• Proceedings of the Computational Structural Engineering Institute Conference
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• 2008.04a
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• pp.104-107
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• 2008

A case study is conducted by between using 3D integrated automatic design software(ABeamDeck, AAbutPier) and using autocad without program to validate the method. As a result, there are many profits introducing the 3D design in the construction, especially, to make up for defect of existing design method. 3D design will enhance the efficiency of construction tasks by supporting a system of sharing and exchanging information throughout all the stages of construction, from design, production and installation to maintenance.

• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• v.3B no.1
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• pp.23-31
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• 2003

A novel 3D shape optimization algorithm is presented for electromagnetic devices carry-ing eddy current. The algorithm integrates the 3D finite element performance analysis and the steepest descent method with design sensitivity and mesh relocation method. For the design sensitivity formula, the adjoint variable vector is defined in complex form based on the 3D finite element method for eddy current problems. A new 3D mesh relocation method is also proposed using the deformation theory of the elastic body under stress to renew the mesh as the shape changes. The design sensitivity f3r the sur-face nodal points is also systematically converted into that for the design variables for the parameterized optimization application. The proposed algorithm is applied to the optimum design of the tank shield model of the transformer and the effectiveness is proved.

• Journal of KIISE:Computing Practices and Letters
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• v.13 no.4
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• pp.231-239
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• 2007

This paper presents the trade-off relationship between area and performance in the hardware design space exploration for the Korean national standard 128-bit block cipher algorithm SEED. In this paper, we compare the following four hardware design types of SEED algorithm : (1) Design 1 that is 16 round fully pipelining approach, (2) Design 2 that is a one round looping approach, (3) Design 3 that is a G function sharing and looping approach, and (4) Design 4 that is one round with internal 3 stage pipelining approach. The Design 1, Design 2, and Design 3 are the existing design approaches while the Design 4 is the newly proposed design in this paper. Our new design employs the pipeline between three G-functions and adders consisting of a F function, which results in the less area requirement than Design 2 and achieves the higher performance than Design 2 and Design 3 due to pipelining and module sharing techniques. We design and implement all the comparing four approaches with real hardware targeting FPGA for the purpose of exact performance and area analysis. The experimental results show that Design 4 has the highest performance except Design 1 which pursues very aggressive parallelism at the expanse of area. Our proposed design (Design 4) shows the best throughput/area ratio among all the alternatives by 2.8 times. Therefore, our new design for SEED is the most efficient design comparing with the existing designs.

• Fashion & Textile Research Journal
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• v.25 no.2
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• pp.139-152
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• 2023

Despite efforts to apply 3D print (3DP) technology in the field of fashion and endless discussions about the possibility of future development, in reality, it is difficult to utilize 3DP technology in fashion for reasons related to material, technology, and cost constraints. The purpose of this study was to supplement the limitations of 3DP technology in order to promote its utilization in fashion and simultaneously find a solution to achieve aesthetic satisfaction in the design method. Specifically, through the development of fashion products with a 3DP polymer-fabric structure to which the parametric design methodology has been applied, this study explored the possibility of practical application and proposes a new 3DP fashion design method. The 3DP polymer-fabric developed as a result of the research was stably adhered to the fabric. Additionally, the study confirmed the possibility of making 3DP clothes that are amenable to the wearer's activities, as it was verified that cutting and sewing tailored to the human body's curvature and structure can be performed. The design process using the 3DP polymer-fabric presented in this study is meaningful in that it suggests a solution to complement the limitations of modern technology in connection with designers' creativity. Moreover, the design process presented in this study is expected to contribute to the commercialization and generalization of 3DP by providing practical help to allow fashion experts to utilize 3DP technology.

• Journal of information and communication convergence engineering
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• v.12 no.3
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• pp.186-192
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• 2014

Monolithic three-dimensional integrated chips (3D ICs) are an emerging technology that offers an integration density that is some orders of magnitude higher than the conventional through-silicon-via (TSV)-based 3D ICs. This is due to a sequential integration process that enables extremely small monolithic inter-tier vias (MIVs). For a monolithic 3D memory, we first explore the static random-access memory (SRAM) design. Next, for digital logic, we explore several design styles. The first is transistor-level, which is a design style unique to monolithic 3D ICs that are enabled by the ultra-high-density of MIVs. We also explore gate-level and block-level design styles, which are available for TSV-based 3D ICs. For each of these design styles, we present techniques to obtain the graphic database system (GDS) layouts, and perform a signoff-quality performance and power analysis. We also discuss various challenges facing monolithic 3D ICs, such as achieving 50% footprint reduction over two-dimensional (2D) ICs, routing congestion, power delivery network design, and thermal issues. Finally, we present design techniques to overcome these challenges.

• Journal of Ship and Ocean Technology
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• v.12 no.3
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• pp.1-13
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• 2008

In shipbuilding, diverse manufacturing techniques for automation have been developed and used in practice. Among them, however, the hull forming automation is the one that has not been of major concern compared with others such as welding and cutting. The basis of the development of this process is to find out how to extract thermal forming information. There exist various methods to obtain such information and the 3D design shape that needs to be formed should be extracted first for getting the necessary thermal forming information. Except well-established shipyards which operate 3D design systems, most of the shipyards only rely on 2.5D design systems and do not have an easy way to obtain 3D surface design data. So in this study, various shipbuilding design systems used by shipyards are investigated and a 3D design surface data extraction method is proposed from those design systems. Then an example is presented to show the extraction of real 3D surface data using the proposed method and computation of thermal forming information using the data.

• Science of Emotion and Sensibility
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• v.20 no.2
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• pp.87-102
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• 2017

With increasing interest in 3D printing, the interest in the 3D modelling training that should precede the 3D printing is increasing. However, the existing 3D modelling software is developed mostly by foreign brands. Thus, the interfaces are all in English. 3D modelling software training for Korean novices who are not familiar with these terms has constraints. This study aims to explore what to consider when developing a Korean model for 3D modelling educational software for 3D printing in the face of such reality. For this goal, after having novices with no experience in 3D modeling to perform a house building task using either 12D Design or Tinker CAD, we conducted a survey. It was found in the result that more users favored Tinker CAD over 123D Design, and the errors involved while working with the Tinker CAD were less than those with the 123D Design, and the ratio of people who completed the task with the Tinker CAD was higher than that with the 123D Design. In general discussion, an introductory level educational 3D modeling software development is proposed which utilize characteristics of Tinker CAD (easy modelling is possible by three-dimensional figures) and web-based method. Also, a beginner/intermediate level educational 3D modeling software development is proposed which utilize characteristics of 123D Design (with finer measurement manipulations and figure alignment) and Windows-based method.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.357-360
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• 2001

Design Engineering Group, LG Production engineering Research Center has been developing The Integrated Design Environment enabling engineering design task with ease, speedy and accurate for several years targeting the design departments in LG Electronics. $ezDesign^{(R)}$ System is consisted by Engineering Database Management, Engineering Knowledge Management, 3D Design Application, Design Evaluation Method and Project Management. Engineering Database Management manage the design information effectively. Engineering Knowledge Management takes control of design knowledge from design engineering activity systematically. It is possible for the engineering designer to utilized 3D CAD easily by 3D Design Application. Design Evaluation Method can evaluate several design alternatives synthetically. In Project management System, Designer can simulate the project schedule and cost. In this report, We will introduce how design process can be innovated by way of $ezDesign^{(R)}$ System.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.11
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• pp.1505-1510
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• 2018

Product modeling technology for graphics is rapidly developing. And 3D data application and usability are increasing.modeling of product design is a very important factor in constructing. 3D modeling in product design takes a lot of production time. Recently, the reverse design method is very useful because of application of 3D data and shortening of production time. In this study, first, 3D point cloud and mesh data are generated using photographs based on image data. The second is to modify the design and the third is to make the prototype with the 3D printer. This product design and production process suggests the utilization and possibility of image data, the shortening of 3D modeling production time and efficient processes. Also, the product design process proposes a model of a new product development system to adapt to the production environment.

• Journal of Fashion Business
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• v.28 no.3
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• pp.122-139
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• 2024

Image-generated AI is rapidly emerging as a powerful tool to augment human creativity and transform the art and design process through deep learning capabilities. The purpose of this study was to propose and demonstrate the feasibility of a new design development method that combined traditional design methods and technology by constructing image-generated AI prompts based on artists' formative elements. The study methodology consisted of analyzing Kazmir Malevich's theoretical considerations and applying them to AI prompts for design, print pattern development, and 3D digital design. This study found that the suprematist works of Kazmir Malevich were suitable as design and print pattern prompts due to their clear geometric shapes, colors, and spatial arrangement. The AI-prompted designs and print patterns produced diverse results quickly and enabled an efficient design process compared to traditional methods, although additional refinement was required to perfect the details. The AI-generated designs were successfully produced as 3D garments, thereby demonstrating that AI technology could significantly contribute to fashion design through its integration with artistic principles. This study has academic significance in that it proposes a prompt composition method applicable to fashion design by combining AI and artistic elements. It also has industrial significance in that it contributes to design innovation and the implementation of creative ideas by presenting an AI-based design process that can be practically applied.