiC$ composites were fabricated using three types of SiC fibers (Tyranno SA, LoxM, Tyranno S) which have different crystallinity and oxygen content. Composites that were fabricated with LSI process were well densified by less than 2% of porosity, but showed an obvious difference in 3-point bending strength according to crystallinity and oxygen content. When composites in LSI process was exposed to a high temperature, crystallization and micro structural changes were occurred in amorphous SiOC phase in SiC fiber. Fiber shrinkage also observed during LSI process that caused from reaction in fiber and between fiber and matrix. These were confirmed with changes of process temperature by SEM, XRD and TEM analysis.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.10
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• pp.773-782
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• 2020

The development of joint FE models for deep learning neural network (DLNN)-based hybrid FEA is presented. Material models of bolts and bearings in the front axle of tractor, showing complex behavior induced by various tightening conditions, were replaced with DLNN models. Bolts are modeled as one-dimensional Timoshenko beam elements with six degrees of freedom, and bearings as three-dimensional solid elements. Stress-strain data were extracted from all elements after finite element analysis subjected to various load conditions, and DLNN for bolts and bearing were trained with Tensorflow. The DLNN-based joint models were implemented in the ABAQUS user subroutines where stresses from the next increment are updated and the algorithmic tangent stiffness matrix is calculated. Generalization of the trained DLNN in the FE model was verified by subjecting it to a new loading condition. Finally, the DLNN-based FEA for the front axle of the tractor was conducted and the feasibility was verified by comparing with results of a static structural experiment of the actual tractor.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.212-217
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• 2022

Large thermal stress due to the difference between silicon carbide and graphite's coefficients of thermal expansion could be formed during crystal growing process of silicon carbide (SiC) at high temperature. The large thermal stress could separate the SiC seed crystals from graphite components, which bring about the drop of the seed crystal during crystal growth. However, the bonding properties of SiC seed crystal module has hardly reported so far. In this study, SiC and graphite were bonded using 3 types of bonding agents and a three-point bending tests using a mixed-mode flexure test were conducted for the bonded samples to evaluate the bonding characteristics between SiC and graphite. Raman spectroscopy, X-ray Photoelectron Spectroscopy, and X-ray Computed Tomography were used to analyze the bonding characteristics and the microstructures of the SiC-graphite interfaces bonded with the bonding agents. As results, an excellent bonding agent was chosen to fabricate SiC seed crystal module with 50 mm in diameter. An SiC single crystal with 50 mm in diameter was successfully grown without falling out during top seeded solution growth of SiC at high temperature.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.52-59
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• 2023

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m² for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m² after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.4
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• pp.277-282
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• 2014

Recently, much attention has been paid to nonlinear ultrasonic technology as a potential tool to assess hidden damages that cannot be detected by conventional ultrasonic testing. One nonlinear ultrasonic technique is measurement of the resonance frequency shift, which is based on the hysteresis of the material elasticity. Sophisticated measurement of resonance frequency is required, because the change in resonance frequency is usually quite small. In this investigation, the nonlinear electromagnetic acoustic resonance (NEMAR) method was employed. The NEMAR method uses noncontact electromagnetic acoustic transducers (EMATs) in order to minimize the effect of the transducer on the frequency response of the object. Aluminum plate specimens that underwent three point bending fatigue were tested with a shear wave EMAT. The hysteretic nonlinear parameter ${\alpha}$, a key indicator of damage, was calculated from the resonance frequency shift at several levels of input voltage. The hysteretic nonlinear parameter of a damaged sample was compared to that of an intact one, showing a difference in the values.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1093-1100
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• 2014

The purpose of this paper is to suggest a weight-reduction design method for the hybrid carbody of a high-speed maglev train that uses aluminum extrusion profiles and sandwich composites. A sandwich composite was used on the roof as a secondary member to minimize the weight. In order to assemble the sandwich composite roof and aluminum extrusion side frame of the carbody using welding, a guide aluminum frame located at the four sides of the sandwich composite roof was introduced in this study. The clamping force of this guide aluminum frame was verified by three-point bending test. The structural integrity and crashworthiness of the hybrid carbody of a high-speed maglev train were evaluated and verified according to the Korean Railway Safety Law using a commercial finite element analysis program. The results showed that the hybrid carbody composed of aluminum extrusion frames and a sandwich composite roof was lighter in weight than a carbody made only of aluminum extrusion profiles and had better structural performance.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.479-486
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• 2007

Four point bending is used to study the dependences of bond strength of benzocyclobutene(BCB) bonded wafers and BCB thickness, the use of an adhesion promoter, and the materials being bonded. The bond strength depends linearly on BCB thickness, due to the thickness-dependent contribution of the plastic dissipation energy of the BCB and thickness independence of BCB yield strength. The bond strength increases by about a factor of two with an adhesion promoter for both $2.6{\mu}m$ and $0.4{\mu}m$ thick BCB, because of the formation of covalent bonds between adhesion promoter and the surface of the bonded materials. The bond strength at the interface between a silicon wafer with deposited oxide and BCB is about a factor of three higher than that at the interface between a glass wafer and BCB. This difference in bond strength is attributed to the difference in Si-O bond density at the interfaces. At the interfaces between plasma enhanced chemical vapor deposited (PECVD) oxide coated silicon wafers and BCB, and between thermally grown oxide on silicon wafers and BCB, 12~13 and $15{\sim}16bonds/nm^2$ need to be broken. This corresponds to the observed bond energies, $G_0s$, of 18 and $22J/m^2$, respectively. Maximum 7~8 Si-O $bonds/nm^2$ are needed to explain the $5J/m^2$ at the interfaces between glass wafers and BCB.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• The Journal of Korean Academy of Prosthodontics
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• v.47 no.2
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• pp.191-198
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• 2009

Statement of problem: Ceramics have been important materials for the restoration of teeth. The demands of patients for tooth-colored restorations and the availability of various dental ceramics has driven the increased use of new types of dental ceramic materials. Improved physical properties of theses materials have expanded its use even in posterior crowns and fixed partial dentures. However, ceramic still has limitation such as low loading capability. This is critical for long-span bridge, because bridge is more subject to tensile force. Purpose: The wire reinforced ceramic was designed to increase the fracture resistance of ceramic restoration. The purpose of this study was to evaluate the fracture resistance of wire reinforced ceramic. Material and methods: Heat pressed ceramic(ingot No.200 : IPS Empress 2, Ivoclar Vivadent, Liechtenstein) and Ni-Cr wire(Alfa Aesar, Johnson Matthey Company, USA) of 0.41 mm diameter were used in this study. Five groups of twelve uniform sized ceramic specimens(width 4 mm, thickness 2 mm, length 15 mm) were fabricated. Each group had different wire arrangement. Wireless ceramic was used as control group. The experimental groups were divided according to wire number and position. One, two and three strands of wires were positioned on the longitudinal axis of specimen. In another experimental group, three strands of wires positioned on the longitudinal axis and five strands of wires positioned on the transverse axis. Three-point bending test was done with universal testing machine(Z020, Zwick, Germany) to compare the flexural modulus, flexural strength, strain at fracture and fracture toughness of each group. Fractured ceramic specimens were cross-sectioned with caborundum disc and grinded with sandpaper to observe interface between ceramic and Ni-Cr wire. The interface between ceramic and Ni-Cr wire was analyzed with scanning electron microscope(JSM-6360, JEOL, Japan) under platinum coating. Results: The results obtained were as follows: 1. The average and standard deviation in flexural modulus, flexural strength and fracture toughness showed no statistical differences between control and experimental groups. However, strain was significantly increased in wire inserted ceramics(P<.001). 2. Control group showed wedge fracture aspects across specimen, while experimental groups showed cracks across specimen. 3. Scanning electron microscopic image of cross-sectioned and longitudinally-sectioned specimens showed no gap at the interface between ceramic and Ni-Cr wire. Conclusion: The results of this study showed that wire inserted ceramics have a high strain characteristic. However, wire inserted ceramics was not enough to use at posterior area of mouth in relation to flexural modulus and flexural strength. Therefore, we need further studies.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.466-472
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• 2007

A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.