• Resources Recycling
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• v.25 no.2
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• pp.42-48
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• 2016

Although the generation of waste flat panel displays in Korea is expected to exceed one million sets in 2016, a comprehensive recycling technology has not yet been developed for effective recovery of valuable materials from the wastes, rendering to outshine the national prestige as a global leader in display industries. The overall aim of this study was to analyze the statistical data of various valuable materials and their ratio after dismantling 40-inch and 42-inch sized waste LCDs. The analysis results showed that plastic portion of the wastes was about 22% and the portion of PCB (Print Circuit Board) part was about 9% by weight whereas panel part was about 34% and leftovers including metals totalled about 35% by weight. Based on the analytical results, a higher value recycling process could be proposed with advanced material separation techniques.

• Resources Recycling
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• v.22 no.2
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• pp.29-36
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• 2013

Although Korean domestic production of flat panel displays totalled more than 48 trillion KRW in 2007, most of the flat panel display wastes have been land-filled or incinerated, which greatly overshadows Korean national prestige as a world leading producer and developer of flat panel display devices. Countries such as Japan or EU possess quite limited land-fill capability and have sought ways to dispose of WEEEs from environment-friendly perspective rather than recovery of valuable materials from the wastes. Considering relatively short cycle of about 5 years for flat panel display devices, it is estimated that more than 5 million units will be accumulated as wastes by 2015. Urban mining is a most suitable countermeasures against China's monopoly of rare and rare earth metals, which are contained in flat panel display wastes. Therefore, materials recycling of waste LCD units has to be developed and commercialized soon enough for economic and environment-friendly recovery of valuable resources hidden in LCD wastes.

• Resources Recycling
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• v.24 no.1
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• pp.58-65
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• 2015

Although Korea is a top market sharing and world leading producer and developer of flat panel display devices, relevant recycling technology is not up to her prestigious status. Besides, most of the waste glass arising from flat panel displays is currently land-filled. The present paper mainly reviews on development of recycling systems for waste TFT-LCD glass from end-of-life LCD TVs and monitors and TFT-LCD process waste of crushed glass particles with target end uses of raw material for high strength concrete pile and glass fibers, respectively. Waste LCD glass was recycled to fabricate ingredients for high strength concrete piles with enhanced physical properties and spherical foam products. The waste LCD glass recycling technology is already developed to fabricate long and short fibers at commercial level. In view of these, future R & D on waste LCD glass materials is to be directed toward implementation of commercial materials recycling system therefrom.

• Resources Recycling
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• v.21 no.3
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• pp.65-73
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• 2012

There are several kinds of displays such as liquid crystal display (LCD), cathode ray tube (CRT), plasma display panel(PDP), light emitting diode (LED), organic light emitting diode (OLED), etc. Nowadays, recycling technologies of waste displays have been widely studied from economy and efficiency points of view. In this paper, patents and literature on the recycling technologies of the waste displays have been comprehensively analyzed. The search was limited to the open patents of USA (US), European Union (EU), Japan (JP), and Korea (KR) and SCI journals published from 1980 to 2011. Patents and journals were systematically compiled and collected using key-words search and filtered by pre-set filtering criteria. The trends of the patents and journals were thus analyzed according to the years, countries, companies, and technologies.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.213-216
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• 2004

폐슬러지 실리콘과 흑연의 혼합물에 물을 주입하고 열처리하여, 마이크론 크기의 이산화 실리콘 구형입자를 제조하였다. 제조된 이산화 실리콘의 직경은 균일하고 약 $1.7\mu\textrm{m}$이다. 탄화 실리콘이 이산화 실리콘 구형입자와 함께 존재하였으며, 그 모양은 휘스커와 다면체였다. 폐슬러지 실리콘과 탄소의 혼합물을 고온에서 열처리하면 일산화 실리콘 기체가 생성된다. 물이 산소의 공급원으로 주입되면 일산화 실리콘 기체는 산소와 반응하여 이산화 실리콘 고체가 형성될 수 있다. 실리콘 공급원으로 일산화 실리콘이 반응기 내에 균일하게 분포하고 물을 주입하여 이산화 실리콘이 형성되는 메커니즘은 액상에서 수산화 실리콘 구형입자를 형성하는 메커니즘과 유사하다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.18-19
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• 2002

Si 웨이퍼제조 시 나오는 페슬러지에서 SiC 연마재와 절삭유를 분리해내면 Si 분말을 얻을 수 있다. 본 연구에서의 SiC는 폐슬러지 Si 분말에 C 분말을 혼합하여 제조할 수 있다. Si-C-O 3성분계는 Si, $SiO_2$, SiC, C 4개의 응축상과 CO, SiO, $CO_2$, $O_2$ 4개의 기체상이 가능하고 생성물들 간의 평형관계를 깁스 자유에너지에 의해 평형 반응식이 계산되어질 수 있다. 계산된 평형 반응식은 2개의 SiO, CO 분압이 각각 X, Y 좌표평면에 나타나는 상안정도를 그려볼 수 있다. 상안정도에서 자유도가 2인 경우는, $SiO_2$가 불안정하므로 SiC와 C가 공존하는 영역에서 온도를 독립 변수로 놓으면 나머지 독립 변수는 SiO 나 CO 기체 분압 둘 중 하나가 되어 하나의 직선으로 나타낼 수 있다. 직선을 경계로 각 응축상들의 안정영역을 하나의 좌표평면에 나타낸 후 온도에 따른 SiC의 안정영역을 알아본다.

• Applied Chemistry for Engineering
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• v.26 no.4
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• pp.389-393
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• 2015

Recovery of indium from secondary sources have been attracting over years not only because of increasing demand together with development of flat panel display industry but also industrial criticality of indium. Applied technology to recover indium for recycling of end-of-life FPD devices can be broadly divided into three major steps, disassembly or dismantling, enrichment or upgrading, and refining or purification. In addition, advanced technology such as zone-refining can be employed for ultra-high purity products. In this mini-review, we present currently applied technologies for recovery of indium and the outlook for total recycling of FDP devices.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.1
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• pp.179-184
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• 2014

The discharge characteristics of an open dielectric structure were investigated, especially such as a firing voltage and related wall voltage, compared with conventional panel structure based on the Vt close curve measurement in AC plasma display panel. While the front panel of the conventional structure in AC plasma display panel was composed of the glass, electrodes, and dielectric, the open dielectric structure could easily produce the discharge between the scan and the sustain electrodes by erasing the dielectric layer between two electrodes. As the open dielectric structure differ from the conventional structure, various problems were produced when driving with the conventional driving waveform. Especially, due to the changes in the discharge firing characteristics of the open dielectric structure between the scan and the sustain electrodes on the front panel, the conventional reset waveform including the address waveform needed to be modified. In this study, the Vt close curves were measured to compare the discharge firing voltages on three electrodes in the conventional and open dielectric structure and based on the Vt close curve analysis, the modified driving waveform suitable for the open dielectric structure was proposed.

• Journal of the Semiconductor & Display Technology
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• v.2 no.1
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• pp.21-24
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• 2003

Sludged silicon powders that are generated during silicon ingot slicing process have potential usage as silicon source in fabricating silicon carbide powders by adding carbon. A thermodynamic calculation is performed to consider a plausible formation condition for the silicon carbide powders. A thin silicon oxide layer around silicon powder is sufficient to supply equilibrium oxygen partial pressure at the formation temperature($1400^{\circ}C$) of the silicon carbide in the Si-C-O ternary system. Formation of silicon carbide by using the sludged silicon powders is more efficient than by using silicon oxide powders.

• Resources Recycling
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• v.23 no.2
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• pp.61-70
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• 2014

LCD televisions and monitors use cold cathode fluorescence lamps (CCFLs) to illuminate the screen. Most CCFLs contain mercury and they have to be carefully handled at the end of their lives as per minimum treatment standards under the Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) directives. CCFLs were carefully separated from mold frames of waste LCD units for primary decontamination of mercury/fluorescent compound mixture using CCFL decontamination system designed and fabricated in the present research. Residual mercury was further removed by employing a pyro-process, where crushed CCFL tubes transferred from primary decontamination process were subject to heat treatment at $550^{\circ}C$ in a box furnace: more than 99% of mercury was removable from waste CCFLs.