Browse > Article

Cure Kinetics and Dynamic Mechanical Properties of an Epoxy/Polyoxypropylene Diamine System  

Huang, Guang-Chun (Department of Polymer Science and Engineering, Kumoh National Institute of Technology)
Lee, Jong-Keun (Department of Polymer Science and Engineering, Kumoh National Institute of Technology)
Publication Information
Polymer(Korea) / v.35, no.3, 2011 , pp. 196-202 More about this Journal
Abstract
The cure kinetics of a bisphenol A epoxy resin and polyoxypropylene diamine curing agent system are investigated in both dynamic and isothermal conditions by differential scanning calorimetry (DSC). In dynamic experiments, the shift of exothermic peaks obtained at different heating rates is used to obtain activation energy of overall cure reaction based on the methods of Ozawa and Kissinger. Isothermal DSC data at different temperatures are fitted to an autocatalytic Kamal kinetic model. The kinetic model is in a good agreement with the experimental data in the initial stage of cure. A diffusion effect is incorporated to describe the later stage of cure, predicting the cure kinetics over the whole range of curing process. Also, dynamic mechanical analysis is performed to evaluate the storage modulus and average molecular weight between crosslinkages.
Keywords
cure kinetics; epoxy resin; amine hardener; differential scanning calorimetry; dynamic mechanical analysis;
Citations & Related Records

Times Cited By Web Of Science : 0  (Related Records In Web of Science)
Times Cited By SCOPUS : 0
연도 인용수 순위
  • Reference
1 S. Sourour and M. R. Kamal, Thermochim. Acta, 14, 41 (1976).   DOI   ScienceOn
2 D. H. Kim and S. C. Kim, Polym. Bull., 18, 533 (1987).
3 U. Khanna and M. Chanda, J. Appl. Polym. Sci., 49, 319 (1993).   DOI   ScienceOn
4 A. Dutta and M. E. Ryan, J. Appl. Polym. Sci., 24, 635 (1979).   DOI   ScienceOn
5 L. Chiao and R. E. Lyon, J. Comp. Mater., 24, 739 (1990).   DOI
6 L. Barral, J. Cano, J. Lopez, I. Lopez-Bueno, P. Nogueira, A. Torres, C. Ramirez, and M. J. Abad, Thermochim. Acta, 344, 127 (2000).   DOI
7 M. Harsch, J. K. Kocsis, and M. Holst, Eur. Polym, J., 43, 1168 (2004).
8 H. Cai, P. Li, G. Sui, Y. Yu, G. Li, X. Yang, and S. Ryu, Thermochim. Acta, 473, 101 (2008).   DOI
9 X. Sheng, J. K. Lee, and M. R. Kessler, Polymer, 50, 1264 (2009).   DOI   ScienceOn
10 A. S. Vallely and J. K. Gillham, J. Appl. Polym. Sci., 64, 39 (1997).   DOI   ScienceOn
11 J. K. Lee, J. Y. Hwang, and J. K. Gillham, J. Appl. Polym. Sci., 81, 396 (2001).   DOI   ScienceOn
12 R. B. Gosnell and H. H. Levine, J. Macromol. Sci.-Chem., A3, 1381 (1969).
13 P. Froimowicz, A. Gandini, and M. Strumia, Tetrahedron Lett., 46, 2653 (2005).   DOI   ScienceOn
14 S. Montserrat and J. Malek, Thermochim. Acta, 228, 47 (1993).   DOI
15 W. M. Chen, P. Li, Y. H. Yu, and X. P. Yang, J. Appl. Polym. Sci., 107, 1493 (2008).   DOI   ScienceOn
16 P. Li, X. P. Yang, Y. H. Yu, and D. S. Yu, J. Appl. Polym. Sci., 92, 1124 (2003).
17 D. Rosu, F. Mustata, and C. N. Cascaval, Thermochim. Acta, 370, 105 (2001).   DOI
18 K. H. Lee and D. G. Lee, Comp. Struc., 86, 37 (2008).   DOI   ScienceOn
19 E. A. Turi, Thermal Characterization of Polymeric Materials, 2nd edition, Academic Press, San Diego, 1981.
20 G. Wisanrakkit and J. K. Gillham, J. Appl. Polym. Sci., 41, 2885 (1990).   DOI
21 H. E. Kissinger, Anal. Chem., 29, 1702 (1959).
22 T. Ozawa, Bull. Chem. Soc. Jpn., 38, 1881 (1965).   DOI
23 T. Ozawa, J. Therm. Anal., 2, 301 (1970).   DOI   ScienceOn
24 M. R. Kamal, Polym. Eng. Sci,, 13, 59 (1973).   DOI
25 T. Ueki, S. Nishijima, and Y. Izumi, Cryogenics, 45, 141 (2005).   DOI   ScienceOn
26 F. Fdez de Nograro, R. Llano-Ponte, and I. Mondragon, Polymer, 37, 1589 (1996).   DOI   ScienceOn
27 J. Macan, I. Brnardic, M. Ivankovic, and H. J. Mencer, J. Therm. Anal. Calor., 81, 369 (2005).   DOI   ScienceOn
28 A. R. Cedeno and C. S. P. Sung, Polymer, 46, 9378 (2005).   DOI   ScienceOn
29 M. Ilavsky, Z. Bubenikova, K. Bouchal, J. Nedbal, and J. Fahrich, Polym. Bull., 42, 465 (1999).   DOI   ScienceOn
30 H. Lee and K. Neville, Handbook of Epoxy Resins, McGraw-Hill Inc, New York, 1982.
31 F. Sawa, S. Nishijima, and T. Okada, Cryogenics, 35, 767 (1995).   DOI   ScienceOn
32 N. Albritton and W. Young, Cryogenics, 36, 713 (1996).   DOI   ScienceOn
33 T. Ueki, K. Nojima, K. Asano, S. Nishijima, and T. Okada, Adv. Cryog. Eng. Mater., 44, 277 (1998).
34 O. P. Anashkin, V. E. Keilin, and V. M. Patrikeev, Cryogenics, 39, 795 (1999).   DOI   ScienceOn
35 H. C. Hsia, C. C. M. Ma, M. S. Li, Y. S. Li, and D. S. Chen, J. Appl. Polym. Sci., 52, 1137 (1994).   DOI   ScienceOn
36 H. Ng and I. M. Zloczower, Polym. Eng. Sci., 33, 211 (1993).   DOI   ScienceOn