• Title/Summary/Keyword: 집적지

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Characteristics of 3-Dimensional Integration Circuit Device (3차원 집적 회로 소자 특성)

  • Park, Yong-Wook
    • The Journal of the Korea institute of electronic communication sciences
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    • v.8 no.1
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    • pp.99-104
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    • 2013
  • As a demand for the portable device requiring smaller size and better performance is in hike, reducing the size of conventionally used planar 2 dimensional integration circuit(IC) cannot be a solution for the enhancement of the semiconductor integration circuit technology due to an increase in RC delay among interconnects. To address this problem, a new technology of 3 dimensional integration circuit (3D-IC) has been developing. In this study, three-dimensional integrated device was investigated due to improve of reducing the size, interconnection problem, high system performance and functionality.

A Highly-Integrated Analog Front-End IC for Medical Ultrasound Imaging Systems (초음파 의료 영상시스템용 고집적 아날로그 Front-End 집적 회로)

  • Banuaji, Aditya;Cha, Hyouk-Kyu
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.12
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    • pp.49-55
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    • 2013
  • A high-voltage highly-integrated analog front-end (AFE) IC for medical ultrasound imaging applications is implemented using standard 0.18-${\mu}m$ CMOS process. The proposed AFE IC is composed of a high-voltage (HV) pulser utilizing stacked transistors generating up to 15 Vp-p pulses at 2.6 MHz, a low-voltage low-noise transimpedance preamplifier, and a HV switch for isolation between the transmit and receive parts. The designed IC consumes less than $0.15mm^2$ of core area, making it feasible to be applied for multi-array medical ultrasound imaging systems, including portable handheld applications.

Granular noise analysis in pixel-to-pixel mapping-based computational integral imaging (화소 대 화소 매핑 기반 컴퓨터 집적 영상에서의 그래눌라 잡음 해석)

  • Yoo, Hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.15 no.6
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    • pp.1363-1368
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    • 2011
  • This paper describes an analysis on the granular noise in pixel-to-pixel mapping-based computational integral imaging. The pixel mapping-based method provides a high-resolution reconstructed images and also its computational cost is very lower than the previous back-projection-based method. In this paper, a signal model for the pixel mapping-based method is introduced, which defines and analyzes the granular noise. Computer experiments provides the granular noise properties based on the proposed signal model. The experimental results indicates that the granular noise pattern differs from that of the back-projection based method. The results is also utilized in the pixel mapping-based method.

Analysis method of signal model for synthetic aperture integral imaging (합성 촬영 집적 영상의 신호 모델 해석 방법)

  • Yoo, Hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.11
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    • pp.2563-2568
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    • 2010
  • SAII (synthetic aperture integral imaging) is a useful technique to record many multi view images of 3D objects by using a moving camera and to reconstruct 3D depth images from the recorded multiviews. This is largely composed of two processes. A pickup process provides elemental images of 3D objects and a reconstruction process generates 3D depth images computationally. In this paper, a signal model for SAII is presented. We defined the granular noise and analyzed its characteristics. Our signal model revealed that we could reduce the noise in the reconstructed images and increase the computational speed by reducing the shifting distance of a single camera.

3D Image Display Method using Synthetic Aperture integral imaging (Synthetic aperture 집적 영상을 이용한 3D 영상 디스플레이 방법)

  • Shin, Dong-Hak;Yoo, Hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.16 no.9
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    • pp.2037-2042
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    • 2012
  • Synthetic aperture integral imaging is one of promising 3D imaging techniques to capture the high-resolution elemental images using multiple cameras. In this paper, we propose a method of displaying 3D images in space using the synthetic aperture integral imaging technique. Since the elemental images captured from SAII cannot be directly used to display 3D images in an integral imaging display system, we first extract the depth map from elemental images and then transform them to novel elemental images for 3D image display. The newly generated elemental images are displayed on a display panel to generate 3D images in space. To show the usefulness of the proposed method, we carry out the preliminary experiments using a 3D toy object and present the experimental results.

2D-3D convertible display system having a background of full-parallax integral images (완전시차 집적 영상 배경을 가지는 2D-3D 겸용 디스플레이 시스템)

  • Hong, Suk-Pyo;Shin, Dong-Hak;Kim, Eun-Soo
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.2
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    • pp.369-375
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    • 2009
  • In this paper, we propose a 2D-3D convertible display system having a background of full-parallax integral images. The proposed system is composed of integral imaging system and conventional 2D flat display and is able to operate either 3D mode or 2D mode. In 3D mode, the 3D image is generated by combining the 2D main image with the background image based on integral imaging. In 2D mode, the integral imaging system plays a role as the back-light of 2D flat display and then 2D image is observed through 2D flat display. To show the usefulness of the proposed system, we carry out the preliminary experiments and present the successful experimental results.

Design problem of Line (선형 집적회로(IC) 설계의 문제점)

  • 김만진
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.13 no.3
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    • pp.22-27
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    • 1976
  • For linear IC design, one has to know the epi thickness, resistivity, and structure of buried island inserted between epi and substrate because the mask structure can only be changed for linear IC consisted of various type of transistors to be made for desired specific function. The interrelation of IC operational and saturation voltages with epi resistivity, theckness and divice structure are studied and presented in graphic forms so that IC design engineers can utilize them.

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Novel Optical Image Encryption using Integral Unaging and Random Pixel-scrambling Schemes (집적영상 및 랜덤 픽셀-스크램블링 기법을 이용한 새로운 광 영상 암호화)

  • Piao, Yong-Ri;Kim, Seok-Tae;Kim, Eun-Soo
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.34 no.4C
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    • pp.380-387
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    • 2009
  • In this paper, optical image encryption using integral imaging and pixel-scrambling technologies is proposed. In the encryption process, we use pixel scrambling to change the order of subsections into which the cover image is divided, and the utilize the integral imaging scheme to obtain the elemental image from the scrambled image. In order to achieve higher security, we reuse pixel scrambling to the elemental image. In the decryption process, we employ optical integral imaging reconstruction technique and inverse pixel scrambling methode. Computer simulation results prove the feasibility of the proposed method and robustness against data loss and noise.

Coding Efficiency Improvement By Applying Rate-Distortion Optimization To 3D-DCT Based Integral Image Compression Method (3D-DCT 기반 집적영상 압축 방법의 율-왜곡 최적화를 통한 부호화 효율 향상 방법)

  • Jeon, Ju-Il;Kang, Hyun-Soo
    • The Journal of the Korea Contents Association
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    • v.12 no.9
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    • pp.1-8
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    • 2012
  • In this paper, we propose a rate-distortion optimization method to improve the coding efficiency of the conventional 3D-DCT based compression method using adaptive block mode selection for integral images. In the conventional 3D-DCT based compression method, 3D-DCT blocks of variable block sizes are adaptively selected depending on the characteristics of integral images, and then 3D-DCT is performed. The proposed method applies a rate-distortion optimization to determine the optimal block mode. In addition, we suggest the optimal Lagrangian parameter for integral images. Experimental results show that the proposed method gives bit-rate reduction of about 5%.

Design & Fabrication of Audio Preamplifier Using Thick film Hybrid Technology (혼성집적회로 기술에 의한 음악 전단증폭기의 설계와 제작)

  • 정선호;정헌생
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.8 no.5
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    • pp.10-19
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    • 1971
  • Problems and technologies involved in integrating an audio preamplifier in terms of thick film technology has been discussed in detail. In particular, an attempt has been made to find methods for functional trimming of the amplifer by employing computer analysis. Among seven resistors integrated on a alumina substrate, only one resistor was found to be very sensitive to over all performance of the preamplifier. By trimming this resistor to its freguency charcteristic reguirements, it was possible to cut down trimming labor by one seventh. Besides, problems concerning resistor conductor contacts, crossover parasitic capacitance and the relations between noise per(ormance and trimming method are discussed in detail.

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