• Applied Chemistry for Engineering
• /
• v.32 no.2
• /
• pp.143-148
• /
• 2021

A thermally conductive 200 ㎛ thick polyimide-based film was made from a polyamic acid (PAA) precursor containing graphene prepared from graphite rod using an electrostatic discharge method in order to improve the thermal conductivity and expand the applicability of polyimide (PI) film. Properties of graphene produced by electrostatic discharge were measured by Raman spectroscopy, transmission electron microscopy and X-ray photoelectron spectroscopy (XPS). As a result of Raman spectrum and XPS analyses of as-prepared graphene, the ID/IG ratio was 0.138 and C/O value was 24.91 which are excellent structural and surface chemical properties. Moreover, thermal conductivities of polyimide films increased exponentially according to graphene contents but when the graphene content exceeded 40%, the polyimide film could not maintain its shape. The thermal conductivity of carbonized PI film made from PAA containing 40 wt% of graphene was 51 W/mK which is greatly enhanced from the pristine carbonized PI film (1.9 W/mK). This result could be originated from superior properties of graphene prepared from the electrostatic discharge method.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.05a
• /
• pp.74-78
• /
• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• Proceedings of the KIEE Conference
• /
• 2002.07c
• /
• pp.1997-1999
• /
• 2002

고분자 주쇄(Main chain)의 소수성을 가지는 플루오르 그룹을 배제시킨 습도 민감성 폴리이미드를 합성 및 이미드화 하였고, 이를 이용한 초고참도 습도 센서를 제작 및 측정하였다. 사용된 폴리이미드는 다이아민계로 Oxydianyline(ODA)와 다이안하이드라이드계로 Pyromellitic dianhydried(PMDA)를 유기용매 Dimethyla cetamide(DMAc) 하에서 폴리이미드 전구체 (Polyamic acid)를 합성하였으며, 진공 및 승온 조건에서 유기용매를 제거하여 이미드화(Imidization) 반응을 진행시켜 제조하였다. 본 습도 센서는 정전용량형 고감도 습도 센서로 디자인되었으며 실리콘 웨이퍼상에서 일반적인 반도체 공정을 이용하여 구현하였다. 본 습도 센서는 센서 크기와 유효면적, 감습층의 두께를 주요 변수로 설정하였으며 이에 따른 습도 민감성 효과를 평가 및 분석하였다. 측정 결과 유효면적 70%, 감습층 두께 $1.1{\mu}m$ 로 제작된 습도 센서는 상대숨도$20%{\sim}90%$ 영역에서 캐패시턴스와 선형적 상관관계를 보여주고 있으며, 습도 민감도는 3.9 pF/%RH 클 얻을 수 있었다.

• Journal of Adhesion and Interface
• /
• v.1 no.1
• /
• pp.38-46
• /
• 2000

A novel diamine monomer, containing fluorine and phosphine oxide, bis(3-aminophenyl) 3,5-bis(trifluoromethyl) phenyl phosphine oxide (mDA6FPPO), was prepared via Grignard reaction, and utilized to prepare polyimides with dianhydrides such as PMDA, 6FDA, BTDA or ODPA, by the conventional two-step route; preparation of poly(amic acid), followed by solution imidization. The polyimides were characterized by FT-lR, NMR, DSC and DMA, with intrinsic viscosity, and adhesive properties were also evaluated. A phosphine oxide containing monomer, bis(3-aminophenyl) phenyl phosphine oxide (mDAPPO) a nd a commercial 3,3'-diamino diphenyl sulfone (mDDS) were also used for comparison. The polyimides with mDA6FPPO exhibited high $T_g$, excellent solubility, and good adhesive properties.

• Polymer(Korea)
• /
• v.30 no.1
• /
• pp.56-63
• /
• 2006

We have synthesized two types of diamine monomers containing various chain length to prepare polyimides with layered structure. By using these diamines, homo-polyimides and co-polyimides having hydrophobic and hydrophilic segment of flexible side chain were synthesized. The segregated layered structures were formed by repulsive force with main chain as the side chains reach a critical length because the rigid main chains are packed into layered structure with the flexible side chains occupying the space between layers. As a result, the gallery space of each homo-polyimide was increased at spacing of $32.7\~48{\AA}\;or\;7\~10.5{\AA}$ as the increased hydrophobic or hydrophilic side chain length through X-ray diffraction. The gallery space of co-polyimides was also showed similar phenomenon by repulsive force of side chains with different properties. We have also confirmed that gallery space and molar volume were significantly depended on length of flexible side chain via molecular modeling.

• Polymer Science and Technology
• /
• v.24 no.1
• /
• pp.17-24
• /
• 2013

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.1277-1278
• /
• 2007

본 논문에서는 폴리이미드를 감습재로 한 정전용량형 습도 센서의 상용화 연구 결과를 보고한다. 유리 기판상에 제작된 용량형 습도센서는 감도 0.338pF%RH, 히스테리시스 1.7%.인 특성을 나타내었다.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.4
• /
• pp.9-14
• /
• 2022

Silica aerogel is a porous material with a very low density and high specific surface area. Still, its application is limited due to its weak mechanical properties due to structural features. To solve this problem, a method of complexing it with various polymers has been proposed. We synthesized polyimide cross-linked silica aerogel by the sol-gel process to obtain high mechanical properties. Tetraethyl orthosilicate (TEOS) was used as a precursor to make silica aerogel, and 3- aminopropyltriethoxysilane (APTES) was used as a coupling agent for cross-linking polyimide. Polyimide was synthesized using pyromellitic dianhydride and 3,5-diaminobenzoic acid, and mechanical properties were improved by crosslinking polyimide with 10 repeating units in the polyimide chain using the reaction formula ${\frac{n_1}{n_2}}={\frac{n}{n+1}}$ To realize silica aerogel, polyimide having various weight ratios was added before gelation, resulting in a 19-fold or greater increase in maximum compressive strength compared to pure silica aerogel. From this study, an enhancement of silica aerogel could be enhanced through polymer cross-linking bonds.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.1
• /
• pp.41-46
• /
• 2010

The interfacial adhesion strengths between screen-printed Ag film and epoxy resin-coated polyimide were evaluated by $180^{\circ}$ peel test method. Measured peel strength value was initially around $164.0{\pm}24.4J/m^2$, while the heat treatment during 24h at $120^{\circ}C$ increase peel strength up to $220.8{\pm}19.2J/m^2$. $85^{\circ}C/85%$ RH temperature/humidity treatment decrease peel strength to $84.1{\pm}50.8J/m^2$, which seems to be attributed to hydrolysis bonding reaction mechanism between metal and adhesive epoxy resin coating layer.

• Elastomers and Composites
• /
• v.43 no.2
• /
• pp.82-87
• /
• 2008

In this study, nine kinds of polyimides were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA), 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA), m-pheny lenediamine (m-PDA) and 4,4'-oxydianiline (ODA) by controlling molar ratio of monomers. Synthesized polyimides were used as insulator films for 2-layer Flexible Copper Clad Laminate(FCCL) which were manufactured by the casting method. Glass transition temperature and thermal degradation temperature for 5% weight loss of the polyimide film were improved by increasing contents of m-PDA and PMDA, respectively. Water absorption of polyimide film was reduced by increasing contents of ODA and BPADA which have relatively long structure, respectively. Peel strength of 2-layer FCCL was improved by increasing contents of ODA and BPADA.