• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.7
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• pp.1303-1310
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• 2016

In this paper, electrocardiogram (ECG) analog front end with supply voltage of 0.5V has been designed and verified by measurements of fabricated chip. ECG is composed of instrument amplifier, 6th order gm-C low pass filter and variable gain amplifier. The instrument amplifier is designed to have gain of 34.8dB and the 6th order gm-C low pass filter is designed to obtain the cutoff frequency of 400Hz. The operational transconductance amplifier of the low pass filter utilizes body-driven differential input stage for low voltage operation. The variable gain amplifier is designed to have gain of 6.1~26.4dB. The electrocardiogram analog front end are fabricated in TSMC $0.18{\mu}m$ CMOS process with chip size of $858{\mu}m{\times}580{\mu}m$. Measurements of the fabricated chip is done not to saturate the gain of ECG by changing the external resistor and measured gain of 28.7dB and cutoff frequency of 0.5 - 630Hz are obtained using the supply voltage of 0.5V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.27-35
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• 2008

This work proposes a 14b 150MS/s 0.13um CMOS ADC for SDR systems requiring simultaneously high resolution, low power, and small size at high speed. The proposed ADC employs a calibration-free four-step pipeline architecture optimizing the scaling factor for the input trans-conductance of amplifiers and the sampling capacitance in each stage to minimize thermal noise effects and power consumption at the target resolution and sampling rate. A signal- insensitive 3-D fully symmetric layout achieves a 14b level resolution by reducing a capacitor mismatch of three MDACs. The proposed supply- and temperature- insensitive current and voltage references with on-chip RC filters minimizing the effect of switching noise are implemented with off-chip C filters. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates a measured DNL and INL within 0.81LSB and 2.83LSB, at 14b, respectively. The ADC shows a maximum SNDR of 64dB and 61dB and a maximum SFDR of 71dB and 70dB at 120MS/s and 150MS/s, respectively. The ADC with an active die area of $2.0mm^2$ consumes 140mW at 150MS/s and 1.2V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.3
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• pp.34-41
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• 2011

This paper presents a wide tuning range, fine-resolution DCO (Digitally Controlled Oscillator) with an active inductor. In order to control the frequency of the DCO, the transconductance of the active inductor is tuned digitally. In addition, the DCO gain needs to be calibrated digitally to compensate for gain variations. To cover the wide tuning range, an automatic three-step coarse tuning scheme is proposed. The DCO total frequency tuning range is 1.4 GHz (2.1 GHz to 3.5 GHz), it is 58 % at 2.4 GHz. An effective frequency resolution is 0.14 kHz/LSB. The proposed DCO is implemented in 0.13 ${\mu}m$ CMOS process. The total power consumption is 6.6 mW from a 1.2 V supply voltage. The phase noise of the DCO output at 2.4 GHz is -120.67 dBc/Hz at 1 MHz offset.

• Journal of IKEEE
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• v.11 no.4
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• pp.152-157
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• 2007

AlGaN/GaN high electron mobility transistors (HEMTs) were fabricated and the effect of ${N_2}O$ plasma on the electrical characteristics of the devices was investigated. The HEMT exposed to ${N_2}O$ plasma formed by 40 W of RF power in a chamber with pressure of 20 mTorr at a temperature of $200^{\circ}C$, exhibited a reduction of gate leakage current from 246 nA to 1.2 pA by 10 seconds treatment. The current between the two isolated active regions reduced from 3 uA to 7 nA and the sheet resistance of the active layer was lowered also. The variations of electrical characteristics for HEMT were occurred within a short time expose of 10 seconds and the successive expose did not influence on the improvements of gate leakage characteristics and conductivity of the active region. The reduced leakage current level was not varied by successive $SiO_2$ deposition and its removal. The transconductnace and drain current of AlGaN/GaN HEMTs were increased also by the expose to the ${N_2}O$ plasma.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.77-85
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• 2008

This work proposes a 12b 130MS/s 108mW $1.8mm^2$ 0.18um CMOS ADC for high-quality video systems such as TFT-LCD displays and digital TVs requiring simultaneously high resolution, low power, and small size at high speed. The proposed ADC optimizes power consumption and chip area at the target resolution and sampling rate based on a three-step pipeline architecture. The input SHA with gate-bootstrapped sampling switches and a properly controlled trans-conductance ratio of two amplifier stages achieves a high gain and phase margin for 12b input accuracy at the Nyquist frequency. A signal-insensitive 3D-fully symmetric layout reduces a capacitor and device mismatch of two MDACs. The proposed supply- and temperature- insensitive current and voltage references are implemented on chip with a small number of transistors. The prototype ADC in a 0.18um 1P6M CMOS technology demonstrates a measured DNL and INL within 0.69LSB and 2.12LSB, respectively. The ADC shows a maximum SNDR of 53dB and 51dB and a maximum SFDR of 68dB and 66dB at 120MS/s and 130MS/s, respectively. The ADC with an active die area of $1.8mm^2$ consumes 108mW at 130MS/s and 1.8V.

• Journal of IKEEE
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• v.17 no.1
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• pp.71-76
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• 2013

AlGaN/GaN HEMTs (High electron mobility transistors) with narrow channel were fabricated and the effect of channel scaling on the device were investigated. The devices were fabricated using e-beam lithography to have same channel length of $1{\mu}m$ and various channel width from 0.5 to $9{\mu}m$. The sheet resistance of the channel was increased corresponding to the decrease of channel width and the increase was larger at the width of sub-${\mu}m$. The threshold voltage of the HEMT with $1.6{\mu}m$ and $9{\mu}m$ channel width was -2.85 V. The transistor showed a variation of 50 mV at the width of $0.9{\mu}m$ and the variation 350 mV at $0.5{\mu}m$. The transconductance of 250 mS/mm was decreased to 150 mS/mm corresponding to the decrease of channel width. Also, the gate leakage current of the HEMT decreased with channel width. But the degree of was reduced at the width of sub-${\mu}m$. It was thought that the variation of the electrical characteristics of the HEMT corresponding to the channel width came from the reduced Piezoelectric field of the AlGaN/GaN structure by the strain relief.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.2
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• pp.345-352
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• 2017

In this paper, a unified potentiostat which can measure the current of both $O_2$-based and $H_2O_2$-based blood glucose sensors with low supply voltage of 1.0V has been designed and verified by simulations and measurements. Potentiostat is composed of low-voltage operational transconductance amplifier, cascode current mirrors and mode-selection circuits. It can measure currents of blood glucose chemical reactions occurred by $O_2$ or $H_2O_2$. The body of PMOS input differentional stage of the operational transconductance amplifier is forward-biased to reduce the threshold voltage for low supply voltage operation. Also, cascode current mirror is used to reduce current measurement error generated by channel length modulation effects. The proposed low-voltage potentiostat is designed and simulated using Cadence SPECTRE and fabricated in Magnachip 0.18um CMOS technology with chip size of $110{\mu}m{\times}60{\mu}m$. The measurement results show that consumption current is maximum $46{\mu}A$ at supply voltage of 1.0V. Using the persian potassium($K_3Fe(CN)_6$) equivalent to glucose, the operation of the fabricated potentiostat was confirmed.

• Journal of IKEEE
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• v.15 no.1
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• pp.57-63
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• 2011

This paper presents a tunable band pass filter (BPF) for multi bio-signal detection. The bandwidth can be controlled by the bias current of transconductance (gm), while conventional BPF exploited switchable capacitor array for band selection. With this design technique, the die area of proposed BPF reduced to at least one tenth the area of conventional design. The simulation results show the high cut-off frequency tuning range of from 100Hz to 1Khz. The circuit was implemented with a 0.18um CMOS standard technology. Total current consumption is 1uA at the supply voltage of 1V with sub-threshold design technique.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.214-219
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• 2011

This paper presents a multi-band low noise amplifier(LNA) with switching operation for 2.4, 3.5 and 5.2 GHz bands using CMOS 0.18 um technology. The proposed circuit uses switching transistors to achieve the input and output matching for multi-band. By using the switching transistors, we can adjust the transconductance, gate inductance and gatesource capacitance at input stage and total output capacitance at output stage. The proposed LNA exhibits gain of 14.2, 12 and 11 dB and noise figure(NF) of 3, 2.9 and 2.8 dB for 2.4, 3.5 and 5.2 GHz, respectively.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.50-52
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• 2006

본 논문은 고성능 다결정 실리콘(Poly-Si) 박막 트랜지스터 (Thin Film Transistor)에서 단일 수직 그레인 경계(Single Perpendlcular Grain Boundary)가 고온 캐리어 스트레스(Hot Carrier Stress) 및 정전류 안정성 평가에서 어떠한 효과를 보이는가에 대해서 살펴보았다. 고온 캐리어 스트레스 하에서($V_G=V_{TH}+1V,\;V_D$ =12V),그레이 경계가 없는 다결정 실리콘 TFT와 비교했을 때 그레인 경계를 가지고 있는 다결정 실리를 TFT는 전기 전도(Electric Conduction)에 작용하는 자유 캐리어(Free Carrier)의 개수가 적기 때문에 상대적으로 더욱 우수한 전기적 특성을 나타낸다. 먼저 1000초 동안 고온 캐리어 스트레스를 가해준 결과 단일 그레인 경계를 가진 다결정 실리콘에서의 트랜스 컨덕턴스(Transconductance)의 이동 정도는 5% 미만으로 확인되었다. 반면에 같은 스트레스 조건 하에서 그레인 경계가 존재하지 않는 다결정 실리콘의 경우에는 그 이동 정도가 약 25%에 달하는 것으로 측정되었다. 다음으로 정전류 스트레스(Constant Current Stress) 인가시, 수직형 그레인 경계가 채널 영역 내에 존재하지 않는 다결정 실리콘 TFT는 드레인 접합 부분의 전계 세기를 비교했을 때, 그레인 경계를 가지고 있는 다결정 실리콘 TFT보다 상대적으로 낮은 원 인 때문에 적게 열화되는(Degraded) 특성을 확인할 수 있었다.