1 |
H. Schmitta, M. Rommela, A.J. Bauera, L. Freya, A. Bichc, M. Eisnerc, R. Voelkelc, M. Hornungd, "Full wafer microlens replication by UV imprint lithography" , Microelectronic Engineering, Volume 87, Issues 5-8, May-August 2010, pp. 1074-1076
DOI
|
2 |
R. Voelkel, J. Duparre, F. Wippermann, P. Dannberg, A. Brauer, R. Zoberbier, M. Gabriel, M. Hornung, S. Hansen, R. Suess, "TECHNOLOGY TRENDS OF MICROLENS IMPRINT LITHOGRAPHY AND WAFER LEVEL CAMERAS (WLC)", MOC'08, Conference on Micro-Optics, Brussels, Belgium on September 25 - September 27, 2008
|
3 |
H. Han, M. Kriman, M. Boomgarden, "Wafer Level Camera technology - from wafer level packaging to wafer level integration", Electronic Packaging Technology &High Density Packaging (ICEPT-HDP), 2010 11th International Conference on , 16-19 ,pp. 121 - 124, Aug. 2010
|
4 |
A. Maffezzolia, R. Terzib, "Effect of irradiation intensity on the isothermal photopolymerization kinetics of acrylic resins for stereolithography", Thermochimica Acta, Volume 321, Issues 1-2, pp. 111-121, November 1998
DOI
|
5 |
M.J. Ha. :Cure Kinetics Modelling of UV Curable Resin", master's thesis, SNU 2008
|
6 |
U. Muller, S. Jockusch, H.J. Timpe., "Photocrosslinking of silicones. VI. Photocrosslinking kinetics of silicone acrylates and methacrylates", Journal of Polymer Science Part A: Polymer Chemistry Volume 30, Issue 13, pp. 2755-2764, December 1992 DOI: http://dx.doi.org/10.1002/pola.1992.080301311
DOI
|
7 |
B. Golaz, V. Michaud, Y. Leterrier, J.-A.E. Manson, "UV intensity, temperature and dark-curing effects in cationic photo-polymerization of a cycloaliphatic epoxy resin", Polymer Volume 53, Issue 10, 25 pp. 2038-2048, April 2012
DOI
|
8 |
B. Patham, "COMSOL(R) Implementation of a viscoelastic model with cure-temperature-time superposition for predicting cure stresses and springback in a thermoset resin", Excerpt from the Proceedings of the COMSOL Conference 2009 Bangalore
|