Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Inductance Characterization of Bonding Wires for 1-10㎓ Radio Frequency Packages

1-10 ㎓ 초고주파 패키지용 bonding wire 인덕턴스 특성 측정

  • Jung, Tae-Ho (Dept. of Electronic Engineering, Sogang University) ;
  • Jee, Yong (Dept. of Electronic Engineering, Sogang University)
  • 정태호 (서강대학교 대학원 전자공학과) ;
  • 지용 (서강대학교 대학원 전자공학과)
  • Published : 2001.06.01
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Abstract

In this paper, the bonding wire interconnection has been studied from the points of view of modeling and electrical characterization. The bonding wire is measured by TDR(Time Domain Reflectometry) and Network analyzer(1-10㎓). First, one gold bonding wire mounted on 2mm gap substrate measured 3.68nH by TDR and 3.39nH by Network analyzer(6㎓). Two gold bonding wire mounted on 2mm gap substrate measured 3.14nH by TDR and 2.80nH by Network analyzer. This result presented that inductance of bonding wire could be employed as inductors for radio frequency circuit packaging.

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