• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.66-66
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• 1999

최근 들어 다결정 SiGe은 MOS(Metal-Oxide-Semiconductor)에서 기존에 사용되던 다결정 Si 공정과의 호환성 및 여러 장점으로 인하여 다결정 Si 대안으로 많은 연구가 진행되고 있다. 고농도로 도핑된 P type의 다결정 SiGe은 Ge의 함량에 따른 일함수의 조절과 낮은 비저항으로 submicrometer CMOS 공정에서 게이트 전극으로 이용하려는 연구가 진행되고 있으며, 55$0^{\circ}C$ 이하의 낮은 온도에서도 증착이 가능하고, 도펀트의 활성화도가 높아서 TFT(Thin Film Transistor)에서도 유용한 재료로 검토되고 있다. 현재까지 다결정 SiGe의 증착은 MBE, APCVD, RECVD. HV/LPCVD 등 다양한 방법으로 이루어지고 있다. 이중 HV/LPCVD 방법을 이용한 증착은 반도체 공정에서 게이트 전극, 유전체, 금속화 공정 등 다양한 공정에서 사용되고 있는 방법으로 현재 사용되고 있는 반도체 공정과의 호환성의 장점으로 다결정 SiGe 게이트 전극의 증착 공정에 적합하다고 할 수 있다. 본 연구에서는 HV/LPCVD 방법을 이용하여 게이트 전극으로의 활용을 위한 다결정 SiGe의 증착 메카니즘을 분석하고 Ex-situ implantation 후 열처리에 따라 나타나는 활성화 정도를 분석하였다. 도펀트를 첨가하지 않은 다결정 SiGe을 주성엔지니어링의 EUREKA 2000 장비를 이용하여, 1000$\AA$의 열산화막이 덮혀있는 8 in 웨이퍼에 증착하였다. 증착 온도는 55$0^{\circ}C$에서 6$25^{\circ}C$까지 변화를 주었으며, 증착압력은 1mtorr-4mtorr로 유지하였다. 낮은 증착압력으로 인한 증착속도의 감소를 방지하기 위하여 Si source로서 Si2H6를 사용하였으며, Ge의 Source는 수소로 희석된 10% GeH4와 100% GeH4를 사용하였다. 증착된 다결정 SiGe의 Ge 함량은 RBS, XPS로 분석하였으며, 증착된 박막의 두께는 Nanospec과 SEM으로 관찰하였다. 또한 Ge 함량 변화에 따른 morphology 관찰과 변화 관찰을 위하여 AFM, SEM, XRD를 이용하였으며, 이온주입후 열처리 온도에 따른 활성화 정도의 관찰을 위하여 4-point probe와 Hall measurement를 이용하였다. 증착된 다결정 SiGe의 두게를 nanospec과 SEM으로 분석한 결과 Gem이 함량이 적을 때는 높은 온도에서의 증착이 더 빠른 증착속도를 나타내었지만, Ge의 함량이 30% 되었을 때는 온도에 관계없이 일정한 것으로 나타났다. XRD 분석을 한 결과 Peak의 위치가 순수한 Si과 순수한 Ge 사이에 존재하는 것으로 나타났으며, ge 함량이 많아짐에 따라 순수한 Ge쪽으로 옮겨가는 경향을 보였다. SEM, ASFM으로 증착한 다결정 SiGe의 morphology 관찰결과 Ge 함량이 높은 박막의 입계가 다결정 Si의 입계에 비해 훨씬 큰 것으로 나타났으며 근 값도 증가하는 것으로 나타났다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.133-136
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• 2001

In this paper, we investigated the diffraction efficiency of polarization holography using by amorphous $Ag/As_{40}Ge_{10}Se_{15}S_{35}$ multi-layer thin films by He-Ne laser. Multi-layer structures were formed by alternating a layer of meta1(Ag) and chalcogenide( $Ag/As_{40}Ge_{10}Se_{15}S_{35}$ ). The holographic grating in these thin flims has been formed using a linealy polarized He-Ne laser light (633nm). The diffraction efficiency was investigated the two sample of $Ag/As_{40}Ge_{10}Se_{15}S_{35}-7$ layers and $Ag/As_{40}Ge_{10}Se_{15}S_{35}-15$ layers. As the results, we found that the diffraction efficiency of $Ag/As_{40}Ge_{10}Se_{15}S_{35}-7$ layers and $Ag/As_{40}Ge_{10}Se_{15}S_{35}-15$ layers were 1.7% and 2.5% respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.133-136
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• 2001

In this paper, we investigated the diffraction efficiency of polarization holography using by amorphous Ag/As$\sub$40/Ge$\sub$10/Se$\sub$15/S$\sub$35/ multi-layer thin films by He-Ne laser. Multi-layer structures were formed by alternating a layer of metal(Ag) and chalcogenide(As$\sub$40/Ge$\sub$10/Se$\sub$15/S$\sub$35/). The holographic grating in these thin films has been formed using a lineally polarized He-Ne laser light (633nm). The diffraction efficiency was investigated the two sample of Ag/As$\sub$40/Ge$\sub$10/Se$\sub$15/S$\sub$35/-7 layers and Ag/As$\sub$40/Ge$\sub$10/Se$\sub$15/S$\sub$35/-15 layers. As the results, we found that the diffraction efficiency of Ag/As$\sub$40/Ge$\sub$10/Se$\sub$15/S$\sub$35/-7 layers and Ag/As$\sub$40/Ge$\sub$10/Se$\sub$15/S$\sub$35/-15 layers were 1.7% and 2.5% respectively

• The Korean Journal of Food And Nutrition
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• v.22 no.4
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• pp.701-707
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• 2009

This study was conducted to investigate the effects of Ge(germanium) treatment on rice quality. Rice samples were divided into the following treatment groups: control(CON: cultivated without Ge), Ge-1(cultivated with 200 kg of rough stone powder containing 1.6 mg/kg germanium per 10 ha), and Ge-2(cultivated with 500 kg of rough stone powder containing 1.6 mg/kg germanium per 10 ha). The mean total Ge level in the Ge-2 sample was 20.47 ppb. The levels of Ca and Na in the Ge-2 rice increased by 65.12 and 110.28%, respectively, when compared to the control, whereas the Zn, Mn, Fe, Mg and K content decreased by 11.44~30.50%. No significant difference in the percentage weight of C and O was observed among samples. The order of the percentage weight of P, S, and Cl was Ge-2>Ge-1>CON. The free amino acids were higher in samples from the Ge-1 and Ge-2 groups than in samples from the control. The GABA($\gamma$-aminobutyric acid) amount in the Ge-2 products was significantly high compared to other groups. The micro structure of Ge-2 showed a firmer network than the control and had a macroporous structure. Conversely, the Ge-2 products had higher scores for stickiness, hardness and overall taste when compared to the other groups. These results suggest that rice treated with rough stone powder containing germanium can be used in the production of commercially-desired functional rice.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.1
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• pp.6-10
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• 2018

Ni germanide (NiGe) is a promising alloy material with small contact resistance at the source/drain (S/D) of Ge MOSFETs. However, it is necessary to reduce the specific contact resistance between NiGe and the doped Ge S/D region in high-performance MOSFETs. In this study, a novel method is proposed to reduce the specific contact resistance between NiGe and p-type Ge (p-Ge) using a Tb interlayer. The specific contact resistance between NiGe and p-Ge was successfully decreased with the introduction of the Tb interlayer. To investigate the mechanism behind the reduction in the specific contact resistance, the elemental distribution and crystalline structure of NiGe were analyzed using secondary ion mass spectroscopy and X-ray diffraction. It is likely that the reduction in specific contact resistance was caused by an increase in the concentration of boron in the space between NiGe and p-Ge due to the influence of the Tb interlayer.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.854-859
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• 2016

Recently, GeSn is drawing great deal of interests as one of the candidates for group-IV-driven optical interconnect for integration with the Si complementary metal-oxide-semiconductor (CMOS) owing to its pseudo-direct band structure and high electron and hole mobilities. However, the large lattice mismatch between GeSn and Si as well as the Sn segregation have been considered to be issues in preparing GeSn on Si. In this work, we deposit the GeSn films on Si by DC magnetron sputtering at a low temperature of $250^{\circ}C$ and characterize the thin films. To reduce the stresses by GeSn onto Si, Ge buffer deposited under different processing conditions were inserted between Si and GeSn. As the result, polycrystalline GeSn domains with Sn atomic fraction of 6.51% on Si were successfully obtained and it has been demonstrated that the Ge buffer layer deposited at a higher sputtering power can relax the stress induced by the large lattice mismatch between Si substrate and GeSn thin films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.4
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• pp.267-273
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• 1998

The band structures of $Si_{1-x}Ge_x$ layers grown on $Si_{1-y}Ge_y$ substrate are calculated using k$\cdot$p and strain Hamiltonians. The hole drift mobilities in the plane direction are then calculated by taking into account the screening effect and the density-of-states of the impurity band. When $Si_{1-x}Ge_x$ is grown on Si substrate, the mobilities of (110) and (111) $Si_{1-x}Ge_x$ layers are larger than that of (001) $Si_{1-x}Ge_x$. However, due to the large defect and surface scattering, (110) and (111) $Si_{1-x}Ge_x$ layers may not be useful for the development of the fast device. Meanwhile, when Si is grown on $Si_{1-y}Ge_y$ substrate, the mobilities of (001) and (110) Si layers are greatly enhanced. Based on the amount of defect and the surface scattering, it is expected that Si grown on (001) $Si_{1-y}Ge_y$ substrate, where the Ge contents is larger than 10%(y>0.1), has the highest mobility.

• Food Science and Preservation
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• v.6 no.4
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• pp.506-513
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• 1999

The growth of lactic acid bacteria was investigated in liquid broth medium containing organic germanium compound(Ge-132, carboxyethylgermanium sesquioxide) in the range of 0.01 to 10mg/ml. Most of all lactic acid bacteria tested were tolerant and could grow better to the high Ge-132 concentration. However, the growth of Leuconostoc mesenteroides and Pediococcus pentosaceus were inhibited in the presence of 10mg/m1 Ge-132. Among 22 strains tested, lactic acid bacteria that were grown to a high degree(about 2 times) by addition of Ge-132 (10mg/ml)were Lactococcus lactis, Lc. cremoris, Lc. diacetilactis, Enterococcus faecium and Streptococcus faecalis. The growth of these strains were markedly accelerated in the culture medium supplemented with 1.omg/ml Ge-132 The optimal concentration of glucose for growth of Lc. lactic was found to be high in medium containing Ge-132 as compared with the case of control. During cultivation viscosity in culture broths of Lc. lactis and Lc. cremoris was rapidly elevated by adding Ge-132 to medium containing high concentration of glucose, and then decreased after incubation of long time. However, in the cultivation of Lc. diacetilactis, E, faecium and S. faecalis, viscosity of culture broths was not increased, even though Ge-132 was shown to be an effective stimulant of growth.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.12
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• pp.1080-1086
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• 2005

We have studied the Ge redistribution after dry oxidation and the oxide growth rate of $Si_{1-x}Ge_x$ epitaxial layer. Oxidation were performed at 700, 800, 900, and $1,000\;^{\circ}C$. After the oxidation, the results of RBS (Rutherford Back Scattering) & AES(Auger Electron Spectroscopy) showed that Ge was completely rejected out of the oxide and pile up at $Si_{1-x}Ge_x$ interface. It is shown that the presence of Ge at the $Si_{1-x}Ge_x$ interface changes the dry oxidation rate. The dry oxidation rate was equal to that of pure Si regardless of Ge mole fraction at 700 and 800$^{\circ}C$, while it was decreased at both 900 and $1,000^{\circ}C$ as the Ge mole fraction was increased. The dry of idation rates were reduced for heavy Ge concentration, and large oxiidation time. In the parabolic growth region of $Si_{1-x}Ge_x$ oxidation, the parabolic rate constant are decreased due to the presence of Ge-rich layer. After the longer oxidation at the $1,000^{\circ}C$, AES showed that Ge peak distribution at the $Si_{1-x}Ge_x$ interface reduced by interdiffusion of silicon and germanium.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.905-909
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• 2009

The new Junction Field Effect Transistors (JFETs) with Silicon-germanium (SiGe) layers is investigated. This structure uses SiGe layer to prevent out diffusion of boron in the channel region. In this paper, we report electrical properties of SiGe JFET measured under various design parameters influencing the performance of the device. Simulation results show that out diffusion of boron is reduced by the insertion SiGe layers. Because the SiGe layer acts as a barrier to prevent the spread of boron. This proposed JFET, regardless of changes in fabrication processes, accurate and stable cutoff voltage can be controlled. It is easy to maintain certain electrical characteristics to improve the yield of JFET devices.