• Journal of the Korea Institute of Information Security & Cryptology
• /
• v.22 no.2
• /
• pp.201-211
• /
• 2012

This paper addresses a Full Disk Encryption hardware processor for SATA HDD in a single FPGA design, and shows its experimental result using an FPGA board. The proposed processor mainly consists of two blocks: the first block processes XTS-AES block cipher which is the IEEE P1619 standard of storage media encryption and the second block executes the interface between SATA Host (PC) and Device (HDD). To minimize the performance degradation, we designed the XTS-AES block with the 4-stage pipelined structure which can process a 128-bit block per 4 clock cycles and has 4.8Gbps (max) performance. Also, we implemented the proposed design with Xilinx ML507 FPGA board and our experiment showed 140MB/sec read/write speed in Windows XP 32-bit and a SATA II HDD. This performance is almost equivalent with the speed of the direct SATA connection without FDE devices, hence our proposed processor is very suitable for SATA HDD Full Disk Encryption environments.

• Journal of IKEEE
• /
• v.25 no.4
• /
• pp.625-633
• /
• 2021

This paper describes a scalable architecture for flexible hardware implementation of Montgomery modular multiplication. Our scalable modular multiplier architecture, which is based on a one-dimensional array of processing elements (PEs), performs word parallel operation and allows us to adjust computational performance and hardware complexity depending on the number of PEs used, N_PE. Based on the proposed architecture, we designed a scalable Montgomery modular multiplier (sMM) core supporting eight field sizes defined in SEC2. Synthesized with 180-nm CMOS cell library, our sMM core was implemented with 38,317 gate equivalents (GEs) and 139,390 GEs for N_PE=1 and N_PE=8, respectively. When operating with a 100 MHz clock, it was evaluated that 256-bit modular multiplications of 0.57 million times/sec for N_PE=1 and 3.5 million times/sec for N_PE=8 can be computed. Our sMM core has the advantage of enabling an optimized implementation by determining the number of PEs to be used in consideration of computational performance and hardware resources required in application fields, and it can be used as an IP (intellectual property) in scalable hardware design of elliptic curve cryptography (ECC).

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.26 no.7
• /
• pp.1071-1077
• /
• 2022

A security SoC that can be used to implement elliptic curve cryptography (ECC) based public-key infrastructures was designed. The security SoC has an architecture in which a hardware accelerator for the elliptic curve digital signature algorithm (ECDSA) is interfaced with the Cortex-A53 CPU using the AXI4-Lite bus. The ECDSA hardware accelerator, which consists of a high-performance ECC processor, a SHA3 hash core, a true random number generator (TRNG), a modular multiplier, BRAM, and control FSM, was designed to perform the high-performance computation of ECDSA signature generation and signature verification with minimal CPU control. The security SoC was implemented in the Zynq UltraScale+ MPSoC device to perform hardware-software co-verification, and it was evaluated that the ECDSA signature generation or signature verification can be achieved about 1,000 times per second at a clock frequency of 150 MHz. The ECDSA hardware accelerator was implemented using hardware resources of 74,630 LUTs, 23,356 flip-flops, 32kb BRAM, and 36 DSP blocks.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.43 no.11 s.353
• /
• pp.37-47
• /
• 2006

This work proposes a 10b 25MS/s $0.8mm^2$ 4.8mW 0.13um CMOS A/D Converter (ADC) for high-performance wireless communication systems such as DVB, DAB and DMB simultaneously requiring low voltage, low power, and small area. A two-stage pipeline architecture minimizes the overall chip area and power dissipation of the proposed ADC at the target resolution and sampling rate while switched-bias power reduction techniques reduce the power consumption of analog amplifiers. A low-power sample-and-hold amplifier maintains 10b resolution for input frequencies up to 60MHz based on a single-stage amplifier and nominal CMOS sampling switches using low threshold-voltage transistors. A signal insensitive 3-D fully symmetric layout reduces the capacitor and device mismatch of a multiplying D/A converter while low-noise reference currents and voltages are implemented on chip with optional off-chip voltage references. The employed down-sampling clock signal selects the sampling rate of 25MS/s or 10MS/s with a reduced power depending on applications. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates the measured DNL and INL within 0.42LSB and 0.91LSB and shows a maximum SNDR and SFDR of 56dB and 65dB at all sampling frequencies up to 2SMS/s, respectively. The ADC with an active die area if $0.8mm^2$ consumes 4.8mW at 25MS/s and 2.4mW at 10MS/s at a 1.2V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.43 no.11 s.353
• /
• pp.48-57
• /
• 2006

This work describes a 12b 200KHz 0.52mA $0.47mm^2$ algorithmic ADC for sensor applications such as motor controls, 3-phase power controls, and CMOS image sensors simultaneously requiring ultra-low power and small size. The proposed ADC is based on the conventional algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. The input SHA with eight input channels for high integration employs a folded-cascode architecture to achieve a required DC gain and a sufficient phase margin. A signal insensitive 3-D fully symmetrical layout with critical signal lines shielded reduces the capacitor and device mismatch of the MDAC. The improved switched bias power-reduction techniques reduce the power consumption of analog amplifiers. Current and voltage references are integrated on the chip with optional off-chip voltage references for low glitch noise. The employed down-sampling clock signal selects the sampling rate of 200KS/s or 10KS/s with a reduced power depending on applications. The prototype ADC in a 0.18um n-well 1P6M CMOS technology demonstrates the measured DNL and INL within 0.76LSB and 2.47LSB. The ADC shows a maximum SNDR and SFDR of 55dB and 70dB at all sampling frequencies up to 200KS/s, respectively. The active die area is $0.47mm^2$ and the chip consumes 0.94mW at 200KS/s and 0.63mW at 10KS/s at a 1.8V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.46 no.3
• /
• pp.75-85
• /
• 2009

This work proposes a 13b 100MS/s 0.13um CMOS ADC for 3G communication systems such as two-carrier W-CDMA applications simultaneously requiring high resolution, low power, and small size at high speed. The proposed ADC employs a four-step pipeline architecture to optimize power consumption and chip area at the target resolution and sampling rate. Area-efficient high-speed high-resolution gate-bootstrapping circuits are implemented at the sampling switches of the input SHA to maintain signal linearity over the Nyquist rate even at a 1.0V supply operation. The cascode compensation technique on a low-impedance path implemented in the two-stage amplifiers of the SHA and MDAC simultaneously achieves the required operation speed and phase margin with more reduced power consumption than the Miller compensation technique. Low-glitch dynamic latches in sub-ranging flash ADCs reduce kickback-noise referred to the differential input stage of the comparator by isolating the input stage from output nodes to improve system accuracy. The proposed low-noise current and voltage references based on triple negative T.C. circuits are employed on chip with optional off-chip reference voltages. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates the measured DNL and INL within 0.70LSB and 1.79LSB, respectively. The ADC shows a maximum SNDR of 64.5dB and a maximum SFDR of 78.0dB at 100MS/s, respectively. The ABC with an active die area of $1.22mm^2$ consumes 42.0mW at 100MS/s and a 1.2V supply, corresponding to a FOM of 0.31pJ/conv-step.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.53 no.5
• /
• pp.87-97
• /
• 2016

This work proposes a time-shared 10b DAC based on a two-step resistor string to minimize the effective area of a DAC channel for driving each AMOLED display column. The proposed DAC shows a lower effective DAC area per unit column driver and a faster conversion speed than the conventional DACs by employing a time-shared DEMUX and a ROM-based two-step decoder of 6b and 4b in the first and second resistor string. In the second-stage 4b floating resistor string, a simple current source rather than a unity-gain buffer decreases the loading effect and chip area of a DAC channel and eliminates offset mismatch between channels caused by buffer amplifiers. The proposed 1-to-24 DEMUX enables a single DAC channel to drive 24 columns sequentially with a single-phase clock and a 5b binary counter. A 0.9pF sampling capacitor and a small-sized source follower in the input stage of each column-driving buffer amplifier decrease the effect due to channel charge injection and improve the output settling accuracy of the buffer amplifier while using the top-plate sampling scheme in the proposed DAC. The proposed DAC in a $0.18{\mu}m$ CMOS shows a signal settling time of 62.5ns during code transitions from '$000_{16}$' to '$3FF_{16}$'. The prototype DAC occupies a unit channel area of $0.058mm^2$ and an effective unit channel area of $0.002mm^2$ while consuming 6.08mW with analog and digital power supplies of 3.3V and 1.8V, respectively.