• Food Industry
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• s.12
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• pp.33-36
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• 1973

• The monthly packaging world
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• s.44
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• pp.146-149
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• 1996

• The monthly packaging world
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• s.134
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• pp.102-103
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• 2004

• The KIPS Transactions:PartD
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• v.10D no.5
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• pp.821-828
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• 2003

Package software should have the feature that enables purchasers to discriminate a product suitable for them among a number of software belonging to the similar kind of product. Purchaser's ability to choose a package software depends on whether they can judge that a package software conforms to the relevant standard through an objective quality test process and method or not. There are the standards that can be applicable to the quality evaluation of package software, such as and . This study developed a system with which purchasers can effectively select a package software suitable for their needs, building quality test process for package software and developing test metric and application method.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of Digital Convergence
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• v.18 no.5
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• pp.473-484
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• 2020

The purpose of the research is to propose ways to activate package tours through active promotion by verifying the motives and constraints pursued by customers of package tours, highlighting the advantages of content development and package tours that are revived in their needs. This study verified empirical analysis using SPSS 25.0 for 481 adults aged 19 or older who experienced package tours. The results of the research analysis are as follows. First, the daily escape, external activities, and service appeal of the tourist motivation were all verified with a positive impact on attitude. Second, it was found that the inherent constraints of tourism constraints had a negative effect on the relationship with attitudes, but the structural constraints were not significantly affected. Third, attitudes have shown to have a positive effect on satisfaction. Based on these results, I have described what factors tourists feel important when participating in package tour products, and hope that The factors will be useful in exploring the development of customized products required by tourists. It will need to be expanded to realistic comparative studies needed to revitalize package tours in the future.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.8
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• pp.19-26
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• 2004

High performance packages must provide excellent transmission characteristics. In face-up ceramic packages, however, parasitic characteristics of bondwires are not negligible at millimeter-wave frequencies. Consequently, the electrical performance of ceramic packages is degraded. In をis paper, we propose a new millimeter-wave ceramic package feed-through having Embedded Metal Sheets (EMS). The package that contains double-bondwire interconnections is analyzed by the FEM (Finite Element Method) and measured from 20 to 50GHz. As a result, the proposed package having Embedded Metal Sheets (EMS) achieved 0.85dB, 0.4dB insertion loss improvement on the conventional and the double bondwires buried in epoxy ( $\varepsilon_{{\gamma}}$/ = 4) ceramic package respectively to 47GHz. This improved ceramic package will be useful for MMICs modules and small ceramic packages developments.amic packages developments.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.63-69
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• 2013

The warpage of a bottom package of Package on Package(PoP) where a chip was mounted to a substrate by flip chip process was compared to that of a bottom package for which a chip was bonded to a substrate using die attach film(DAF). At the solder reflow temperature of $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpages of $57{\mu}m$ and $-102{\mu}m$, respectively. At the temperature range between room temperature and $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpage values ranging from $-27{\mu}m$ to $60{\mu}m$ and from $-50{\mu}m$ to $-15{\mu}m$, respectively.

• Journal of Digital Convergence
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• v.18 no.9
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• pp.343-349
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• 2020

This study is cases study of sustainable eco-friendly cosmetics packages. The importance of eco-friendly packages has been increasing as environmental issues have recently emerged around the world. Domestic cosmetics industry are releasing sustainable package designs with these changes, but they are limited. In this study, sustainable package criteria were divided and analyzed based on each of the five prior studies of domestic and foreign cases. Studies have confirmed that there is no diversity in the materials and designs of sustainable packages in Korea compared with other countries. Also, it could be seen that there was the lack of consumer-led eco-friendly campaigns. Starting point of research, it is expected that this study may help continue to study better sustainable cosmetics packages in the future.

• The KIPS Transactions:PartD
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• v.9D no.4
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• pp.629-638
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• 2002

As the application area of software grows bigger and the importance of software quality increases, software quality evaluation method is also getting a lot of attention. To evaluate the software quality properly, we need an objective and concrete evaluation mechanism. In general, practitioners customize the international standards to their own needs for this purpose. Package software documents plat an important role in software quality evaluation because it provides the information that helps customers use the software effectively and conveniently. h great deal of efforts has been made in terms of international standards for documentation and documentation process. However, those international standards are too abstract to be applied directly to domestic software packages. In this paper, we developed a guidelines and checklists for writing and evaluating package software documents. Our research basically followed ISO 12119, ISO 9127 and some related research results. Also we proved the effectiveness of this research through actual tests with package softwares.