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http://dx.doi.org/10.5394/KINPR.2003.27.2.217

A Fully-integrated Ku/K Broadband Amplifier MMIC Employing a Novel Chip Size Package  

Yun, Young (Semiconductor Device Research Center, Matsushita Electric Industrial CO., Ltd.)
Publication Information
Journal of Navigation and Port Research / v.27, no.2, 2003 , pp. 217-221 More about this Journal
Abstract
In this work, we used a novel RF-CSP to develop a broadband amplifier MMIC, including all the matching and biasing components, for Ku and K band applications. By utilizing an ACF for the RF-CSP, the fabrication process for the packaged amplifier MMIC could be simplified and made cost effective. STO (SrTiO$_3$) capacitors were employed to integrate the DC biasing components on the MMIC. A pre-matching technique was used for the gate input and drain output of the FETs to achieve a broadband design for the amplifier MMIC. The amplifier CSP MMIC exhibited good RF performance (Gain of 12.5$\pm$1.5 dB, return loss less than -6 dB, PldB of 18.5$\pm$1.5 dBm) over a wide frequency range. This work is the first report of a fully integrated CSP amplifier MMIC successfully operating in the Ku/K band.
Keywords
CSP (chip size package); MMIC; ACF; STO; broadband amplifier; MMIC; chip size package; ACF; STO;
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1 H. Okazaki, T. Nakagawa, and K. Araki.(1999), A low-power Ku-band GaAs monolithic frequency quadnpler, European Microwave Conf, Vol. 1, pp. 353-356
2 H. Sakai, T. Yoshida, and M. Sagawa(1998), High frequency flip-chip bonding technologies and their application to microwave/millimeter-wave ICs, IEICE Trans. Electron , Vol. E81-C, No. 6, pp. 810-818
3 S. Chaki, T. Hisaka, T. Hirai, Y. Sasaki, S. Sakamoto, and Y. Mitsui(2001), A Ka-band compact 1 Watt power amplifier using a platy-trl matching method, Asian-Pacific Microwave Conf., pp. 284-287
4 S. F. Wei, I. H. Lin, and H. Wang(2001), A monolithic K-band MMIC receiver, Asian-Pacific Microwave Conf., pp. 299-302
5 S. Koriyama, K. Kitazawa, N. Shino, and H. Minamiue (2000), Millimeter-Wave Ceramic Package for a Surface Mount, IEEE MIT-S Int. Microwave Symp. Dig., pp. 61-64
6 T. Satoh, T. Shimura, S. Ichikawa, A. B. Berutto, C. Poledrelli, Y. Furukawa, Y. Hasegawa, S. Kuroda, and J. Fukaya(2000), A Compact PA MMIC Module for K-Band High-Speed Wireless Systems, IEEE MTT-S Int. Microwave Symp. Dig., pp. 1333-1336
7 T. Takgi, K. Yamauchi, Y. Itoh, S. Urasaki, M. Komaru, Y. Mitsui H. Nakaguro, and Y. Kazekami(2001), MMIC development for millimeter-wave space applications, IEEE Trans. Microwave Theory & Tech, vol. MTT-49, pp. 2073-2079
8 J. Udomoto, T. Ishida, A. Akaishi, T. Araki, N. Kadowaki, M. Komaru, and Y. Mitsui(1999), A 50% PAE K-band power MMIC amplifier European Microwave Conf, Vol. 1, pp. 263-266
9 A. Ishimaru, M. Maeda, T. Yoshida, J. Ozaki, and S. Kamihashi(1999), 35% PAE 6W Ku-Band Power Amplifier Module, IEEE MIT-S Int. Microwave Symp. Dig., pp. 955-958
10 J. M. Schellenberg(2002), 1 and 2 Watt MMIC power amplifiers for commercial K/Ka-band applications, IEEE MIT-S Int. Microwave Symp. Dig., pp. 445-448
11 J Williams, and S. Peak(2002), Ku-band MMIC's in low-cost SMT compatible packages, IEEE MIT-S Int Microwave Symp. Dig., pp. 27-30