1 |
J. B. Choi and K. W. Shin, "True Random Number Generator based on Cellular Automata with Random Transition Rules," Journal of Institute of Korean Electrical and Electronics Engineers, vol. 24, no.1, pp. 52-58, Mar. 2020.
|
2 |
H. J. Yang, "A Security SoC embedded with High-Performance ECC Processor," M. S. thesis, Kumoh National Institute of Technology, Gumi, Korea, 2021.
|
3 |
D. S. Kim and K. W. Shin, "An Optimized Hardware Implementation of SHA-3 Hash Functions," Journal of Institute of Korean Electrical and Electronics Engineers, vol. 22, no.4, pp. 886-895, Dec. 2018.
|
4 |
J. B. Choi, "A Scalable ECC Processor Supporting Prime Field Elliptic Curves," M. S. thesis, Kumoh National Institute of Technology, Gumi, Korea, 2020.
|
5 |
NIST, Digital Signature Standard (DSS) Federal Information Processing Standards Publication (FIPS) 186-5, Oct. 2019. [Online] Available: https://doi.org/10.6028/NIST.FIPS.186-5-draft.
DOI
|
6 |
IoT Analytics, Market Insights for the Internet of Things [Internet]. Available: https://iot-analytics.com/state-of-the-iot-2020-12-billion-iot-connections-surpassing-non-iot-for-the-first-time/.
|
7 |
M. Ahmad, The Anatomy of Security Microcon-trollers for IoT Applications, Digi-Key Electronics, Jan. 13, 2020 [Internet]. Available: https://www.digikey.com/en/articles/the-anatomy-of-security-microcontrollers-for-iot-applications.
|
8 |
Ug761 axi reference guide [Internet]. Available: http://www.xilinx.com/support/documentation/ip_documentationlug761_axi_reference_guide.pdf.
|
9 |
H. -T. Huynh, T. -K. Tran, T. -P. Dang, and T. -T. Bui, "Security Enhancement for loT Systems Based on SoC FPGA Platforms," in 4th International Conference on Recent Advances in Signal Processing Telecommunications Computing (SigTelCom), Hanoi, Vietnam, pp. 35-39, 2020.
|
10 |
S. Sugiyama, H. Awano, and M. Ikeda, "Low- Latency 256-bit Fp ECDSA Signature Generation Crypto Processor," IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, vol. E101-A, no. 12, pp. 2290-2296, Dec. 2018.
DOI
|