• The Journal of Korean Institute of Communications and Information Sciences
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• v.14 no.5
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• pp.531-541
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• 1989

To protect VHF FM radio receiver from the strong interference signal, the study of antenna processor causes a strong interference signal(CW, AM, FM) to be suppressed a level below a weaker desired signal by pointing a spatial null(effective attenuation = 35dB) in the direction of the interference against a stational jamming signal.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.33B no.2
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• pp.47-55
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• 1996

A microwave incoherent imaging method for a conducting cyliner by using multi-frequency tiem-harmonic field is presented in this study. In this paper, an incoherent intensity pattern of th econducting cylinder is obtained by averagin gout the multi-frequency intensities of the coherent field such as the time-harmonic field scattered from this cylinder. This phenomenon is hsown numerically in scattering by a conducting circular cylinder illuminated by the time-harmonic plane wave, and is interpreted analytically by the mutual coherence functon defined as a frequency-averaged intensity of the time-harmonic fields in th frequency domain.

• 한국정보통신설비학회:학술대회논문집
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• 2003.08a
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• pp.269-271
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• 2003

초고주파/밀리미터파 대역에서 전력증폭기의 효율을 향상시키기 위해 MEMS 튜닝회로를 설계하였다. MEMS 튜닝회로의 효과를 확인하기 위해 2차 및 3차 고조파를 억제할 수 있도록 3-stub Class-E 증폭기를 설계하였으며 또한 설계된 증폭기에 대해 시뮬레이션을 실시하였다. 시뮬레이션의 결과로서 8GHz에서 14dBm입력에 대해 MEMS가 적용된 증폭기의 성능은 PAE=66 9%, drain efficiency=75.89%, 그리고 출력 P=23.37 dBm을 얻었다. 또한 FET의 기생리액턴스의 변화에 대해서 MEMS 튜닝회로의 효율증대효과를 확인하였다. 결론적으로 이 연구에서 제안된 새로운 방법을 통해 증폭기의 효율향상을 위한 효과적인 방법이 될 수 있음 보여 주었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.11
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• pp.925-928
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• 2011

Perovskite niobates and tantalates have been placed on a short list of functional materials for future technologies. This article was investigated ferroelectric materials $Ag(Ta,Nb)O_3$ thick film. In this study, we have fabricated the $Ag(Ta,Nb)O_3$ thick film on the $Al_2O_3$ substrates by screen printing method. The $Ag(Ta,Nb)O_3$ thick film were fabricated by the mixed oxide method. The sintering temperature and time were 1,150$^{\circ}C$, 2 hr. The electrical properties of $Ag(Ta,Nb)O_3$ thick film were investigated at 30~100$^{\circ}C$.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.439-440
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• 2008

A high-speed DCO is proposed that uses the negative-skewed delay scheme. The DCO consists of a ring of inverters with each PMOS transistor driven from the output of 3 earlier stage through a set of minimum-sized pass-transistors. The digitization of negative-skewed delay is achieved by selecting pass-transistors turned on and digitizing the gate voltages of the selected pass-transistors. The proposed 7-stage DCO has been simulated using 1.8V, $0.18\;{\mu}m$ TSMC CMOS process to obtain a resolution of 3ps and an operation range of 2.88-5.03GHz.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.2
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• pp.1-7
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• 1992

A consideration for image improvement under the Born approximation in the microwave diffraction tomography is suggested by using a projection function. The limiting factors in the degrading reconstructed image due to Born approximation are identified in terms of projection function and its modification is suggested to improve the degraded image based upon the Born approximation. In order to verify the proposed method, the reconstructed images are shown by computer simulation from the back-scattered data of angular and frequency diversity for squared dielectric cylinder with a various relative dielectric constant. From simulation results, it was shown that the proposed method can lead to a fairly good improved image for a severe degraded one irrespective of homogeneous and inhomogeneous dielectric object. In the future, the analysis on the limitation of this method should be considered and performed by means of more quantitative method.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.221-224
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• 2001

In this paper, the bonding wire interconnection has been studied from the points of view of modeling and electrical characterization. The bonding wire is measured by TDR(Time Domain Reflectometry) and Network analyzer(1-10㎓). First, one gold bonding wire mounted on 2mm gap substrate measured 3.68nH by TDR and 3.39nH by Network analyzer(6㎓). Two gold bonding wire mounted on 2mm gap substrate measured 3.14nH by TDR and 2.80nH by Network analyzer. This result presented that inductance of bonding wire could be employed as inductors for radio frequency circuit packaging.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.9
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• pp.98-105
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• 1995

Recent microwave IC's reach to the extent of high operating frequencies at which bonding wires limit their performance as dominant parasitic components. Double bonding wires separated by an internal angle have been firstly characterized using the Method of Moments with the incorporation of the ohmic resistance calculated by the phenomenological loss equivalence method. For a 30$^{\circ}$ internal angle, the calculated total reactance is 45% less than that of a single bonding wire due to the negative mutual coupling effect. The radiation effect has been observed decreasing the mutual inductance, whereas for parallel bonding wires it greatly increases the mutual inductance. This calculation results can be widely used for designing and packaging of high frequency and high density MMIC's and OEIC's.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.1-9
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• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.316-318
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• 2003

양자우물 구조를 사용한 HEMT(High Electron Mobility Transistor)는 고속 스위칭 소자와 초고주파 통신용 소자 및 센서에에 우수한 동작특성을 갖고 있다. 본 논문에서는 AlInAs/InP HEMT의 heterostructure를 파동방정식과 Poisson 방정식을 self-consistent 한 방법으로 해석하였다. 파동방정식으로 junction의 전자농도를 계산하고, Poisson 방정식을 해석하여 potential profile에 의한 전자 농도가 heterostructure에서 self-consistent가 되도록 연산하였다. 끝으로 AlInAs/InP 구조에서 positively ionized donor, valance band에서의 hole, conduction band의 free electron과 구조내의 2DEG를 AlGaAs/GaAs 및 AlGaAs/InGaAs/GaAs와 비교하였다.