Composites Research

The Korean Society for Composite Materials (한국복합재료학회)
권호 표지
DOI QR코드

DOI QR Code

Recyclable Polymeric Composite with High Thermal Conductivity

재활용 가능한 고방열 고분자 복합소재 개발

  • Shin, Haeun (Institute of Advanced Composite Materials, Korea Institute of Science and Technology) ;
  • Kim, Chae Bin (Department of Polymer Science and Engineering, Pusan National University) ;
  • Ahn, Seokhoon (Institute of Advanced Composite Materials, Korea Institute of Science and Technology) ;
  • Kim, Doohun (Institute of Advanced Composite Materials, Korea Institute of Science and Technology) ;
  • Lim, Jong Kuk (Department of Chemistry, Chosun University) ;
  • Goh, Munju (Department of Chemical Engineering, Konkuk University)
  • Received : 2019.02.13
  • Accepted : 2019.12.23
  • Published : 2019.12.31
Download PDF
⟨ Previous Next ⟩

Abstract

To address tremendous needs for developing efficiently heat dissipating material with lightweights, a new class of polymer possessing recyclable and malleable characteristics was synthesized for incorporating model functional hexagonal boron nitride (h-BN) filler. A good interfacial affinity between the polymer matrix and the filler along with shear force generated upon manufacturing the composite yielded the final product bearing highly aligned filler via simple hot pressing method. For this reason, the composite exhibited a high thermal conductivity of 13.8 W/mK. Moreover, it was possible to recover the h-BN from the composite without physical/chemical denaturation of the filler by chemically depolymerizing the matrix, thus the recovered filler can be re-used in the future. We believe this polymer could be beneficial as matrix for incorporating many other functional fillers, thus they may find applications in various polymeric composite related fields.

본 연구에서는 재활용이 가능하며 열가소성 특성을 지닌 신규 고분자 수지를 개발하고 합성하였다. 이렇게 개발된 수지와 판상형 질화붕소(h-BN) 사이의 계면 친화성이 좋음을 계산과학을 통하여 확인하고 열압기(hot press)를 이용하여 복합소재를 제조하였다. 고분자 수지와 필러 사이의 계면 친화성과 함께 복합소재 제조시 발생되는 전단력(shear force) 만으로도 매우 높은 필러 정렬도를 지닌 복합소재를 제조할 수 있었고, 이러한 이유로 복합소재는 최대 13.8 W/mK의 높은 열전도도를 갖는 것을 확인하였다. 또한, 개발된 수지가 화학적으로 분해 가능한 장점을 이용하여 제조된 복합소재로부터 물리/화학적 변성 없이 필러를 회수할 수 있었고 이렇게 회수된 필러는 향후 다양한 신규 복합소재 제조에 재활용이 가능하다.

Keywords

References

  1. Moore, G.E., "Cramming More Components onto Integrated Circuits," Proceedings of the IEEE, Vol. 6, No. 1, 1998, pp. 82-85. https://doi.org/10.1109/JPROC.1998.658762
  2. Bates, C.M., Maher, M.J., Janes, D.W., Ellison, C.J., and Willson, C.G., "Block Copolymer Lithography," Macromolecules, Vol. 47, No. 1, 2014, pp. 2-12. https://doi.org/10.1021/ma401762n
  3. Kim, S.O., Solar, H.H., Stoykovich, M.P., Ferrier, N.J., de Pablo, J.J., and Nealey, P.F., "Epitaxial Self Assembly of Block Copolymers on Lithographically Defined Nanopatterned Substrates," Nature, Vol. 424, 2003, pp. 411-414. https://doi.org/10.1038/nature01775
  4. Stoykovich, M.P., Muller, M., Kim, S.O., Solak, H.H., Edwards, E.W., de Pablo, J.J., and Nealey, P.F., "Directed Assembly of Block Copolymer Blends into Nonregular Device-Oriented Structures," Science, Vol. 308, No. 5727, 2005, pp. 1442-1446. https://doi.org/10.1126/science.1111041
  5. Ruiz, R., Kang, H., Detcheverry, F.A., Dobisz, E., Kercher, D.S., Albrecht, T.R., de Pablo, J.J., and Nealey, P.F., "Density Multiplication and Improved Lithography by Directed Block Copolymer Assembly," Science, Vol. 321, No. 5891, 2008, pp. 936-939. https://doi.org/10.1126/science.1157626
  6. Moore, A.L., and Shi, L., "Emerging Challenges and Materials for Thermal Management of Electronics," Materials Today, Vol. 17, No. 4, 2014, pp. 163-174. https://doi.org/10.1016/j.mattod.2014.04.003
  7. Prasher, R., "Thermal Interface Materials: Historical Perspective, Status, and Future Directions," Proceedings of the IEEE, Vol. 94, No. 8, 2006, pp. 1571-1586. https://doi.org/10.1109/JPROC.2006.879796
  8. Wong, C.P., and Bollampally, R.S., "Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging," Journal of Applied Polymer Science, Vol. 74, 1999, pp. 3396-3403. https://doi.org/10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3
  9. Kang, D.G., Kim, N., Park, M., Nah, C., Kim, J.S., Lee, C.R., Kim, Y., Kim, C.B., Goh, M., and Jeong, K.U., "Interfacial Engineering for the Synergistic Enhancement of Thermal Conductivity of Discotic Liquid Crystal Composites," ACS Applied Materials & Interfaces, Vol. 10, No. 4, 2018, pp. 3155-3159. https://doi.org/10.1021/acsami.7b16921
  10. Jeong, I., Kim, C.B., Kang, D.-G., Jeong, K.-U., Jang, S.G., You, N.-H., Ahn, S., Lee, D.-S., and Goh, M., "Liquid Crystalline Epoxy Resin with Improved Thermal Conductivity by Intermolecular Dipole-Dipole Interactions," Journal of Polymer Science Part A: Polymer Chemistry, Vol. 57, No. 6, 2019, pp. 708-715. https://doi.org/10.1002/pola.29315
  11. Yeo, H., Islam, A Md., You, N.-H., Ahn, S., Goh, M., Hahn, J.R., and Jang, S.G., "Characteristic Correlation between Liquid Crystalline Epoxy and Alumina Filler on Thermal Conducting Properties," Composites Science and Technology, Vol. 141, 2017, pp. 99-105. https://doi.org/10.1016/j.compscitech.2017.01.016
  12. Islam, A Md., Lim, H., You, N.-H., Ahn, S., Goh, M., Hahn, J.R., Yeo, H., and Jang, S.G., "Enhanced Thermal Conductivity of Liquid Crystalline Epoxy Resin using Controlled Linear Polymerization," ACS Macro Letters, Vol. 7, No. 10, 2018, pp.1180-1185. https://doi.org/10.1021/acsmacrolett.8b00456
  13. Xu, X., Chen, J., Zhou, J., and Li, B., "Thermal Conductivity of Polymers and Their Nanocomposites," Advanced Materials, Vol. 30, No. 17, 2018, 1705544. https://doi.org/10.1002/adma.201705544
  14. Kim, C.B., Lee, J., Cho, J., and Goh, M., "Thermal Conductivity Enhancement of Reduced Graphene Oxide via Chemical Defect Healing for Efficient Heat Dissipation," Carbon, Vol. 139, 2018, pp. 386-392. https://doi.org/10.1016/j.carbon.2018.07.008
  15. Lee, J., Hwang, S., Lee, S.-K., Ahn, S., Jang, S.G., You, N.-H., Kim, C.B., and Goh, M., "Optimizing Filler Network Formation in Poly(hexahydrotriazine) for Realizing High Thermal Conductivity and Low Oxygen Permeation," Polymer, Vol. 179, 2019, pp. 121639. https://doi.org/10.1016/j.polymer.2019.121639
  16. Jiang, Q., Wang, X., Zhu, Y., Hui, D., and Qiu, Y., "Mechanical, Electrical and Thermal Properties of Aligned Carbon Nanotube/Polyimide Composites," Composites Part B: Engineering, Vol. 56, 2014, pp. 408-412. https://doi.org/10.1016/j.compositesb.2013.08.064
  17. Zhu, H., Li, Y., Fang, Z., Xu, J., Cao, F., Wan, J., Preston, C., Yang, B., and Hu, L., "Highly Thermally Conductive Papers with Percolative Layered Boron Nitride Nanosheets," ACS Nano, Vol. 8, No. 4, 2014, pp. 3606-3613. https://doi.org/10.1021/nn500134m
  18. Song, W.L., Wang, P., Cao, L., Anderson, A., Meziani, M.J., Farr, A.J., and Sun, Y.-P., "Polymer/Boron Nitride Nanocomposite Materials for Superior Thermal Transport Performance," Angewandte Chemie International Edition, Vol. 51, No. 26, 2012, pp. 6498-6501. https://doi.org/10.1002/anie.201201689
  19. Lin, Z., Liu, Y., Raghavan, S., Moon, K.S., Sitaraman, S.K., and Wong, C.P., "Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation," ACS Applied Materials & Interfaces, Vol. 5, No. 15, 2013, pp. 7633-7640. https://doi.org/10.1021/am401939z
  20. Yuan, C., Duan, B., Li, L., Xie, B., Huang, M., and Luo, X., "Thermal Conductivity of Polymer Based Composites with Magnetic Aligned Hexagonal Boron Nitride Platelets," ACS Applied Materials & Interfaces, Vol. 7, No. 23, 2015, pp. 13000-13006. https://doi.org/10.1021/acsami.5b03007
  21. Yousefi, N., Gudarzi, M.M., Zheng, Q.B., Aboutalebi, S.H., Sharif, F., and Kim, J.K., "Self-alignment and High Electrical Conductivity of Ultralarge Graphene Oxide-Polyurethane Nanocomposites," Journal of Materials Chemistry, Vol. 22, No. 25, 2012, pp. 12709-12717. https://doi.org/10.1039/c2jm30590a
  22. Liang, Q., Yao, X., Wang, W., Liu, Y., and Wong, C.P., "A Three-dimensional Vertically Aligned Functionalized Multilayer Graphene Architecture: An Approach for Graphene-based Thermal Interfacial Materials," ACS Nano, Vol. 5, No. 3, 2011, pp. 2392-2401. https://doi.org/10.1021/nn200181e
  23. Erb, R.M., Libanori, R., Rothfuchs, N., and Studart, A.R., "Composites Reinforced in Three Dimensions by using Low Magnetic Fields," Science, Vol. 355, No. 6065, 2012, pp. 199-204.
  24. Erb, R.M., Son, H.S., Samanta, B., Rotello, V.M., and Yellen, B.B., "Magnetic Assembly of Colloidal Superstructures with Multipole Symmetry," Nature, Vol. 457, 2009, pp. 999-1002. https://doi.org/10.1038/nature07766
  25. Lanticse, L.J., Tanabe, Y., Matsui, K., Kaburagi, Y., Suda, K., Hoteida, M., Endo, M., and Yasuda, E., "Shear-induced Preferential Alignment of Carbon Nanotubes Resulted in Anisotropic Electrical Conductivity of Polymer Composites," Carbon, Vol. 44, No. 14, 2006, pp. 3078-3086. https://doi.org/10.1016/j.carbon.2006.05.008
  26. Terao, T., Zhi, C., Bando, Y., Mitome, M., Tang, C., and Golberg, D., "Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement," Journal of Physical Chemistry C, Vol. 114, No. 10, 2010, pp. 4340-4344. https://doi.org/10.1021/jp911431f
  27. Jan, R., May, P., Bell, A.P., Habib, A., Khan, U., and Coleman, J.N., "Enhancing the Mechanical Properties of BN NanosheetPolymer Composites by Uniaxial Drawing," Nanoscale, Vol. 6, No. 9, 2014, pp. 4889-4895. https://doi.org/10.1039/c3nr06711d
  28. Haggenmueller, R., Gommans, H.H., Rinzler, A.G., Fischer, J.E., and Winey, K.I., "Aligned Single Wall Carbon Nanotubes in Composites by Melt Processing Methods," Chemical Physics Letters, Vol. 330, No. 3-4, 2000, pp. 219-225. https://doi.org/10.1016/S0009-2614(00)01013-7
  29. Shin, H., Ahn, S., Lim, J.K., Kim, C.B., and Goh, M., "Recyclable Thermoplastic Hexagonal Boron Nitride Composites with High Thermal Conductivity," Composites Part B: Engineering, Vol, 163, 2019, pp. 723-729. https://doi.org/10.1016/j.compositesb.2019.01.049
  30. García, J.M., Jones, G.O., Virwani, K., McCloskey, B.D., Boday, D.J., ter Huurne, J.M., Horn, H.W., Coady, D.J., Bintaleb, A.M., Alabdulrahman, A.M.S., Alsewailem, F., Almegren, H.A.A., and Hedrick, J.L., "Recyclable, Strong Thermosets and Organogels via Paraformaldehyde Condensation with Diamines," Science, Vol. 344, No. 6185, 2014, pp. 732-735. https://doi.org/10.1126/science.1251484
  31. Kaminker, R., Callaway, E.B., Dolinski, N.D., Barbon, S.M., Shibata, M., Wang, H., Hu, J., and Hawker, C.J., "Solvent-free Synthesis of High-performance Polyhexahydrotriazine (PHT) Thermosets," Chemistry of Materials, Vol. 30, No. 22, 2018, pp. 8352-8358. https://doi.org/10.1021/acs.chemmater.8b03926
  32. Lei, H., Wang, S., Liaw, D.J., Cheng, Y., Yang, X., Tan, J., Chen, X., Gu, J., and Zhang, Y., "Tunable and Processable Shape-Memory Materials Based on Solvent-Free Catalyst-Free Polycondensation between Formaldehyde and Diamine at Room Temperature," ACS Macro Letters, Vol. 8, No. 5, 2019, pp. 582-587.
  33. Ho, M.-P., Wang, H., Lau, K.-T., Lee, J.-H., and Hui, D., "Interfacial Bonding and Degumming Effects on Silk Fibre/Polymer Biocomposites," Composites Part B: Engineering, Vol. 43, 2012, pp. 2801-2812. https://doi.org/10.1016/j.compositesb.2012.04.042
  34. Lu, T., Jiang, M., Jiang, Z., Hui, D., Wang, Z., and Zhou, Z., "Effect of Surface Modification of Bamboo Cellulose Fibers on Mechanical Properties of Cellulose/Epoxy Composites," Composites Part B: Engineering, Vol. 51, 2013, pp. 28-34. https://doi.org/10.1016/j.compositesb.2013.02.031
  35. Nielsen, L.E., "Generalized Equation for the Elastic Moduli of Composite Materials," Journal of Applied Physics, Vol. 41, No. 11, 1970, pp. 4626-4627. https://doi.org/10.1063/1.1658506
  36. Tanimoto, M., Yamagata, T., Miyata, K., and Ando, S., "Anisotropic Thermal Diffusivity of Hexagonal Boron Nitride-filled Polyimide Films: Effects of Filler Particle Size, Aggregation, Orientation, and Polymer Chain Rigidity," ACS Applied Materials & Interfaces, Vol. 5, No. 10, 2013, pp. 4374-4382. https://doi.org/10.1021/am400615z
  37. Lee, K.H., Shin, H.J., Lee, J., Lee, I.Y., Kim, G.H., Choi, J.Y., and Kim, S.W., "Large-scale Synthesis of High-quality Hexagonal Boron Nitride Nanosheets for Large-Area Graphene Electronics," Nano Letters, Vol. 12, No. 2, 2012, pp. 714-718. https://doi.org/10.1021/nl203635v