• Title/Summary/Keyword: 폴리이미드

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Effects of Additives on the Friction and Wear Properties of PTFE Composites (PTFE 복합재료의 마찰 . 마모 특성에 미치는 첨가제의 영향)

  • 김용직;엄수현;김윤해
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 1999.11a
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    • pp.88-94
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    • 1999
  • Recently, PTFE-polyimide composites are being used self-lubricating parts for industrial field. Thus, this study is mainly concerned with friction and wear properties for the piston ring of non-lubricating air compressor which made of PTFE-polyimide composites. The friction and wear test was carried out for the different composition ratio under the atmosphere room temperature and constant load of 7.69N and their friction and wear properties were compared with each other at various sliding speed. Notable results are summarized as follows. PTFE 100% showed that friction coefficient was almost same values at 0.94 and 1.88m/s but the value was decreased at 2.83m/s because the friction temperature is higher than low speed. PTFE 80%-PI 20% showed the lowest mean friction coefficient at 2.83m/s. PTFE 20%-PI 80% showed the highest friction coefficient at 0.94m/s and the value was decreased at high speed but the value is higher than other materials except PTFE 100 %. PI 100% showed the highest friction coefficient at 0.94 and 1.88m/s because adhesive wear mainly occurred that speed. PTFE 100% showed highest specific wear rate on the whole. Specific wear rate of PTFE 80%-PI 20% was almost the same value with PTFE 20%-PI 80%. PI 100% showed the lowest value at high sliding speed because the friction surface was thicken and carbonated by high friction temperature.

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Moisture Diffusion Analysis for Bendable Electronic Module Under Autoclave Test Condition (유연성 전자모듈에 대한 오토클레이브 시험조건에서의 습기확산해석)

  • Han, Chang-Woon;Oh, Chul-Min;Hong, Won-Sik
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.5
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    • pp.523-528
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    • 2012
  • A bendable electronic module is developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In the module, a thin silicon chip is embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. A set of tests are conducted for the purpose of qualification: thermal shock, high temperature storage, and autoclave tests. During the autoclave test, delamination occurs at many places within the module layers. To investigate the failure mechanism, moisture diffusion analysis is conducted for the interior of the module under the autoclave test condition. For the analysis, the hygroscopic characteristics of the encapsulating materials are experimentally determined. Analysis results indicate the moisture saturation process in the interior of the module under the autoclave test condition.

Preparation and Properties Enhancement of Epoxy Resin Employing Poly(amic acid) (PAA) (Poly(amic acid) (PAA)를 함유한 에폭시 수지의 제조 및 물성 향상)

  • 이용택;배성호;박병천
    • Polymer(Korea)
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    • v.25 no.2
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    • pp.254-262
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    • 2001
  • Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.

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Analysis of Properties of Rubbed Polyimide Alignment Layer and Rubbing Effect of Various Rubbing Cloths for LCD Fabrication (LCD 제조용 러빙포 물성에 따른 러빙된 폴리이미드 배향막의 특성 및 러빙효과 분석)

  • Ahn, Hong-Jun;Lee, Jang-Ju;Ahn, Jong-Soo;Park, Kyung-Chul;Noh, Jae-Gyu;Yoo, Dong-Yeon;Paek, Sang-Hyon
    • Polymer(Korea)
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    • v.35 no.5
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    • pp.385-389
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    • 2011
  • In rubbing process, process factors, the properties of alignment layer and the physical properties of rubbing cloth have acted as important variables. These factors affect the orientation properties of the alignment layer by rubbed extent that is determined by rubbing density and rubbing force. In this work, we studied the effects of rubbing cloths with different pile density and rigidity on rubbing density(length) and rubbing force. As the pile density and rigidity of rubbing cloths increased, the birefringence and the surface roughness of the rubbed alignment layers became bigger, but the characteristics of rubbing-effect had differed each other. The pile density of rubbing cloths which was related with the number of pile, affected the rubbing density(length). On the other hand, the pile rigidity of rubbing was closely related to rubbing force rather than the rubbing density(length).

Study on the Multi-stage Hollow Fiber Membrane Modules for SF6 Gas Separation (불화가스 분리를 위한 중공사막 모듈의 다단 기체분리공정 연구)

  • Jeong, Su Jung;Lim, Joo Hwan;Koh, Hyung Chul;Ha, Seong Yong
    • Membrane Journal
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    • v.26 no.2
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    • pp.159-165
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    • 2016
  • Polyimide hollow fiber membrane modules were prepared in order to investigate the process of multi stage gas separation. The modules performance was carried out using 50/50 of $N_2/SF_6$ mixed gas. The membrane modules has been tested for measuring gas flow rate and concentration under various stage cut at 0.5 MPa. The membrane modules showed a high recovery ratio at the same stage cut as $N_2/SF_6$ selectivity increased. Two stage process was fulfilled for improving $SF_6$ recovery ratio and $SF_6$ concentration. Eventually, two stage process showed higher performance of $SF_6$ recovery ratio and concentration ($SF_6$ recovery ratio = 95%, $SF_6$ conc. = 98%).

Effect of Additional Electrical Current on Adhesion Strength between Copper and Polyimide Films (인가 전류가 구리 도금 피막과 폴리이미드 필름의 접합력에 미치는 영향)

  • Lee, Jang-Hun;Han, Yoonsung;Lee, Ho-Nyun;Hur, Jin-Young;Lee, Hong Kee
    • Journal of the Korean institute of surface engineering
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    • v.46 no.1
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    • pp.9-15
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    • 2013
  • The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.

Embedded Ferrite Film Inductor in PCB Substrate (PCB기판에 임베디드 된 페라이트 필름 인덕터)

  • Bae, Seok;Mano, Yasuiko
    • Journal of the Korean Magnetics Society
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    • v.15 no.1
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    • pp.30-36
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    • 2005
  • Recently, It has been reported that the spin sprayed ferite film shows better magnetic properties at high frequeny that the ferrite by co-firing over $800^{\circ}C$ . Besides, there is no limitation to select the substrate materials because it can be processed with relatively low temperature below $100^{\circ}C$. Therefore, we fabricated film inductor as a passive device for DC-DC converter by a use of spin sprayed embedded form was completed by via hole process of pad opening. Saturation magnetization of 0.61 T and real part of permeability of 110 were obtained in Ni-Zn ferrite. In addition, inductance of 1.52 ${\mu}H$, quality factor of 24.3 at 5 MHz were measured with spiral 16 turn inductor. The rated current of inductor was 863 mA.

Effects of UV Irradiation and Thermal Treatment of Photo-Degradable Polyimide Layer on LC Alignment (광분해성 고분자를 이용한 액정배향에서의 광조사 및 열처리 효과)

  • Lee, Jang-Ju;Lee, Won-Ho;Shin, Yong-Il;Paek, Sang-Hyon
    • Polymer(Korea)
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    • v.36 no.2
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    • pp.145-148
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    • 2012
  • The effects of the linearly polarized UV (LPUV) irradiation and thermal treatment of a photo-degradable polyimide (CBDA-ODA) alignment layer (AL) on its AL properties, liquid crystal (LC) alignment, and LCD characteristics have been investigated. The best quality of LC photo-alignment have been induced by the LPUV-irradiation with much (about 5~10 times) less dosage than that generating the maximum anisotropy of the AL. A thermal treatment of the LPUV-irradiated AL has effectively removed the undesirable, low-M.W. fragments of the AL generated during the photo-decomposition and increased the stability of the AL, which has resulted in improvement of the LC alignment and the LCD property.

Preparation and Gas Permeation Properties of Polyimide-Silica Hybric Memberanes (폴리이미드-실리카 하이브리드막의 제조와 기체투과특성)

  • 염승호;정용수;이우태;김선일;김진환
    • Membrane Journal
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    • v.11 no.3
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    • pp.116-123
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    • 2001
  • Polyimide-silica hybrid membranes were prepared and the effect of silica content on the structural properties and the gas transport properties was studied. The hybrid membranes were obtained by the sol-gel process starting from 1,2,4,5-benzenetetracarboxylic dianhydride(PMDA), 4,4`-diamino- diphenyl oxide(ODA) and tetraethoxysilane(TEOS) in N,N` dimethylacetatmide (DMAc) solvent. The structural characterizations of the membrane were performed by FT-IR, EDX, TGA and SEM. The gas permeation experiments with ${N_2}, {O_2}, {H_2}, {CO_2}and ${CH_4}$ were carried out at the temperature of $25^{\circ}C$ and in the range of pressure from 3atm to 7atm. the hybrid membranes showed higher thermal stability than PI membranes. The silica patricles were uniformly embedded in the polyimide matrix and the size of silica particles increased with increasing silica content. The permeability coefficients of ${N_2}, {O_2}, {H_2}, {CO_2}and ${CH_4}$ increased with increasing silica content but the diffusion coefficients might appear to be a result of a solubility enhancement. In spite of the permeability enhancement, an increase in the selectivities of ${H_2}/{N_2}, ${H_2}/{O_2} and ${H_2}/{CO_2} was observed.

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Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test (온도/습도 시험, 온도 싸이클링 시험 및 고온유지 시험에 따른 Package-on-Package의 신뢰성)

  • Park, Donghyun;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.43-49
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    • 2016
  • Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.