• Journal of Navigation and Port Research
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• v.27 no.2
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• pp.217-221
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• 2003

In this work, we used a novel RF-CSP to develop a broadband amplifier MMIC, including all the matching and biasing components, for Ku and K band applications. By utilizing an ACF for the RF-CSP, the fabrication process for the packaged amplifier MMIC could be simplified and made cost effective. STO (SrTiO$_3$) capacitors were employed to integrate the DC biasing components on the MMIC. A pre-matching technique was used for the gate input and drain output of the FETs to achieve a broadband design for the amplifier MMIC. The amplifier CSP MMIC exhibited good RF performance (Gain of 12.5$\pm$1.5 dB, return loss less than -6 dB, PldB of 18.5$\pm$1.5 dBm) over a wide frequency range. This work is the first report of a fully integrated CSP amplifier MMIC successfully operating in the Ku/K band.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.11
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• pp.1367-1372
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• 1988

In this paper, we have optimized the computation of the CSP - LOC (Channel Substrate Planar-Large Optical Cavity) structure to design the gith power (Ga, Al) As/GaAs CSP-LOC laser diode. The parameters of the device on the bases of experimental datas include the effects of the various layer thickness, material absorption coefficients, stripe width and so forth. At active layer ($d_2$)=0.08 um with optical layer ($d_3$)=0.5 um and $d_2$ = 0.1 um with $d_3$ = 0.4 um, we find the narrower beam divergence and stable high power in the lowest-order mode without the phenomenon of spatial hole burning. The results of theoretical computation show good agreement with experimental measurements made on LPE grown CSP-LOC. Finally, we developed an practical program and the program is applicable to the CSP-LOC lasers with any materials.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2508-2512
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• 2012

Cold shock proteins (CSPs) are a family of proteins induced at low temperatures. CSPs bind to single-stranded nucleic acids through the ribonucleoprotein 1 and 2 (RNP 1 and 2) binding motifs. CSPs play an essential role in cold adaptation by regulating transcription and translation via molecular chaperones. The solution nuclear magnetic resonance (NMR) or X-ray crystal structures of several CSPs from various microorganisms have been determined, but structural characteristics of psychrophilic CSPs have not been studied. Therefore, we optimized the purification process to obtain highly pure Lm-Csp and determined the three-dimensional structure model of Lm-Csp by comparative homology modeling using MODELLER on the basis of the solution NMR structure of Bs-CspB. Lm-Csp consists of a ${\beta}$-barrel structure, which includes antiparallel ${\beta}$ strands (G4-N10, F15-I18, V26-H29, A46-D50, and P58-Q64). The template protein, Bs-CspB, shares a similar ${\beta}$ sheet structure and an identical chain fold to Lm-Csp. However, the sheets in Lm-Csp were much shorter than those of Bs-CspB. The Lm-Csp side chains, E2 and R20 form a salt bridge, thus, stabilizing the Lm-Csp structure. To evaluate the contribution of this ionic interaction as well as that of the hydrophobic patch on protein stability, we investigated the secondary structures of wild type and mutant protein (W8, F15, and R20) of Lm-Csp using circular dichroism (CD) spectroscopy. The results showed that solvent-exposed aromatic side chains as well as residues participating in ionic interactions are very important for structural stability. Further studies on the three-dimensional structure and dynamics of Lm-Csp using NMR spectroscopy are required.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5260-5266
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• 2015

To develop weapon system, Concurrent Spare Parts(CSP) is one of the important somethings in terms of Intergrated Logistics System(ILS). CSP is very important to improve the availability of weapon system, and various research about CSP are performed. However, most of the research does not consider the effects between sub-item's failure and weapon system's multiple function. In other words, if sub-item's failure does not seriously influence weapon system's specific function, the point, not necessarily to replace sub-item, is not considered. Therefore, the method to calculate CSP based on above consideration is written by failure-function matrix in this paper. The study follows the procedure below. First, it's to define the operation and maintenance procedure of weapon system. Second, failure-function matrix is developed. Third, simulation model is desinged by input data. Finally, The quantity of CSP is calculated by simulation and evolution strategy, meta-model. This study suggests new research direction to calculate CSP.

• Journal of Information Display
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• v.1 no.1
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• pp.32-34
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• 2000

A new PDP cell structure called CSP(Charge Storage Pad) improves the luminous efficiency by 1.6 times and prevents cross talk between adjacent cells. The CSP, which is a conducting material, is inserted between the dielectric layer and the MgO film in the front plate. This CSP produces a longer time-averaged discharge path to get a high luminous efficiency and confines the discharge to prevent cross talk.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.418-421
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• 2005

The objective of this research work is to investigate the effects of process parameters, such as power of laser, travel speed of laser and material thickness, on kerfwidth and characteristics of the cut surface for the case of cutting of CSP 1N sheet using high power continuous wave Nd:YAG laser. In order to find relationship between the process parameters on the quality of the cut section, such as kerfwidth, surface roughness and the striation formation, several laser cutting experiments are carried out. From the results of experiments, an optimal cutting speed for each cutting condition has been obtained to improve the quality of the cut surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.162-165
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• 2005

The objective of this research work is to investigate into the three-dimensional temperature distribution using quasi steady-state heat transfer analysis fur the case of the laser cutting of CSP 1N sheet using high power CW Nd:YAG laser. The laser heat source is assumed as a volumetric heat source with a gaussian heat distribution in a plane. Through the comparison of the results of analyses with those of the experiments, the optimal finite element model is obtained. Finally, characteristics of the three-dimensional heat transfer and temperature distribution have been estimated by the optimal finite element model.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.99.1-99
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• 1998

• Bulletin of the Korean Chemical Society
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• v.27 no.5
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• pp.637-641
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• 2006

Although chiral separation has been one of the main topics of chromatographic practice for over twenty-five years, it still presents many difficulties. In this work, the ultrasonic dependence of chiral resolution was investigated at various temperatures to improve resolution and reduce analysis time. The chiral resolution was performed on recently commercialized two HPLC chiral stationary phases (CSP 1 and CSP 2) with the analogues of racemic N-acylnaphthylethylamines (1a-d) and racemic amino acid derivatives (2a-c, 3a-c) as analytes. The CSP 1 was prepared from a (R)-N-(3,5-dinitrobenzoyl)phenylglycinol and the CSP 2 was prepared from a (S)-N-3,5-(dinitrobenzoyl) leucine. From the comparison of the chromatographic results under sonic condition with those under non-sonic condition, we found that the ultrasound decreased the elution time in chiral chromatography at all temperatures and improved the enantioselectivity at high temperature (45, 50, 60 ${^{\circ}C}$).