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http://dx.doi.org/10.6117/kmeps.2016.23.3.043

Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test  

Park, Donghyun (Department of Materials Science and Engineering, Hongik University)
Oh, Tae Sung (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.23, no.3, 2016 , pp. 43-49 More about this Journal
Abstract
Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.
Keywords
Package-on-package; warpage; reliability;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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