1 |
S. Kang, H. Choi, S. Park, C. Park, J. Lee, U. Lee, and S. J. Lee, "Fire in Your Hands: Understanding Thermal Behavior of Smartphones", The 25th Annu. Int. Conf. on Mobile Computing and Networking (MobiCom), Aug., 13, 1 (2019).
|
2 |
K. H. Kim, H. Lee, J. W. Jeong, J. H. Kim, and S. H. Choa, "Numerical Analysis of Warpage and Stress for 4-layer Stacked FBGA Package", J. Microelectron. Packag. Soc., 19(2), 7 (2012).
DOI
|
3 |
H. G. Yang and J. W. Joo, "Measurement and Evaluation of Thermal Expansion Coefficient for Warpage Analysis of Package Substrate", Trans. Korean Soc. Mech. Eng. A, 38(10), 1049 (2014).
DOI
|
4 |
D. H. Park, D. M. Jung, and T. S. Oh, "Warpage Characteristics Analysis for Top Packages of Thin Package-on-Packages with Progress of Their Process Steps", J. Microelectron. Packag. Soc., 21(2), 65 (2014).
DOI
|
5 |
N. Jiang, L. Zhang, Z. Q. Liu, L. Sun, W. M. Long, P. He, M. Y. Xiong, and M. Zhao, "Reliability issues of lead-free solder joints in electronic devices", Sci. Technol. Adv. Mat., 20(1), 876 (2019).
DOI
|
6 |
M. Mustafa, J. C. Suhling, and P. Lall, "Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging", Microelectron Reliab., 56, 136 (2016).
DOI
|
7 |
M. C. Hsieh, C. C. Lee, and L. C. Hung, "Comprehensive Thermo-Mechanical Stress Analyses and Underfill Selection of Large Die Flip Chip BGA", IEEE Trans. Compon. Packag. Manuf. Technol., 3(7), 1155 (2013).
DOI
|
8 |
Y. Song, S. B. Lee, S. H. Jeon, B. S. Yim, H. S. Chung, and J. M. Kim, "Underfill Flow Characteristics for Flip-Chip Packaging", J. Microelectron. Packag. Soc., 16(3), 39 (2009).
|
9 |
J. M. Kim, D. F. Farson, and Y. E. Shin, "Improvement of Board Level Reliability for Solder Joints Using Underfill", Mat. Trans., 44(10), 2175 (2003).
DOI
|
10 |
B. V. Chheda, S. M. Ramkumar, and R. Ghaffarian, "Thermal Shock and Drop Test Performance of Lead-Free Assemblies with No-Underfill, Corner-Underfill and Full-Underfill", Proc. 60th Electronic Components and Technology Conference (ECTC), 935 (2010).
|
11 |
B. I. Noh, J. W. Yoon, S. O. Ha, and S. B. Jung, "Effects of Different Kinds of Underfills and Temperature-Humidity Treatments on Drop Reliability of Board-Level Packages", J. Electron. Mater., 40(2), 224 (2011).
DOI
|