• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of Digital Convergence
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• v.18 no.5
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• pp.473-484
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• 2020

The purpose of the research is to propose ways to activate package tours through active promotion by verifying the motives and constraints pursued by customers of package tours, highlighting the advantages of content development and package tours that are revived in their needs. This study verified empirical analysis using SPSS 25.0 for 481 adults aged 19 or older who experienced package tours. The results of the research analysis are as follows. First, the daily escape, external activities, and service appeal of the tourist motivation were all verified with a positive impact on attitude. Second, it was found that the inherent constraints of tourism constraints had a negative effect on the relationship with attitudes, but the structural constraints were not significantly affected. Third, attitudes have shown to have a positive effect on satisfaction. Based on these results, I have described what factors tourists feel important when participating in package tour products, and hope that The factors will be useful in exploring the development of customized products required by tourists. It will need to be expanded to realistic comparative studies needed to revitalize package tours in the future.

• Journal of the Korean Data and Information Science Society
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• v.25 no.5
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• pp.1039-1055
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• 2014

The distribution of a test statistic under a null hypothesis depends on the unknown distribution of the data and thus is unknown as well. Conditional tests replace the unknown null distribution by the conditional null distribution, that is, the distribution of the test statistic given the observed data. This approach is known as permutation tests and was developed by Fisher (Fisher, 1935). Theoretical framework for permutation tests was given by Strasser and Weber(1999). The coin package developed by Hothon et al. (2006, 2008) implements a unified approach for conditional inference via the generic independence test. Because convenient functions for the most prominent problems are available, users will not have to use the extremely flexible procedure. In this article we briefly review the underlying theory from Strasser and Weber (1999) and explain how to transform the data to perform the generic function independence test. Finally it was illustrated with a few real data sets.

• The Journal of the Korea Contents Association
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• v.7 no.3
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• pp.17-24
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• 2007

SIP-based tightly coupled conference, which has a centrally located conference server for controlling and management, can be classified several models according to location of focus and mixer. These are centralized server model, endpoint server model, media server component model and distributed mixing model. However each model has its strength and weakness. In this paper, we propose and implement a SIP-based effective hybrid-type conference model which decreases amount of SIP signaling messages, lowers load of server media mixer, and can be easily expandable to large scale conference. In this model, when the number of participants exceeds a pre-defined limit, the conference server selects some participants which posses specific functions and let them share functions of notifications of conference state event package and media mixing. When each participant subscribes conference state event package to the server, it can indicates its possession of such functions by a specific header message. The server stores the indication to the conference information database, and later uses it to select participants for load sharing. The performance of our proposed model is evaluated by experiments.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.2
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• pp.55-67
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• 2003

본 고에서는 차세대 무선통신용 초소형 단말기 구현에서 RF 시스템의 성능 개선에 크게 기여하게 될 RF 집적형 안테나 기술 현황과 향후 발전 방향이 제시된다. 고성능을 유지하면서 초소형 RF 전치단을 실현하기 위한 능동소자와 안테나가 결합하여 복합 기능을 하는 능동 집적 안테나(AIA, Active Integrated Antenna) 기술 현황, RF 시스템 단일 패키지(RF-SOP, System On Package) 형태에 집적 가능한 안테나 및 미래의 꿈인 RF 시스템 단일 칩 (RF-SOC, System On Chip)을 향한 단일 칩 안테나 (AOC, antenna on chip) 기술 동향 등이 기술된다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.10
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• pp.31-39
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• 2004

This paper illustrates the noise characteristics under chip's core operations according to types of packages and modules for DDR DRAM For analyzing this, the impedance profiles and power noises are analyzed with DRAM chips having commercial TSOP package and commercial FBGA package on TSOP-based DIMM and FBGA-based DIMH In controversy with common concepts, we find that the noise-isolation characteristics of FBGA package are more weak and sensitive on transferred noises than those of the TSOP package. In addition, the simulated results show that the decoupling capacitor locations of modules are more important to control the self and transfer noise characteristics than the lead inductance of the packages. Therefore, satisfying the target spec of the noise suppression and isolation can be achieved through the design of power distribution systems only with considering not only the package types but also the whole module system.

• The monthly packaging world
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• s.274
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• pp.90-94
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• 2016

• The monthly packaging world
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• s.320
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• pp.70-83
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• 2019

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.6
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• pp.518-523
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• 2003

The purpose of this study was to reduce the noise emitted from the package air-conditioner. The optimum design methods of the fans ware investigated experimentally through the analysis of noise problem caused by the conventional PAC system. New PAC system had decreased 6 dBA in overall noise level as compared with the conventional system by various technology.

• Proceedings of the KAIS Fall Conference
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• 2002.05a
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• pp.160-162
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• 2002

본 논문은 LCD구동 IC 패키지 제조 분야에서 사용되는 TAB IC블랭킹 금형에 대해 신속하고 합리적인 설계를 수행하기 위하여 금형설계와 관련된 다년간 축적된 경험적지식과 설계지식을 전산정보화하여 지식베이스를 구축하였고, 설계에 필요한 TAP IC 패키지의 형상정보를 제공받기 위하여 표준적인 특징형상 입력모듈을 제안하였다. 또한 지식베이스를 통해 산출된 설계 결과를 3차원 모델러와 연계하여 3차원 형상생성 및 가공도면의 자동화를 실현하여, 기존의 TAB If 블랭킹 금형설계자 뿐만 아니라 신입설계자도 바로 실무에 적용할 수 있는 시스템으로 발전시키고자 한다.