• 한국전자파학회지:전자파기술
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• 제5권2호
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• pp.46-54
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• 1994

본 논문에서는 원통변에 표면-정합된 마이크로스트럽 배열 안태나의 지향특성을 개선하기 위한 방볍을 제 시한다. 장방형 마이크로스트립 패치를 원통변에 횡방향으로 호(arc) 모양 배열하는 경우, 원통면윤 다각형의 각주로 끈사하고, 각각의 각주 평변에 임의 방향으로 주빔의 sqwnt를 가지는 Dolph - Tschebyscheff 배열, u uniform 배열 등의 부배열(sub-array)을 배치하므로써 전체 원통면 배열 안테나에 원하는 지향특성을 가지도 록 할 수 있음을 보이고, 원통면-공진기 모텔을 이용하여 복사패턴을 해석한다. 부배열의 종류에 따른 전체 배 열 얀테나의 복사패턴을 비교하고, 배열간격이 $\lambda_0$/2인 uniform 배열을 이용한 요소수 12인 원통면 배열 안테 나를 제작하여 반경이 6인 원통변에 정합시켰을 때 부엽 level -l3dB, 반전력범폭 $9^{\circ}$, 제일 null 사이각 $15^{\circ}$인 양호한 특성을 얻어 선형배열을 이용하는 경우보다 지향특성을 현저하게 개선시켰다

• Advances in aircraft and spacecraft science
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• 제4권3호
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• pp.219-235
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• 2017

The large container ships and fast patrol boats are complex marine structures. Therefore, their global mechanical behaviour has long been modeled mostly by refined beam theories. Important issues of cross section warping and bending-torsion coupling have been addressed by introducing special functions in these theories with inherent assumptions and thus compromising their robustness. The 3D solid Finite Element (FE) models, on the other hand, are accurate enough but pose high computational cost. In this work, different marine vessel structures have been analysed using the well-known Carrera Unified Formulation (CUF). According to CUF, the governing equations (and consequently the finite element arrays) are written in terms of fundamental nuclei that do not depend on the problem characteristics and the approximation order. Thus, refined models can be developed in an automatic manner. In the present work, a particular class of 1D CUF models that was initially devised for the analysis of aircraft structures has been employed for the analysis of marine structures. This class, which was called Component-Wise (CW), allows one to model complex 3D features, such as inclined hull walls, floors and girders in the form of components. Realistic ship geometries were used to demonstrate the efficacy of the CUF approach. With the same level of accuracy achieved, 1D CUF beam elements require far less number of Degrees of Freedom (DoFs) compared to a 3D solid FE solution.

• 전자공학회논문지
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• 제51권9호
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• pp.82-90
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• 2014

본 논문에서는 선형성을 가진 파노라믹 스캔 라이다(PSL) 시스템용의 4-채널 차동 트랜스임피던스 증폭기 어레이를 0.18-um CMOS 공정을 이용하여 구현하였다. PSL시스템을 위한 성능의 비교분석을 위하여 전류모드 및 전압모드의 두 종류 트랜스임피던스 어레이 칩을 각각 구현하였으며, 채널당 1.25-Gb/s 동작속도를 갖도록 설계하였다. 먼저 전류모드 칩의 경우, 각 채널 광 수신입력단은 전류미러 구조로 구현하였으며, 특히 로컬 피드백 입력구조로 개선하여 낮은 입력저항과 낮은 잡음지수를 가질 수 있도록 설계하였다. 칩 측정 결과, 채널 당 $69-dB{\Omega}$ 트랜스임피던스 이득, 2.2-GHz 대역폭, 21.5-pA/sqrt(Hz) 평균 잡음 전류 스펙트럼 밀도, -20.5-dBm 수신감도, 및 1.8-V 전원전압에서 4채널 총 147.6-mW 소모전력을 보이며, 1.25-Gb/s 동작속도에서 크고 깨끗한 eye-diagram을 보인다. 한편, 전압모드 칩의 경우, 각 채널 광 수신입력단은 인버터 입력구조로 구현하여 낮은 잡음지수를 갖도록 설계하였다. 칩 측정 결과, 채널 당 $73-dB{\Omega}$ 트랜스임피던스 이득, 1.1-GHz 대역폭, 13.2-pA/sqrt(Hz) 평균 잡음 전류 스펙트럼 밀도, -22.8-dBm수신감도, 및 4채널 총 138.4-mW 소모전력을 보이며, 1.25-Gb/s 동작속도에서 크고 깨끗한 eye-diagra을 보인다.

• Journal of Information Display
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• 제13권2호
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• pp.83-89
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• 2012

The crosstalk evaluation of multiview autostereoscopic three-dimensional (3D) displays is discussed, with both the human and technical factors investigated via image quality assessment. In the imaging performance measurements and analysis for a multiview autostereoscopic display prototype equipment, it was inferred that crosstalk would have both a positive and a negative effect on the imaging performance of the equipment. The importance of the attached diaphragm in the crosstalk evaluation was proposed and then experimentally verified, using the developed prototype equipment. The luminance distribution and crosstalk situation were given, with two different diaphragm arrays applied. The analysis results showed that the imaging performance of this 3D display system can be improved with minimum changes to the system structure.

• 대한기계학회논문집
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• 제10권1호
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• pp.1-6
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• 1986

본 논문에서는 제트유동에 놓인 튜우브 집합체의 진동 발생구조를 깊이 파악하고 일반성 있게 사용할 수 있는 설계 지침을 마련하기 위하여 보다 광법위 하게 수행된 파라미터 연구 내용을 다루었다

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권2호
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• pp.212-226
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• 2014

This paper presents the design and implementation of a pipelined architecture and a method for real-time human detection using depth image from a Time-of-Flight (ToF) camera. In the proposed method, we use Euclidean Distance Transform (EDT) in order to extract human body location, and we then use the 1D, 2D scanning window in order to extract human joint location. The EDT-based human extraction method is robust against noise. In addition, the 1D, 2D scanning window helps extracting human joint locations easily from a distance image. The proposed method is designed using Verilog HDL (Hardware Description Language) as the dedicated hardware architecture based on pipeline architecture. We implement the dedicated hardware architecture on a Xilinx Virtex6 LX750 Field Programmable Gate Arrays (FPGA). The FPGA implementation can run 80 MHz of maximum operating frequency and show over 60fps of processing performance in the QVGA ($320{\times}240$) resolution depth image.

• 센서학회지
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• 제31권4호
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• pp.228-237
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• 2022

Two-dimensional (2D) nanomaterials have demonstrated the potential to replace silicon and compound semiconductors that are conventionally used in photodetectors. These materials are ultrathin and have superior electrical and optoelectronic properties as well as mechanical flexibility. Consequently, they are particularly advantageous for fabricating high-performance photodetectors that can be used for wearable device applications and Internet of Things technology. Although prototype photodetectors based on single microflakes of 2D materials have demonstrated excellent photoresponsivity across the entire optical spectrum, their practical applications are limited due to the difficulties in scaling up the synthesis process while maintaining the optoelectronic performance. In this review, we discuss facile methods to mass-produce 2D material-based photodetectors based on the exfoliation of van der Waals crystals into nanosheet dispersions. We first introduce the liquid-phase exfoliation process, which has been widely investigated for the scalable fabrication of photodetectors. Solution processing techniques to assemble 2D nanosheets into thin films and the optoelectronic performance of the fabricated devices are also presented. We conclude by discussing the limitations associated with liquid-phase exfoliation and the recent advances made due to the development of the electrochemical exfoliation process with molecular intercalants.

• 소성∙가공
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• 제15권1호
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• 한국산업융합학회 논문집
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• 제26권4_1호
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• pp.517-527
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• 2023

Many techniques have been proposed and investigated for microlens array manufacturing in three-dimensional (3D) structures. We present fabricating a microlens array using selective laser etching and a CO₂ laser. The femtosecond laser was employed to produce multiple micro-cracks that comprise the predesigned 3D structure. Subsequently, the wet etching process with a KOH solution was used to produce the primary microlens array structures. To polish the nonoptical surface to the optical surface, we performed reflow postprocessing using a CO₂ laser. We confirmed that the micro lens array can be manufactured in three primary shapes (cone, pyramid and hemisphere). Compared to our previous study, the processing time required for laser processing was reduced from approximately 1 hour to less than 30 seconds using the proposed processing method. Therefore, micro lens arrays can be manufactured using our processing method and can be applied to mass productionon large surface areas.