Browse > Article

Interfacial Adhesion between Screen-Printed Ag and Epoxy Resin-Coated Polyimide  

Park, Sung-Cheol (School of Materials Science and Engineering, Andong National University)
Kim, Jae-Won (School of Materials Science and Engineering, Andong National University)
Kim, Ki-Hyun (Telecommunication R&D Center, Samsung Electronics)
Park, Se-Ho (Telecommunication R&D Center, Samsung Electronics)
Lee, Young-Min (Telecommunication R&D Center, Samsung Electronics)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 41-46 More about this Journal
Abstract
The interfacial adhesion strengths between screen-printed Ag film and epoxy resin-coated polyimide were evaluated by $180^{\circ}$ peel test method. Measured peel strength value was initially around $164.0{\pm}24.4J/m^2$, while the heat treatment during 24h at $120^{\circ}C$ increase peel strength up to $220.8{\pm}19.2J/m^2$. $85^{\circ}C/85%$ RH temperature/humidity treatment decrease peel strength to $84.1{\pm}50.8J/m^2$, which seems to be attributed to hydrolysis bonding reaction mechanism between metal and adhesive epoxy resin coating layer.
Keywords
Adhesion; Screen-printed Ag; polyimide; Thin film;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
연도 인용수 순위
1 W. Yu and T. M. Ko, "Surface Characterizations of Potassium- hydroxide-modified Upilex-S Polyimide at an Elevated Temperature", Eur. Polym. J., 37, 1791 (2001).   DOI   ScienceOn
2 S. C. Park, J. H. Lee, J. W. Lee, I. H. Lee, S. E. Lee, B. I. Song, Y. K. Chung and Y. B. Park, "Effect of $Ar^+$ RF Plasma Treatment Conditions on Interfacial Adhesion Energy Between Cu and ALD $Al_2O_3$ Thin Films for Embedded PCB Applications", J. Microelctron. Packag. Soc., 14(1), 61 (2007).   과학기술학회마을
3 H. D. Kang, H. J. Kim, J. H. Lee, D. H. Suh and Y. T. Hong, "Adhesion Properties between Polyimide Film and Copper by Ion Beam Treatment and Imidazole-Silane Compound", J. Adhesion & Interface, 8(1), 15 (2007).
4 A. E. Langroudi, A. A. Yousefi and K. Kabiri, "Effect of Silane Coupling Agent On Adhesion of Copper/ Glass Fabric / Epoxy Composites", Iran. polym. J., 12(3), 201 (2003).
5 Y. B. Park, I. S. Park and J. Yu, "Interfacial Fracture Energy Measurements in the Cu/Cr/polyimide System", Mater. Sci. Eng., A266, 261 (1999).
6 G. Jeong, B. Lee and S. Kim, "Improvement of Interfacial Adhesion of Copper-Epoxy Using Silane Primer", Kor. J. Mater. Res., 9(12), 1160 (1999).
7 K. J. Min, S. C. Park, J. J. Lee, K. H Lee, G. H. Lee and Y. B. Park, "Interfacial Adhesion between Electroless Plated Ni Film and Polyimide by Post-baking Treatment Conditions", J. Microelctron. Packag. Soc., 14(4), 49 (2007).   과학기술학회마을
8 K. J. Min, S. C. Park, J. J. Lee, K. H Lee, G. H. Lee and Y.B. Park, "Interfacial Fracture Energy between Electroless Plated Ni Film and Polyimide for Flexible PCB Applications", J. Microelctron. Packag. Soc., 14(1), 39 (2007).   과학기술학회마을
9 J. Y. Song and J. Yu, "Analysis of the T peel Strength in a Cu/Cr/Polyimide System", Acta Mater., 50, 3985 (2002).   DOI   ScienceOn
10 Y. B. Park and J. Yu, "Effects of Electroplated Cu Thickness and Polyimide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in Cu/Cr/polyimide System", Met. Mater. Int., 7, 123 (2001).   DOI
11 S. B. Koo and H. K. Lee, "A Study on Characteristics of Surface Modified Polyimide Film by Wet Process", J. Kor. Inst. Surf. Eng., 39, 166 (2006).   과학기술학회마을
12 Z. Wang, F. Akihiko, Y. Keiichirou, I. Hideo, B. Tomoyuki, H. Muneaki, T. Sotaro, S. Shoso, K. Hiroshi and O. Tadahiro, "Adhesion Improvement of Electroless Copper to a Polyimide Film Substrate by Combining Surface Microroughening and Imide Ring Cleavage", J. Adhesion Sci. Technol., 16, 1027 (2002).   DOI   ScienceOn
13 J. Kim, K. S. Kim and Y. Kim, "Mechanical Effects in Peel Adhesion Test", J. Adhesion Sci. Technol., 3, 175 (1989).   DOI
14 E. P. Plueddemann, Silane Coupling Agents, pp 120-124 , Plenum Press, New York (1982).
15 E. M. Petrie, Metalfinishing, 105(7-8), 85 (2007).
16 J. W. Lee, Y. H Lee and H. N. Yoon, "Development of Printable Transparent Electrode and Line Electrode Materials" Polym. Sci. & Technol., 18, 3, 233 (2007).