• The Korean Journal of Rheology
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• v.10 no.2
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• pp.92-97
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• 1998

열잠재성 경화제인 N-benzylpyrazinium hexafluoroantimonate (BPH)를 이용하여 함 량에 따른 DGEBA계 에폭시 수지의 경화반응에서의 유변학적 특서 및 반응속도를 연구하 였다. 경화시의 활성화 에너지를 Barrett 방법을 이용한 동적 DSC 측정방법으로 조사 하였 다. DSC 실험 결과 BPH의 함량이 증가할수록 활성화 에너지는 감소함을 알수 있었다. Rheomter를 이용하여 DGEBA/BPH 계의 유변학적 특성을 등온경화와 tdmdhsrud화 조건하 에서 살펴보았다. BPH의 함량이 증가함에 따라 겔화점 도달시간 빠르게 나타나는데 이는 낮아진 활성화 에너지에 기인한 것으로 사료된다. 두 번째 damping 피크를 이용하여 유리 화점을 측정하여 Time-Temperature-Transformation (T-T-T) cure diagram을 작성한 결 과 열잠재성 경화제의 특성인 일정온도 이상에서 활성이 나타남을 확인할수있었다.

• Polymer(Korea)
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• v.37 no.3
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• pp.302-307
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• 2013

We synthesized aliphatic epoxy acrylate monomer by the reaction of glycerol diglycidyl ether and acrylic acid. The reaction was monitored by FTIR, Raman spectroscopy and $^1H$ NMR. Electron-beam (E-beam) curing behaviors of the synthesized monomer were studied by spectroscopic analysis, glass transition temperature, and tensile properties. We found that curing reaction was complete in a low dosage of ca. 30 kGy. The viscosity of monomer was a low enough for coating without using diluents and the cured sample was highly transparent, indicating that the monomer can be used for an E-beam curable coating material on transparent optical films.

• Polymer(Korea)
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• v.35 no.3
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• pp.196-202
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• 2011

The cure kinetics of a bisphenol A epoxy resin and polyoxypropylene diamine curing agent system are investigated in both dynamic and isothermal conditions by differential scanning calorimetry (DSC). In dynamic experiments, the shift of exothermic peaks obtained at different heating rates is used to obtain activation energy of overall cure reaction based on the methods of Ozawa and Kissinger. Isothermal DSC data at different temperatures are fitted to an autocatalytic Kamal kinetic model. The kinetic model is in a good agreement with the experimental data in the initial stage of cure. A diffusion effect is incorporated to describe the later stage of cure, predicting the cure kinetics over the whole range of curing process. Also, dynamic mechanical analysis is performed to evaluate the storage modulus and average molecular weight between crosslinkages.

• Proceedings of the Korean Nuclear Society Conference
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• 2004.10a
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• pp.983-984
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• 2004

• Polymer(Korea)
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• v.39 no.2
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• pp.281-286
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• 2015

UV-cured acrylic copolymer pressure sensitive adhesive (PSA) having different amounts of crosslinking agents were prepared and adhesion properties were investigated. 0.01 wt% of MMT clay was dispersed in 2-ethylhexyl acrylate (2-EHA)/acrylic acid (AA) monomer mixture containing 0, 0.05, 0.1 and 0.3 wt% 1,6-hexandiol diacrylate (HDDA) for crosslinking. It was investigated that the curing behavior and surface chemistry of PSAs were merely affected by the presence of MMT clays. On the other hand, adhesive properties were influenced by the MMT addition; a cohesive failure was restrained due to improved molecular elasticity even in uncrosslinked acrylic PSAs. However, it was also appeared that combination of 0.3 wt% crosslinking agent and MMT loading might result in the damage of adhesion properties of PSAs possibly due to the lack of chain flexibility. In our studies, it is suggested that the 2-EHA/AA PSAs incorporating 0.01 wt% of MMT and crosslinked with 0.05 wt% of HDDA exhibited the balanced adhesion properties without severe cohesive failure during strip.

• Clean Technology
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• v.12 no.1
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• pp.27-35
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• 2006

Main compositions of powder paint based on thermoset type epoxy resin consist of epoxy resin for powder coating, curing agent, filler and pigment. The curing system used in this study was based on diglycidyl ether of bisphenol-A (DGEBA) and dicyan diamide (DICY). The curing behavior and rheological properties of powder coating material were investigated using DSC and rheometer, respectively. And the adhesion strength between steel and powder coating material was measured using lap shear geometry. The optimum formulation of epoxy powder paint obtained from this study was base resin of 100 phr, DICY of 6 phr, $CaCO_3$ of 20 phr, and $TiO_2$ of 10 phr.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.2 no.1
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• pp.75-82
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• 1988

Epoxy, noticed as a new insulation material tor electrical installation, may become an excellent cured material from the crosslink reaction with some curing agents. The characteristics of cured Epoxy is determined by the kind of the curing agents and the method of lattice formation. The purpose of this paper, varing the process of lattice formation by various surrounding temperatures during the curing process, is to obtain the optimum curing temperature for electrical insulation from the results of investigation on the properties of cured Epoxy. In the experiment, Epoxy was cured at various temperatures between $20[^{\circ}C] and 50^[{\circ}C]$ which differ by $5^[{\circ}C]$, and then examined on the electrical insulation haracteristics as well as the thermal and mechanical stability. As a result, it is concluded that the optimum electrical insulation characteristis and mechanical strength of cured Epoxy can be obtained when cured at a surrounding temperature at $30[^{\circ}C]$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6464-6471
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• 2014

The UV curing method is a popular process for lens molding on a unit wafer. This process, however, has several drawbacks including wafer adhesion during the ejection process after curing, errors in lens shape and wafer warpage due to material shrinkage during the curing process, and lens centering errors on both sides of a wafer. Among these, the lens shape error and warpage are influenced directly by the UV curing process due to factors including the UV radiation uniformity, the degree of cure according to UV intensity, and the shrinkage characteristics of the material. Therefore, a theory is needed not only to understand the change in the material characteristics, such as the shrinkage rate due to the curing reaction, but also to establish a model. In addition, an analysis system is needed to realize the model. This study proposes a new analysis method for the wafer lens molding process by Comsol modeling. This method was verified by comparing the results with those of the actual process.

• Composites Research
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• v.17 no.6
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• pp.37-43
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• 2004

To determine the effect of chain length and chemical structure of linear amine curing agents on thermal and mechanical properties, a standard bifunctional linear DGEBF epoxy resin was cured with EDA and HMDA having amine group at the both ends of main chain in a stoichiometrically equivalent ratio in condition of preliminary and post cure. From this work, the effect of linear amine curing agents on the thermal and mechanical properties is significantly influenced by numbers of carbon atoms of main chain. In contrast, the results show that the DCEBF/EDA system having two carbons had higher values in the thermal stability, density, shrinkage (%), grass transition temperature, tensile modulus and strength, flexural modulus and strength than the DGEBF/HMDA system having six carbons, whereas the DGEBF/EDA cure system had relatively low values in maximum ekothermic temperature, maximum conversion of epoxide, thermal expansion coefficient than the DGEBF/HDMA cure system. These findings indicate that the packing capability (rigid property) in the EDA structure affects the thermal and mechanical properties predominantly. It shows that flexural fracture properties have a close relation to flexural modulus and strength.

• Applied Chemistry for Engineering
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• v.5 no.6
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• pp.1030-1035
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• 1994

Curing behavior and glass transition temperatures of epoxy resins into which reactive diluents were added to control processability were investigated. Heat of cure generated of the epoxy resin was reduced with butyl glycidyl ether(BGE) and phenyl glycidyl ether(PGE) contents. $T_g$ of the resin was decreased with the amount of reactive diluents and it was attributed to increased molecular weight between crosslink points. Cure kinetics of the resins was studied employing autocatalytic reaction model and found that reaction constants decreased as the contents of reactive diluent was increased.