• Title/Summary/Keyword: 필러

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Structural Analysis and Design of B-pillar Reinforcement using Composite Materials (복합소재를 활용한 B필러 강화재의 구조해석 및 설계)

  • Kang, Ji Heon;Kim, Kun Woo;Jang, Jin Seok;Kim, Ji Wook;Yang, Min Seok;Gu, Yoon Sik;Ahn, Tae Min;Kwon, Sun Deok;Lee, Jae Wook
    • Composites Research
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    • v.34 no.1
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    • pp.35-46
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    • 2021
  • This paper aims to reduce weight by replacing the reinforcements of the B-pillar used in vehicles with CFRP(Carbon Fiber Reinforced Plastics) and GFRP(Glass Fiber Reinforced Plastics) from the existing steel materials. For this, it is necessary to secure structural stability that can replace the existing B-pillar while reducing the weight. Existing B-pillar are composed of steel reinforcements of various shapes, including a steel outer. Among these steel reinforcements, two steel reinforcements are to be replaced with composite materials. Each steel reinforcement is manufactured separately and bonded to the B-pillar outer by welding. However, the composite reinforcements presented in this paper are manufactured at once through compression and injection processes using patch-type CFRP and rib-structured GFRP. CFRP is attached to the high-strength part of the B-pillar to resist side loads, and the GFRP ribs are designed to resist torsion and side loads through a topology optimization technique. Through structural analysis, the designed composite B-pillar was compared with the existing B-pillar, and the weight reduction ratio was calculated.

Connection Structure Between Center Pillar and Roof Center Rail (거셋일체형 센터필러 어퍼 루프레일 연결구조 개발)

  • Lee, Hae Hoon;Chung, Pil Sang;Kang, Chong Ku
    • Journal of Auto-vehicle Safety Association
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    • v.13 no.4
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    • pp.26-32
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    • 2021
  • This study is intended to augment the Roof strength test being evaluated by IIHS (Insurance Institute for Highway Safety). In order to find solutions for increasing Roof Crashworthiness Evaluation SWR (Strengthto-weight ratio). This study introduces that Integrated Connection Structure Between Center Pillar and Roof Center Rail is proposed as a critical solution.

Effect of Inorganic Fillers on the Dimensional Stability of Poly(ethylene naphthalate) Film as a Flexible Substrate (무기 필러가 유연기판용 폴리에틸렌나프탈레이트 필름 치수안정성에 미치는 영향)

  • Kim, Jongwha;Kim, Hongsuk;Kang, Ho-Jong
    • Polymer(Korea)
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    • v.36 no.6
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    • pp.733-738
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    • 2012
  • The effect of glass bead and glass fiber on the enhancement of dimensional stability in poly(ethylene naphthalate) (PEN) flexible substrate for photovoltaic devices has been studied. It was found that the coefficient of thermal expansion (CTE) and the optical transmittance decreased with increasing inorganic filler content. In addition to filler contents, the size and size distribution of fillers are the other important factors to improve CTE and optical transmittance of PEN film. Our results showed that the optimum filler content was found to be about 5 wt% to enhance the dimensional stability of PEN by more than 50% with maintaining the optical transmittance over 85% for the flexible substrate.

A STUDY OF MICROHARDNESS AND POLYMERIZATION SHRINKAGE OF PACKABLE RESINS (Packable resin의 미세경도와 경화수축)

  • Son, Deok-Il;Nam, Soon-Hyeun;Kim, Hyun-Jung;Seol, Hyo-Joung;Kwon, Yong-Hoon;Kim, Hyung-Il;Kim, Young-Jin
    • Journal of the korean academy of Pediatric Dentistry
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    • v.31 no.3
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    • pp.534-540
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    • 2004
  • Packable resins have been introduced in the market with high expectations as an alternative to amalgam. They are characterized by a high-filler load and a filler distribution that gives them a different consistency compared with the hybrid resins. The effect of high filler load on the microhardness and polymerization shrinkage of packable resins was tested. Hybrid resins were also tested to compared with the packable resins. As a result, packable resins showed a much greater microhardness value than hybrid resins. All the tested resins have a correlationship with the microhardness and filler content (vol%). The packable resins showed much less polymerization shrinkage than hybrid resins. The filler content and polymerization shrinkage were inversely correlated in the tested resins.

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Recyclable Polymeric Composite with High Thermal Conductivity (재활용 가능한 고방열 고분자 복합소재 개발)

  • Shin, Haeun;Kim, Chae Bin;Ahn, Seokhoon;Kim, Doohun;Lim, Jong Kuk;Goh, Munju
    • Composites Research
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    • v.32 no.6
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    • pp.319-326
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    • 2019
  • To address tremendous needs for developing efficiently heat dissipating material with lightweights, a new class of polymer possessing recyclable and malleable characteristics was synthesized for incorporating model functional hexagonal boron nitride (h-BN) filler. A good interfacial affinity between the polymer matrix and the filler along with shear force generated upon manufacturing the composite yielded the final product bearing highly aligned filler via simple hot pressing method. For this reason, the composite exhibited a high thermal conductivity of 13.8 W/mK. Moreover, it was possible to recover the h-BN from the composite without physical/chemical denaturation of the filler by chemically depolymerizing the matrix, thus the recovered filler can be re-used in the future. We believe this polymer could be beneficial as matrix for incorporating many other functional fillers, thus they may find applications in various polymeric composite related fields.

Effect of Boron Nitride on Mechanical Properties, Thermal and Electrical Conductivities of Carbon Fiber Reinforced Plastics (탄소섬유강화 복합소재의 열적, 전기적, 기계적 특성에 대한 질화붕소 첨가제의 효과)

  • Hong, Hyunkee;Bae, Kwak Jin;Yu, Jaesang
    • Composites Research
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    • v.33 no.3
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    • pp.153-160
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    • 2020
  • In this paper, hexagonal boron nitride (h-BN) particles were added between the sheets of prepreg, and the effect of on many properties of BN-embedded carbon fiber reinforced plastics was investigated. The amount of BN particles which corresponds with 0 to 15 wt% of total resin weight was used as an additive material. The tensile strength and the inter-laminar shear strength of BN-embedded CFRP samples were improved by maximally 13.6%, and 6.7%, respectively. The tendency changes of thermal, electrical conductivities and the morphology of cross-section of CFRPs were also observed. This study suggests the possibility of controlling the characteristics of carbon fiber-BN-epoxy composites to use for aerospace applications.

Effects of silica fillers on the reliability of COB flip chip package using NCP (NCP 적용 COB 플립칩 패키지의 신뢰성에 미치는 실리카 필러의 영향)

  • Lee, So-Jeong;Kim, Jun-Ki;Lee, Chang-Woo;Kim, Jeong-Han;Lee, Ji-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.158-158
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    • 2008
  • 모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

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Preparation and Characterization of Pitch-based Carbon Paper for Low Energy and High Efficiency Surface Heating Elements (저전력 및 고효율 면상발열체를 위한 피치기반 탄소종이 제조 및 특성)

  • Yang, Jae-Yeon;Yoon, Dong-Ho;Kim, Byoung-Suhk;Seo, Min-Kang
    • Composites Research
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    • v.31 no.6
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    • pp.412-420
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    • 2018
  • In this work, phenolic resins containing conductive carbon fillers, such as, petroleum coke, carbon black, and graphite, were used to improve the surface heating elements by impregnating a pitch-based carbon paper. The influence of conductive carbon fillers on physicochemical properties of the carbon paper was investigated through electrical resistance measurement and thermal analysis. As a result, the surface resistance and interfacial contact resistivity of the carbon paper were decreased linearly by impregnating the carbon fillers with phenol resins. The increase of carbon filler contents led to the improvement of electrical and thermal conductivity of the carbon paper. Also, the heating characteristics of the surface heating element were examined through the applied voltage of 1~5 V. With the applied voltage, it was confirmed that the surface heating element exhibited a maximum heating characteristic of about $125.01^{\circ}C$(5 V). These results were attributed to the formation of electrical networks by filled micropore between the carbon fibers, which led to the improvement of electrical and thermal properties of the carbon paper.

Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package (초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발)

  • Park, Seong Yeon;On, Seung Yoon;Kim, Seong Su
    • Composites Research
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    • v.34 no.1
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    • pp.47-50
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    • 2021
  • In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

Establishment of Tailing Disposal Scenario in Open-Pit and Surface Pillar Stability Analysis (노천채굴적 내 광미 적치 시나리오 구축 및 천반 수평필러 안정성 분석)

  • Il-Seok Kang;Jae-Joon Song;Thomas Pabst
    • Tunnel and Underground Space
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    • v.34 no.1
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    • pp.54-70
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    • 2024
  • Utilization of completed open-pit for mining waste disposal is an alternative method of tailing storage facility (TSF), which can minimize the area and cost required for the installation of TSF. However, long-term tailing disposal into open-pit has a potential risk of reducing mechanical stability of surrounding rock mass by acting as an additional load. In this research, a realistic open-pit tailing disposal scenario of 60,400 hours was established based on the case of Marymia gold mine, Australia. Mechanical stability of surface pillar between open-pit and underground stope was analyzed numerically by using Sigma/W, under different stope geometry and rock mass conditions. Simulation results showed that long-term tailing disposal into open-pit can significantly increase the failure probability of surface piller. This result suggests that mechanical stability of mine geometry should be conducted beforehand of open-pit tailing disposal.