• Title/Summary/Keyword: 접합강도

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In-situ Observation on Micro-Fractural Behavior and Strength Characteristics in Sn-4.0wt%Ag-0.5wt%Cu Solder Joint Interface (Sn-4.0wt%Ag-0.5wt%Cu 솔더 접합계면의 강도특성과 미세파괴거동에 대한 In-situ관찰)

  • Lee, Kyung-Keun;Choi, Eun-Geun;Chu, Yong-Ho;Kim, Jin-Soo;Lee, Byung-Soo;Ahn, Haeng-Keun
    • Korean Journal of Materials Research
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    • v.18 no.1
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    • pp.38-44
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    • 2008
  • The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

Effect of Paint Baking on the Strength and Failure of Spot Welds for 780 TRIP Steels (780 MPa급 TRIP강의 저항 점용접부 강도 및 파단에 미치는 Paint Baking의 영향)

  • Son, Jong-Woo;Nam, Dae-Geun;Kim, Dong-Cheol;Park, Yeong-Do
    • Journal of Welding and Joining
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    • v.28 no.2
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    • pp.66-73
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    • 2010
  • Conventional fracture test of resistance spot weld had been performed without consideration of paint baking process in automobile manufacturing line. This study was aim to investigate the effect of paint baking on fracture mode and load carrying capacity in fracture test for resistance spot welded 780TRIP steels. With paint baking cycle after resistance spot welds, peel tests and microhardness were conducted on the as-welded and baked samples. Resistance spot welds in AHSS (Advanced High Strength Steels) are prone to display partial interfacial fractures during fracture test or vehicle crash. Baking cycle increased the load-carrying capacity of the resistance spot welded samples and improved the fracture appearance from partial to full button fracture for the L-type peel tests. Specially, the differences in fracture appearance are apparent when the nugget size of spot welds is small enough to produce the partial interfacial fracture. The comparison of macrohardness and microstructure between as-welded and baked samples showed that there are no large difference in change the fracture mode. However, the results of the instrumented indentation test suggested that fusion zone and HAZ of baked sample have less tensile and yield strength and proves that the tempering effects are applied and enhanced the resistance to fracture on welds with application of baking cycle.

Effect of Intermetallic Compounds Growth Characteristics on the Shear Strength of Cu pillar/Sn-3.5Ag Microbump for a 3-D Stacked IC Package (3차원 칩 적층을 위한 Cu pillar/Sn-3.5Ag 미세범프 접합부의 금속간화합물 성장거동에 따른 전단강도 평가)

  • Kwak, Byung-Hyun;Jeong, Myeong-Hyeok;Park, Young-Bae
    • Korean Journal of Metals and Materials
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    • v.50 no.10
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    • pp.775-783
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    • 2012
  • The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.

Design and construction of verification complex that checks the efficiency on water permeability of permeable pavement parking lot LID (투수 주차장형 LID 투수효율성 검증실험단지 설계 및 구축)

  • Lee, Eun Ku;Shin, Hyun Shuk
    • Proceedings of the Korea Water Resources Association Conference
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    • 2016.05a
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    • pp.317-317
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    • 2016
  • 저영향개발(Low Impact Development, LID) 시설들은 미국 일본 등 선진국을 중심으로 관련법에 따라 개발 및 적용 되어왔으나 국내에서는 최근에서야 LID 시설을 적용할 수 있는 제도적인 틀을 구축하고 있는 실정이며, 국내 여건에 맞는 LID 시설을 개발하여 그 효용성을 검증하기 까지는 상당한 시간이 소요될 것으로 판단된다. 서울시는 2014년 '서울특별시 빗물관리에 관한 조례 전부개정조례'를 발표함으로써 한국형 LID 시설을 대단위로 적용 하고 검증 할 수 있는 발판을 마련하였다. 서울시의 2014년 전부개정조례에 따르면 시장 및 구청장은 저영향개발 계획 수립의 실효성 확보를 위하여 저영항개발 사전협의 제도를 마련하여 시행하여야 하며, 시장은 저영향개발 지구단위계획을 수립하여야 한다. 이에 따라, 본 연구에서는 실제로 적용 가능한 투수포장 주차장을 설계 할 수 있도록 투수 주차장형 LID 시설을 검증할 수 있는 투수효율성 검증실험단지를 설계 및 구축 하였다. 과거 도심의 우수배제는 중앙 집중형 시스템으로 단기간에 우수를 차집하여 배제하는 방식이었으나, 근래에는 집중형 우수배제 시스템의 위험성, 경제성 그리고 용량한계 등 여러 가지 문제점이 부각되면서 분산형 시스템으로의 전환이 이루어지고 있다. 물순환도시 및 지속가능한 도시 등이 분산형 우수배제 시스템의 예이며, 주차장, 도로, 건물 등 불투수 표면으로부터의 우수를 지면으로 침투 및 침루시키는 방법 등을 활용하여 건전한 물순환을 꾀하고 있다. 침투 및 침루 능력은 각각 포장체 및 포장면 하부구조의 재료와 밀접한 관련이 있으며 재료의 선정은 하부구조의 안정성 확보를 고려하여 선택되어야 한다. 또한 우수 배제를 위한 유공관은 접합점에서 강도를 유지하면서 효율적으로 유수를 배제할 수 있어야 하며, 저류조 설치는 강수의 활용목적에 맞게 선정되어야 한다. 이러한 투수 주차장형 LID 시설은 하나의 시스템으로서 포장체의 재료에 따른 공학적 성질, 하부구조 구축방법 및 재료 선정 그리고 유공관 배열 등에 따라 그 시스템의 거동이 변화하므로 기존에 행해왔던 단순 재료실험으로는 투수성 주차장의 우수배제 시스템을 평가할 수 없다. 따라서 본 연구에서는 이를 검증할 수 있는 투수효율성 검증실험단지 설계 및 구축하였다.

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Improvement of Reliability of Low-melting Temperature Sn-Bi Solder (저융점 Sn-Bi 솔더의 신뢰성 개선 연구)

  • Jeong, Min-Seong;Kim, Hyeon-Tae;Yoon, Jeong-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.2
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    • pp.1-10
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    • 2022
  • Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.

Evaluation of Commercial Anion Exchange Membrane for the application to Water Electrolysis (수전해 시스템에 적용하기 위한 상용 음이온교환막의 특성평가)

  • Jun Ho, Park;Kwang Seop, Im;Sang Yong, Nam
    • Membrane Journal
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    • v.32 no.6
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    • pp.496-513
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    • 2022
  • In this study, we sought to verify the applicability of anion exchange membrane water electrolysis system using FAA-3-50, Neosepta-ASE, Sustainion grade T, and Fujifilm type 10, which are commercial anion exchange membranes. The morphology of the commercial membranes and the elements on the surface were analyzed using SEM/EDX to confirm the distribution of functional groups included in the commercial membranes. In addition, mechanical strength and decomposition temperature were measured using UTM and TGA to check whether the driving conditions of the water electrolyte were satisfied. The ion exchange capacity and ion conductivity were measured to understand the performance of anion exchange membranes, and the alkaline resistance of each commercial membrane was checked and durability test was performed because they were driven in an alkaline environment. Finally, a membrane-electrode assembly was manufactured and a water electrolysis single cell test was performed to confirm cell performance at 60℃, 70℃, and 80℃. The long-term cell test was measured 20 cycles at other temperatures to compare water electrolysis performance.

Evaluation of Cryogenic Performance of Adhesives Using Composite-Aluminum Double Lap Joints (복합재-알루미늄 양면겹치기 조인트를 이용한 접착제의 극저온 물성 평가)

  • Kang, Sang-Guk;Kim, Myung-Gon;Kong, Cheol-Won;Kim, Chun-Gon
    • Composites Research
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    • v.19 no.4
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    • pp.23-30
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    • 2006
  • In the development of a cryogenic propellant tank, the proper selection of adhesives to bond composite and metal liner is important for the safety of operation. In this study, 3 types of adhesives were tested for the ability to bond CFRP composites developed for cryogenic use and aluminum alloy (Al 6061-T6) for lining the tank using double-lap joint specimens. The double-lap joint specimens were tested inside an environmental chamber at room temperature and cryogenic temperature ($-150^{\circ}C$) respectively to compare the bond strength of each adhesive and fracture characteristics. The material properties with temperature of component materials of double-lap joints were measured. In addition, ABAQUS was used for the purpose of analyzing the experimental results.

Strength of PSC Bridge Decks using Half-Depth Precast Panel with Loop Joint (루프이음 반단면 프리캐스트 패널을 이용한 PSC 바닥판의 강도평가)

  • Chung, Chul Hun;Kim, Yu Seok;Hyun, Byung Hak;Kim, In Gyu
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.29 no.5A
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    • pp.433-445
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    • 2009
  • The panels are used as a composite part of the completed deck. They replace the main bottom transverse deck reinforcement and also serve as a form surface for the cast-in-place concrete upper layer that contains the top of deck reinforcement. Research has also demonstrated that mechanical shear ties on the top of the panels are required. In a composite deck with precast panels, it is required to notice behavior of transverse joints between panels. In this paper, static tests of composite deck with shear ties and loop joints were conducted. From the results, the validity of loop joints for continuity of deck was observed. Also, a composite behavior was abserved between precast panel and slab concrete. Tested composite decks with shear ties have 140~164% ultimate strength than have no shear ties due to the increase of composite action. Therefore, the shear ties between the slabs were sufficient to enforce composite flexural behavior to failure.

A Study of material analysis and its experimentation of metamorphosis and its utilities in Copper Alloy plates for contemporary metal craft (현대금속공예용 동합금판의 재료분석과 형질변환 실험 및 응용에 관한 연구)

  • Lim, Ock-Soo
    • Archives of design research
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    • v.17 no.4
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    • pp.241-250
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    • 2004
  • In this research, the copper alloy plates C2200, C5210, C7701, C8113 were selected to make datum and to identify further usage of metal craft experimentation. For its experimentation, the general welding and TIG welding methods were researched; for 2nd experimentation, the Reticulation and Electroforming skill's differences in color and temperature were researched. With these methods 3 different kinds of works are introduced for sample studies. For this research, Dr. Lee, Dong-Woo who works in Poongsan Metal Co, supported 4 kinds of copper alloy metals. Which are Commercial bronze (Cu-Zn), Deoxidiged Copper(Cu-Sn-P), Nickel Silver (Cu-Ni-Zn), and White Bronze (Cu-Ni); they were applied partly and wholly by the method of Laminatin, Reticulation, Fusing, and Electroforming skills. In case of C2200, the brass, the A. C. TIG welding method is better under 2mm slight plate; the D.C. TIG welding is better upper 2mm plate; and 250~300$^{\circ}C$ is recommended for remain heat treatment. In case of C5210, not having Hydrogen in high temperature return period, doesn't need Oxygen in high temperature and hardening in comparative high temperature neither, it is good for welding. It contains Sn 2-9% ad P 0.03-0.4% generally; and in accordance with the growth rate of Sn contain amount, the harden temperature boundary become broad. In case of cold moment after welding, they are recommended that higher speed TIG welding, smaller melting site and less than 200$^{\circ}C$ for pre-heating temperature. In case of C7701, the 10-20% Ni, 15-30% Zn are widely used.. If it is upper 30% Zn, it become (${\alpha}+{\beta}$) system and adhesive power rate become lower, and the productivity become lower in low temperature but the productivity become higher in high temperature. Nickel Silver's resistance of electricity is well; and the heatproof and incorrodibility is good, too. Lastly, in case of C8113, good at persistence in salty and grind; high in strength of high temperature. In case of white brass, contain 10-30% Nickel and hardened in high temperature and become single phrase. For these reason, the crystallization particles easily become large, if the resistance become higher small amount of Pb, P, S separation rate become higher.

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Seismic Performance of Precast Infill Walls with Strain-Hardening Cementitious Composites (변형경화형 시멘트 복합체를 사용한 프리캐스트 끼움벽의 내진성능)

  • Kim, Sun-Woo;Yun, Hyun-Do;Jang, Gwang-Soo;Yun, Yeo-Jin
    • Journal of the Korea Concrete Institute
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    • v.21 no.3
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    • pp.327-335
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    • 2009
  • In the seismic region, non-ductile structures often form soft story and exhibit brittle collapse. However, structure demolition and new structure construction strategies have serious problems, as construction waste, environmental pollution and popular complain. And these methods can be uneconomical. Therefore, to satisfy seismic performance, so many seismic retrofit methods have been investigated. There are some retrofit methods as infill walls, steel brace, continuous walls, buttress, wing walls, jacketing of column or beam. Among them, the infilled frames exhibit complex behavior as follows: flexible frames experiment large deflection and rotations at the joints, and infilled shear walls fail mainly in shear at relatively small displacements. Therefore, the combined action of the composite system differs significantly from that of the frame or wall alone. Purpose of research is evaluation on the seismic performance of infill walls, and improvement concept of this paper is use of SHCCs (strain-hardening cementitious composites) to absorb damage energy effectively. The experimental investigation consisted of cyclic loading tests on 1/3-scale models of infill walls. The experimental results, as expected, show that the multiple crack pattern, strength, and energy dissipation capacity are superior for SHCC infill wall due to bridging of fibers and stress redistribution in cement matrix.