• The Journal of the Korea institute of electronic communication sciences
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• v.12 no.5
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• pp.791-796
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• 2017

In this study, we investigated the influence of the fabrication process of stacked capacitors on the cell capacitance by using Load Lock (L/L) LPCVD system for dielectric thin film of DRAM capacitor. As a result, it was confirmed that the capacitance difference of about 3-4 fF is obtained by reducing the effective thickness of the oxide film by about $6{\AA}$ compared to the conventional non-L/L device. In addition, Cs was found to be about 3-6 fF lower than the calculated value, even though the measurement range of the thickness of the nitride film as an insulating film was in a normal management range. This is because the node poly FI CD is managed at the upper limit of the spec, resulting in a decrease in cell surface area, which indicates a Cs reduction of about 2fF. Therefore, it is necessary to control the thickness of insulating film and CD management within 10% of the spec center value in order to secure stable Cs.

• Journal of Sensor Science and Technology
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• v.9 no.2
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• pp.90-95
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• 2000

The substrate for pyroelectric IR sensor which has orientation similar to MgO single crystal was fabricated by depositing the MgO thin film on $Si_3N_4/SiO_2/Si_3N_4$/Si. The MgO thin film was deposited by RF magnetron sputtering. The c-axis orientation of PLT thin film deposited on Pt/MgO(100)/$Si_3N_4/SiO_2/Si_3N_4$/Si substrate was investigated. The MgO thin film deposited at $500^{\circ}C$ at a gas pressure of 30 mTorr with RF power of 160 W exhibited a good a-axis orientation. The PLT thin films deposited on these substrates also exhibited c-axis orientation similar to the PLT thin films deposited on MgO single crystal substrate.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.1
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• pp.52-59
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• 2004

Recently, many researches for fine particles plasma have been focused on the fabrication of the new devices and materials in micro-electronic industry, although reduction or elimination of fine particles was interested in plasma processing until now on. In order to enhance their utilization, it is necessary to control and analyze fine particle behavior. Therefore, we developed simulation model of fine particles in RF Ar plasmas. This model consists of the calculation parts of plasma structure using a two-dimensional fluid model and of fine particle behavior. The motion of fine particles was derived from the charge amount on the fine particles and forces applied to them. In this paper, Ar plasma properties using two-dimensional fluid model without fine particles were calculated at power source voltage 15[V] and pressure 0.5[Torr]. Time-averaged spatial distributions of Ar plasma were shown. The process on the formation of Coulomb crystal of fine particles was investigated and it was explained by combination of ion drag and electrostatic forces. And also analysis on the forces of fine particles was presented.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.88-92
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• 2003

In this paper, the characteristics of the ZnO films deposited on AI bottom electrode and the temperature effects on the ZnO film growth are presented along with the fabrication and their evaluation of the film bulk acoustic wave resonator (FBAR) devices. All the films used in this work were deposited using a radio-frequency (RF) magnetron sputtering technique. Growth characteristics of the ZnO films are shown to have a strong dependence on the deposition temperatures ranged from room temperature to 35$0^{\circ}C$ regardless of the RF power applied for sputtering the ZnO target. In addition, according to the growth characteristics of the distinguishably different micro-crystal structures and the degree of the c-axis preferred orientation, the deposition temperatures can be divided into 3 temperature regions and 2 critical temperatures in-between. Overall, the ZnO films deposited at/below 20$0^{\circ}C$ are seen to have columnar grains with a highly preferred c-axis orientation where the full width at half maximum (FWHM) of X-ray diffraction rocking curve is 14$^{\circ}$. Based on the experimental findings, several FBAR devices were fabricated and measured. As a result, the FBAR devices show return loss of ~19.5dB at resonant frequency of ~2.05GHz.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.2
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• pp.286-291
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• 1998

$SrTiO_3$[ST] thin films were fabricated on $RuO_2$bottom electrodes by RF magnetron sputtering with various $Ar/O_2$ratio in sputtering gas. As the content of oxygen increases, the leakage current of ST films measured at $10^5$ V/cm decreases from $2.0{\times}10^{-6}A/{\textrm}{cm}^2(Ar/O_2=10/0)$ to $3.8{\times}10^{-7}A/{\textrm}cm^2(Ar/O_2=5/5)$, and the dielectric constant of ST films increases from $70(Ar/O_2=10/0)$ to $190(Ar/O_2=5/5)$. The improvement of electrical properties of ST films is mainly due to the structural modification of ST films such as better crystallinity, smooth surface morphology with the increase of oxygen content in the sputtering gas.

• Journal of the Korean Magnetics Society
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• v.10 no.3
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• pp.118-122
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• 2000

MR characteristics of $Al_2$ $O_3$ based magnetic tunneling juction with various $Al_2$ $O_3$ thicknesses were investigated. Spin-dependent tunneling junctions, in which the tunneling barrier $Al_2$ $O_3$ is formed by depositing a 1-3 nm thick Al layer, followed by thermal oxidation at room temperature in an $O_2$atmosphere, were fabricated on 4$^{\circ}$tilt(111)Si substrate in 3-gun magnetron sputtering system. The top and bottom ferromagnetic electrodes were Ni$_{80}$Fe$_{20}$ and Co. A maximum Tunneling MR ratio of 14% was obtained in the junction of which insulating barrier thickness was 2 nm. By increasing the tunneling voltage across the junction, maximum MR ratio reduced and finally showed no MR characteristics.s.

• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.331-340
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• 2010

3D fluid based numerical modelling is done for a VHF multi hollow cathode array plasma enhanced chemical vapor deposition system. In order to understand the fundamental characteristics of it, Ar plasma is analyzed with a condition of 40 MHz, 100 Vrf and 1 Torr. For hole array of 6 mm diameter and 20 mm inter-hole distance, plasma is well confined within the hole at an electrode gap of 10 mm. The peak plasma density was $5{\times}10^{11}#/cm^3$ at the center of the hole. When the substrate was assumed at ground potential, electron temperature showed a peak at the vicinity of the grounded walls including the substrate and chamber walls. The reaction rate of metastable based two step ionization was 10 times higher than the direct electron impact ionization at this condition. For $H_2$, the spatial localization of discharge is harder to get than Ar due to various pathways of electron impact reactions other than ionization.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.63-63
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• 2011

비정질 반도체/절연체의 직류와 교류 전도도 스펙트럼은 주파수에 대한 거듭제곱의 법칙 (power-law)을 따르는 보편성이 있음이 확인되었다. 이러한 보편성은 다양한 비정질 반도체/절연체 물질에서 공통적으로 관찰되었으며 현재까지 이 보편성의 물리학적 원인이 정확히 규명되지 않고 있다. 이 보편성을 설명하기 위한 모델로서 비정질 반도체/절연체 내의 전자/정공의 호핑 전도기구 (hopping conduction mechanism)가 제시된 바 있으며 다양한 비정질 시스템의 전도도 스펙트럼 해석에 인용되고 있다. 그러나 직.교류 전도기구 사이의 상이함에 대한 이견이 있으며 현재까지 정확히 규명된 바 없다. 본 연구에서는 비정질 GeSe 반도성 물질의 전도도 스펙트럼을 10 Hz-1 MHz 주파수 대역에서 측정하였으며 이를 위해 백금 상.하부 전극을 갖는 크로스바(crossbar)형의 금속-절연체-금속구조의 2단자 소자를 제작하였다. 측정 스펙트럼으로부터 본 연구의 GeSe 물질이 앞서 언급한 비정질 물질의 보편성에 부합함을 확인하였으며 스펙트럼 내의 직류와 교류 성분을 명확히 분리할 수 있었다. 직.교류 전도도 스펙트럼의 명확한 기구 분리를 위하여 4개의 상이한 면적을 갖는 크로스바에 대한 측정을 실시하였으며 그 결과로 직.교류 전도도의 상이한 면적 의존성을 관찰하였고 이를 근거로 직.교류 전도도가 서로 다른 전도기구에 기인함을 간접적으로 알 수 있었다. GeSe의 전도도 스펙트럼의 온도 의존성 실험을 위해 시편의 온도를 20-300 K 범위에서 변화시키며 전도도 스펙트럼을 측정하였으며 이를 통해 교류 전도도 스펙트럼 내에 상이한 두 개의 전도 기구가 혼재해있음을 규명하였다.

• Korean Journal of Materials Research
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• v.13 no.2
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• pp.69-73
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• 2003

In this work, $IrO_2$thin films as bottom electrode of ferroelectric capacitors were deposited and characterized. The $IrO_2$films deposited in the conditions of 25, 40 and 50% oxygen ambient by sputtering method were annealed at 600, 700 and $800^{\circ}C$, respectively. It was found that the crystallinity and the surface morphology of $IrO_2$films affected the surface properties and electrical properties of SBT thin films prepared by the MOD method. With increasing temperature, the crystallinity and the roughness of $IrO_2$films were also increasing. This increasing of roughness degraded the surface properties and electrical properties of SBT films. We found an optimum condition of $IrO_2$films as bottom electrode for ferroelectric capacitor at 50% oxygen ambient and $600^{\circ}C$ annealing temperature. Electrical characterizations were performed by using$ IrO_2$bottom electrodes grown at an optimum conditions. The remanent polarization ($P_{r}$) of the Pt/SBT/$IrO_2$/$SiO_2$/Si structure was 2.75 $\mu$C/$\textrm{cm}^2$ at an applied voltage of 3 V. The leakage current density was $1.06${\times}$10^{-3}$ A/$\textrm{cm}^2$ at an applied voltage of 3 V.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.76-79
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• 2005

Dry etching of NiFe, NiFeCo, and Ta for magnetic random access memory (MRAM) by inductively coupled plasmas (ICPs) of $Cl_2/Ar$ has been carried out. NiFe and NiFeCo showed maximum etch rates at a particular ICP source power, but the etch rate of Ta increased with the ICP source power. The etch rates of the magnetic thin films increased with the RF chuck power, but decreased with the operating pressure and the $Cl_2$ concentration. To avoid a corrosion problem by chlorine, the etched samples were rinsed with de-ionized water for 5 minutes after etching. The etch profile showed a clean and smooth surface at 50% $Cl_2$ concentration.