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http://dx.doi.org/10.3795/KSME-A.2012.36.5.523

Moisture Diffusion Analysis for Bendable Electronic Module Under Autoclave Test Condition  

Han, Chang-Woon (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
Oh, Chul-Min (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
Hong, Won-Sik (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.36, no.5, 2012 , pp. 523-528 More about this Journal
Abstract
A bendable electronic module is developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In the module, a thin silicon chip is embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. A set of tests are conducted for the purpose of qualification: thermal shock, high temperature storage, and autoclave tests. During the autoclave test, delamination occurs at many places within the module layers. To investigate the failure mechanism, moisture diffusion analysis is conducted for the interior of the module under the autoclave test condition. For the analysis, the hygroscopic characteristics of the encapsulating materials are experimentally determined. Analysis results indicate the moisture saturation process in the interior of the module under the autoclave test condition.
Keywords
Bendable Electronic Module; Moisture Diffusion Analysis; Autoclave Test;
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