• 제목/요약/키워드: 1D-CSP

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새로운 형태의 CSP를 이용한 완전 집적화 Ku/K밴드 광대역 증폭기 MMIC (A Fully-integrated Ku/K Broadband Amplifier MMIC Employing a Novel Chip Size Package)

  • 윤영
    • 한국항해항만학회지
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    • 제27권2호
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    • pp.217-221
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    • 2003
  • 본 논문에서는 새로운 형태의 CSP (chip site package)를 이용하여 정합소자 린 바이어스소자를 MMIC상에 완전집적한 Ku/K밴드 광대역 증폭기 MMIC에 관하여 보고한다. 새로운 형태의 CSP에 대해서는 이방성 도전필름인 ACF (anisotropic conductive film)을 이용하였으며, 그 결과 MMIC 패키지 프로세스가 간략화 되었고, CSP MMIC의 저 가격화가 실현되었다. MMIC상에 집적하기 위한 DC 바이어스 용량소자로서는 고유전율의 STO (SrTiO3) 필름 커패시터가 이용되었다. 제작된 CSP MMIC는 광대역 RF동작특성 (12-24 GHz에서 12.5$\pm$1.5 dB의 이득치, -6 dB이하의 반사계수, 18.5$\pm$1.5 dBm의 PldB) 을 보였다. 본 논문은 K 또는 Ku 밴드의 주파수대역에 있어서의 완전집적화 CSP MMIC에 관한 최초의 보고이다.

고출력 CSP-LOC 레이저 다이오드의 모우드 특성에 관한 연구 (A Study on the Mode Characteristics of CSP-LOC Laser Diode for High Power)

  • 윤석범;오환술
    • 대한전자공학회논문지
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    • 제25권11호
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    • pp.1367-1372
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    • 1988
  • 본 논문은 최적의 고출력용 (GaAl) As/GaAs CSP-LOC 레이저 다이오드 구조를 설계하기 위하여 컴퓨터 시뮬레이션 하였다. 실험 데이터를 근거로한 레이저다이오드의 설계변수로 각 층의 두께, 흡수계수, 스트라이프 폭등이 사용되었고 활성층(d2)와 광 도파로층(d3)의 두께가 각각 0.08um, 0.5um일때와 0.1um, 0.4um일때 최적의 안정된 고출력용 CSP-LOC 구조를 얻었다. 따라서 본 노문에서는 실용적인 반도체레이저의 컴퓨터 시뮬레이션 프로그램을 개발하였고 임의의 재료를 갖는 CSP-LOC 구조에 이 프로그램의 적용이 가능하다.

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Purification and Structural Characterization of Cold Shock Protein from Listeria monocytogenes

  • Lee, Ju-Ho;Jeong, Ki-Woong;Kim, Yang-Mee
    • Bulletin of the Korean Chemical Society
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    • 제33권8호
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    • pp.2508-2512
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    • 2012
  • Cold shock proteins (CSPs) are a family of proteins induced at low temperatures. CSPs bind to single-stranded nucleic acids through the ribonucleoprotein 1 and 2 (RNP 1 and 2) binding motifs. CSPs play an essential role in cold adaptation by regulating transcription and translation via molecular chaperones. The solution nuclear magnetic resonance (NMR) or X-ray crystal structures of several CSPs from various microorganisms have been determined, but structural characteristics of psychrophilic CSPs have not been studied. Therefore, we optimized the purification process to obtain highly pure Lm-Csp and determined the three-dimensional structure model of Lm-Csp by comparative homology modeling using MODELLER on the basis of the solution NMR structure of Bs-CspB. Lm-Csp consists of a ${\beta}$-barrel structure, which includes antiparallel ${\beta}$ strands (G4-N10, F15-I18, V26-H29, A46-D50, and P58-Q64). The template protein, Bs-CspB, shares a similar ${\beta}$ sheet structure and an identical chain fold to Lm-Csp. However, the sheets in Lm-Csp were much shorter than those of Bs-CspB. The Lm-Csp side chains, E2 and R20 form a salt bridge, thus, stabilizing the Lm-Csp structure. To evaluate the contribution of this ionic interaction as well as that of the hydrophobic patch on protein stability, we investigated the secondary structures of wild type and mutant protein (W8, F15, and R20) of Lm-Csp using circular dichroism (CD) spectroscopy. The results showed that solvent-exposed aromatic side chains as well as residues participating in ionic interactions are very important for structural stability. Further studies on the three-dimensional structure and dynamics of Lm-Csp using NMR spectroscopy are required.

A Wafer Level Packaged Limiting Amplifier for 10Gbps Optical Transmission System

  • Ju, Chul-Won;Min, Byoung-Gue;Kim, Seong-Il;Lee, Kyung-Ho;Lee, Jong-Min;Kang, Young-Il
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제4권3호
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    • pp.189-195
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    • 2004
  • A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

고장-기능 간 관계도를 이용한 다 기능 무기체계의 동시조달수리부속 최적화 연구 (Study to Optimize the Concurrent Spare Parts of Multiple Function Weapon System using Failure-Function Matrix)

  • 김경록;최효준
    • 한국산학기술학회논문지
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    • 제16권8호
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    • pp.5260-5266
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    • 2015
  • 무기체계 개발 시 종합군수지원 측면에서 중요한 것 중 하나가 동시조달수리부속 산출이다. 동시조달수리부속은 무기체계 가용도 향상 측면에서 매우 중요한 것으로, 이에 대한 다양한 연구가 이루어지고 있다. 그러나 대부분의 연구는 하부 구성품의 고장이 무기체계의 다양한 기능에 미치는 세부 영향들을 고려하지 못하고 있다. 즉 하부 구성품의 고장이 무기체계의 특정 기능에 미치는 영향이 미비하면, 구성품 교환과 같은 정비가 필요 없다는 점을 고려하지 못한다. 그래서 본 연구에서는 고장-기능 간 관계도를 이용하여, 하부 구성품의 고장이 무기체계의 다양한 기능에 미치는 세부 영향을 고려한 동시조달수리부속 산출 방법을 기술하였다. 본 연구 절차는 다음과 같다. 첫째, 무기체계의 운용 및 정비 시스템을 분석한다. 둘째, 고장-기능 간 관계도를 개발한다. 셋째, 수집된 자료를 바탕으로 시뮬레이션 모델을 설계 한다. 마지막으로, 시뮬레이션과 메타 휴리스틱 모형인 진화 전략을 통해 동시조달수리부속 최적 수량을 선정한다. 해당 연구는 동시조달수리부속 산출 연구에 새로운 방향을 제시하였다.

Application of the New Panel Structure for High Luminous Efficiency in AC-PDPs

  • Kim, Jae-Sung;Jeon, Chung-Huan;Lee, Eun-Cheol;Ahn, Young-Joon;Kang, Seok-Dong;Ahn, Sung-Yong;Shin, Young-Kyo;Ryu, Jae-Hwa;Schemerhorn, Jerry D.
    • Journal of Information Display
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    • 제1권1호
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    • pp.32-34
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    • 2000
  • A new PDP cell structure called CSP(Charge Storage Pad) improves the luminous efficiency by 1.6 times and prevents cross talk between adjacent cells. The CSP, which is a conducting material, is inserted between the dielectric layer and the MgO film in the front plate. This CSP produces a longer time-averaged discharge path to get a high luminous efficiency and confines the discharge to prevent cross talk.

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고출력 연속파형 Nd:YAG 레이저를 이용한 CSP 1N 박판재 절단시 공정변수가 절단폭 및 절단표면특성에 미치는 영향 (Effects of process parameters on kerfwidth and characteristics of the cut surface for the case of cutting of CSP 1N sheet using high power continuous wave Nd:YAG laser)

  • 안동규;김민수;이상훈;유영태;박형준
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.418-421
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    • 2005
  • The objective of this research work is to investigate the effects of process parameters, such as power of laser, travel speed of laser and material thickness, on kerfwidth and characteristics of the cut surface for the case of cutting of CSP 1N sheet using high power continuous wave Nd:YAG laser. In order to find relationship between the process parameters on the quality of the cut section, such as kerfwidth, surface roughness and the striation formation, several laser cutting experiments are carried out. From the results of experiments, an optimal cutting speed for each cutting condition has been obtained to improve the quality of the cut surface.

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고출력 CW Nd:YAG 레이저를 이용한 CSP 1N 냉연강판 절단 공정의 3 차원 열전달 해석 (Three-dimensional heat transfer analysis of laser cutting process for CSP 1N sheet using high power CW Nd:YAG laser)

  • 김민수;안동규;이상훈;유영태;박형준;신호준
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.162-165
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    • 2005
  • The objective of this research work is to investigate into the three-dimensional temperature distribution using quasi steady-state heat transfer analysis fur the case of the laser cutting of CSP 1N sheet using high power CW Nd:YAG laser. The laser heat source is assumed as a volumetric heat source with a gaussian heat distribution in a plane. Through the comparison of the results of analyses with those of the experiments, the optimal finite element model is obtained. Finally, characteristics of the three-dimensional heat transfer and temperature distribution have been estimated by the optimal finite element model.

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Enantioseparation by Sonochromatography

  • Ryoo, Jae-Jeong;Song, Young-Ae;Jeong, Young Han;Hyun, Myung-Ho;Park, Jung-Hag;Lee, Won-jae
    • Bulletin of the Korean Chemical Society
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    • 제27권5호
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    • pp.637-641
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    • 2006
  • Although chiral separation has been one of the main topics of chromatographic practice for over twenty-five years, it still presents many difficulties. In this work, the ultrasonic dependence of chiral resolution was investigated at various temperatures to improve resolution and reduce analysis time. The chiral resolution was performed on recently commercialized two HPLC chiral stationary phases (CSP 1 and CSP 2) with the analogues of racemic N-acylnaphthylethylamines (1a-d) and racemic amino acid derivatives (2a-c, 3a-c) as analytes. The CSP 1 was prepared from a (R)-N-(3,5-dinitrobenzoyl)phenylglycinol and the CSP 2 was prepared from a (S)-N-3,5-(dinitrobenzoyl) leucine. From the comparison of the chromatographic results under sonic condition with those under non-sonic condition, we found that the ultrasound decreased the elution time in chiral chromatography at all temperatures and improved the enantioselectivity at high temperature (45, 50, 60 ${^{\circ}C}$).