• Journal of the Korean Society for information Management
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• v.30 no.1
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• pp.51-69
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• 2013

It was difficult for user to identify e-books due to some problems such as duplicable bibliographic records and inconsistent descriptive cataloging when cataloging the bibliographic records of the e-book packages in OPAC. Therefore, the purpose of this study was to find the applicable methods of the provider neutral e-book(e-monograph) MARC record guideline for the standardization of the bibliographic records of the provider supplied e-book package. Through the literature reviews and homepage analysis of 15 university libraries in domestic, the theoretical background on cataloging e-book, the descriptive cataloging of e-book, the provider-neutral e-monograph MARC record guideline as new standard for e-book, and the libraries practices of cataloging bibliographic records of the e-book package were inquired. Based on these analysis, it was to suggest applicable methods of provider neutral e-book(e-monograph) MARC record guideline for the standardization of the bibliographic records of domestic e-book packages in aspect of cataloging rule, KORMARC, and neutral bibliographic records. This study will contribute to build FRBRization of the e-books in OPAC as finding the guideline for the standardization of the bibliographic records of the e-book packages for both providers and libraries.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.3
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• pp.271-277
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• 2004

A Si(Silicon) MEMS(Micro Electro Mechanical System) package using a doped lossy Si carrier for CPW(Coplanar Waveguide) MMICs(Microwave and Millimeter-wave Integrated Circuits) is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed chip-carrier scheme is verified by fabricating and measuring a GaAs CPW on the two types of carriers(conductor-back metal, doped lossy Si) in the frequency from 0.5 to 40 ㎓. The proposed MEMS package using the lightly doped lossy(15 Ω$.$cm) Si chip-carrier and the HRS(High Resistivity Silicon, 15 ㏀$.$cm) shows the optimized loss and parasitic problems-free since the doped lossy Si-carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss of only - 2.0 ㏈ and a power loss of - 7.5 ㏈ at 40 ㎓.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.10
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• pp.1005-1009
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• 2017

In this study, the shock resistance of a gas turbine package subjected to a shock load caused by non-contact underwater explosion was investigated using numerical analysis. To perform shock analysis, the time-history shock load was calculated according to BV-043 (German Navy Regulation). The direct transient response analysis in the time domain for the simplified Whole Engine Model (WEM) was performed using the calculated shock load. In addition, the structural integrity of a detailed model was evaluated by considering the shock load transferred to each component. As a result, it was confirmed that the safety factor was at least 1.0 as compared with the reference stress. Finally, the structural and functional integrity of the Engine Management System (EMS) of the gas turbine package was verified through an actual shock test.

• The Journal of the Korea Contents Association
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• v.16 no.1
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• pp.42-51
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• 2016

For changes in the distribution structure these days, consumer demand is moving rapidly from offline to online. The consumers' mentality to purchase products conveniently is reflected in this phenomenon. Also for agricultural products, safety to protect contents, brand and design which can provide credibility to consumers are recognized as most important than ever. Especially, strawberry is thin-skinned so that the quality of product may deteriorate even with weak impact and shaking, so it is significantly influenced by the structural packaging or material. Also, strawberry is frequently distributed through direct trading, it is the reality that the package design of strawberry is less competitive than that of other products due to inadequate environments of commercial farms. That is, the demand of strawberry increases everyday but the strawberry package cannot fulfill the needs of producers and consumers. In order to reinforce competitiveness in strawberry sales, it is urgent to carry out fundamental studies regarding the development of package. Therefore, the purpose of this study is to supplement and improve issues arising from the usage of current strawberry package. Through the analysis of strawberry package elements (shape, material, design) and understand the points of improvement sought by producers and consumers through IPA MAP (importance, satisfaction level) analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.6
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• pp.443-453
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• 2017

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

• Journal of Digital Convergence
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• v.15 no.9
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• pp.479-486
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• 2017

The purpose of this study is to analyze the preference and value of consumers through the package design of cosmetics with the concept of cause branding, and to propose a package design that can satisfy consumers' needs. I have recruited an experimental group that emphasizes the importance of package design in purchasing cosmetics. And Survey and in-depth interviews were conducted by comparing cause brand's product with general brand's product. In the first experiment, the items were classified into cognitive, emotional, and behavioral responses and a total of 31 subjects were surveyed. In the second experiment, six interviewees were interviewed through a questionnaire prepared by extracting 4 items from Sheth 's consumption value standard. As a result of the experiment, consumers preferred a design that can quickly and accurately grasp the information of the product. Especially, it is not easy to know whether it is a cause brand's product. So It should be stated in the package how it will be socially beneficial.

• Journal of the Korea Convergence Society
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• v.10 no.7
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• pp.115-120
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• 2019

This study is aimed at giving directions for the development of fresh food delivery packaging design in the domestic e-commerce market. First literature study of food consumption trend, cold chain system and zero waste campaign related to e-commerce food market. Second, packaging designs of e-commerce fresh food in domestic and foreign were analyzed and also the prospective studies were checked to find out the future direction of packaging designs. Studies show that the packaging design of delivery for fresh food should not only be kept freshness, also consider the usefulness, convenience and environmental protection from various angles.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.63-67
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• 2021

In order to detect fires that may not be visible to the naked eye, an IoT module that uses changes in Carbon dioxide (CO₂) levels and temperature to effectively identify ambers (dying flames) was developed. Finite element analysis was then used to optimize the packaging for this module. Given the nature of ambers, the low power long range LoRa (Long Range) technology was used in the development of this module. To protect the module, a number of packages were designed, and comparative analysis performed on the stress generated when they fall. The results of which show that Model C showed the lowest stress. In addition, unlike other models in which stress concentration was predicted in the module mounting part of the package, in this model the stress concentration phenomenon was predicted in the wing part. It was therefore determined that this approach is ideal for protecting the internal module, and a package to which this was applied was manufactured.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.