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http://dx.doi.org/10.6117/kmeps.2022.29.2.001

Improvement of Reliability of Low-melting Temperature Sn-Bi Solder  

Jeong, Min-Seong (Department of Advanced Materials Engineering, Chungbuk National University)
Kim, Hyeon-Tae (Department of Advanced Materials Engineering, Chungbuk National University)
Yoon, Jeong-Won (Department of Advanced Materials Engineering, Chungbuk National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.2, 2022 , pp. 1-10 More about this Journal
Abstract
Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.
Keywords
Sn-58Bi solder; Mechanical properties; Low-melting temperature; Intermetallic compound; Flexible substrates;
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1 R. Raj, P. Shrivastava, N. Jindal, S. N. Alam, N. Naithani, M. Padhy, and M. M. Abbas, "Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys", J. Mater. Res., 110(12), 1150-1159 (2019).   DOI
2 S. Liu, T. Song, W. Xiong, L. Liu, and S. Huang, "Effects of Ag on the microstructure and shear strength of rapidly solidified Sn-58Bi solder", J. Mater. Sci.: Mater. Electron., 30(7), 6701-6707 (2019).   DOI
3 H. E. Peng, X. C. Lu, T. S. Lin, H. X. Li, A. N. Jing, M. A. Xin, and Y. Y. Qian, "Improvement of mechanical properties of Sn-58Bi alloy with multi-walled carbon nanotubes", Trans. Nonferrous Met. Soc. China, 22, 692-696 (2012).
4 L. Yang, W. Zhou, Y. Ma, X. Li, Y. Liang, W. Cui, and P. Wu, "Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging", Mater. Sci. Eng. A, 667, 368-375 (2016).   DOI
5 L. Yang, W. Zhou, Y. Liang, W. Cui, and P. Wu, "Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes", Mater. Sci. Eng. A, 642, 7-15 (2015).   DOI
6 M. McCormack, H. S. Chen, G. W. Kammlott, and S. Jin, "Significantly improved of Bi-Sn solder alloys mechanical properties by Ag-doping", J. Electron. Mater., 26(8), 954-958 (1997).   DOI
7 C. J. Lee, K. D. Min, H. J. Park, and S. B. Jung, "Mechanical properties of Sn-58wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests", J. Alloys Compd., 820, 153077 (2020).   DOI
8 R. M. Shalaby, "Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys", Mater. Sci. Eng. A, 560, 86-95 (2013).   DOI
9 H. Kang, B. Baek, and J. P. Jung, "Recent Low Temperature Solder of SnBi and Its Bonding Characteristics (in Kor.)", JWJ, 38(6), 576-583 (2020).
10 W. Dong, Y. Shi, Z. Xia, Y. Lei, and F. Guo, "Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy", J. Electron. Mater., 37(7), 982-991 (2008).   DOI
11 M. Li, Y. Tang, Z. Li, M. Zhu, and W. Wang, "Microstructure and mechanical properties of Sn-58Bi eutectic alloy with Cu/P addition", Mater. Res. Express., 7(11), 116502 (2020).   DOI
12 Z. Mei, and J. W. Morris, "Characterization of eutectic SnBi solder joints", J. Electron. Mater., 21(6), 599-607 (1992).   DOI
13 L. Yang, J. Dai, Y. Zhang, Y. Jing, J. Ge, and H. Liu, "Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder", J. Electron. Mater., 44(7), 2473-2478, (2015).   DOI
14 S. Amares, R. Durairaj, and S. H. Kuan, "Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles", Arch. Metall. Mater., 66, 407-418 (2021).
15 W. Zhu, Y. Ma, X. Li, W. Zhou, and P. Wu, "Effects of Al2O3 nanoparticles on the microstructure and properties of Sn58Bi solder alloys", J. Mater. Sci.: Mater. Electron., 29(9), 7575-7585 (2018).   DOI
16 Q. S. Zhu, H. Y. Song, H. Y. Liu, Z. G. Wang, and J. K. Shang, "Effect of Zn addition on microstructure of Sn-Bi joint", Proc. 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPTHDP), Beijing, 1043, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2009).
17 N. Jiang, L. Zhang, Z. Q. Liu, L. Sun, M. Y. Xiong, M. Zhao, and K. K. Xu, "Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder", J. Mater. Sci.: Mater. Electron., 30(19), 17583-17590 (2019).   DOI
18 B. Kim, H. Choi, H. Jeon, D. Lee, and Y. Sohn, "Mechanical Properties and Interfacial Reactions of Ru Nanoparticles Added Sn-58Bi Solder Joints (in Kor.)", J. Microelectron. Packag. Soc. 28(2), 95-103 (2021).   DOI
19 D. Grivas, K. L. Murty, and J. W. Morris Jr, "Deformation of Pb Sn eutectic alloys at relatively high strain rates", Acta Metall., 27(5), 731-737 (1979).   DOI
20 S. Zhou, C. H. Yang, S. K. Lin, A. N. AlHazaa, O. Mokhtari, X. Liu, and H. Nishikawa, "Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy", Mater. Sci. Eng. A, 744, 560-569 (2019).   DOI
21 L. Shen, P. Septiwerdani, and Z. Chen, "Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation", Mater. Sci. Eng. A, 558, 253-258 (2012).   DOI
22 F. Wang, H. Chen, Y. Huang, L. Liu, and Z. Zhang, "Recent progress on the development of Sn-Bi based low-temperature Pb-free solders", J. Mater. Sci.: Mater. Electron., 30(4), 3222-3243 (2019).   DOI
23 L. Yang, C. Du, J. Dai, N. Zhang, and Y. Jing, "Effect of nanosized graphite on properties of Sn-Bi solder" J. Mater. Sci.: Mater. Electron., 24(11), 4180-4185 (2013).   DOI
24 X. Li, Y. Ma, W. Zhou, and P. Wu, "Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys", Mater. Sci. Eng. A, 684, 328-334 (2017).   DOI
25 D. P. Jiang, Z. X. Yao, L. M. Yin, G. Wang, D. Li, and X. K. Tian, "Effect of minor Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi solder", Proc. 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, 1098, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2017).
26 Z. Zhao, C. Chen, C. Y. Park, Y. Wang, L. Liu, G. Zou, and Q. Wang, "Effects of package warpage on head-in-pillow defect", Mater. Trans., 56(7), 1037-1042 (2015).   DOI
27 K. N. Tu, Y. Liu, and M. Li, "Effect of Joule heating and current crowding on electromigration in mobile technology", Appl. Phys. Rev., 4(1), 011101 (2017).   DOI
28 D. Xie, D. Shangguan, D. Geiger, D. Gill, V. Vellppan, and K. Chinniah, "Head in pillow (HIP) and yield study on SIP and PoP assembly", Proc. 2009 59th IEEE Electronic Components and Technology Conference (ECTC), California, 752, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2009).
29 H. W. Miao, J. G. Duh, and B. S. Chiou, "Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints", J. Mater. Sci.: Mater. Electron., 11(8), 609-618 (2000).   DOI
30 L. Pu, Y. Huo, X. Zhao, K. N. Tu, and Y. Liu, "Undercooling and microstructure analysis for the design of low melting point solder", Proc. 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Chengdu, 1, IEEE Electronic Devices Society (EDS) (2021).
31 S. Cheng, C. M. Huang, and M. Pecht, "A review of lead-free solders for electronics applications", Microelectron. Reliab., 75, 77-95 (2017).   DOI
32 N. Hansen, "Hall-Petch relation and boundary strengthening", Scr. Mater., 51(8), 801-806 (2004).   DOI
33 Y. Maruya, H. Hata, I. Shohji, and S. Koyama, "Bonding characteristics of Sn-57Bi-1Ag low temperature lead-free solder to gold-plated copper", Procedia Eng., 184, 223-230 (2017).   DOI
34 Z. Wang, Q. K. Zhang, Y. X. Chen, and Z. L. Song, "Influences of Ag and In alloying on Sn- Bi eutectic solder and SnBi/Cu solder joints", J. Mater. Sci.: Mater. Electron., 30(20), 18524-18538 (2019).   DOI
35 S. Liu, Z. Liu, L. Liu, T. Song, W. Liu, Y. Tan, Z. San, and S. Huang, "Electromigration behavior of Cu/Sn-58Bi-1Ag/Cu solder Joints by ultrasonic soldering process", J. Mater. Sci.: Mater. Electron., 31(15), 11997-12003 (2020).   DOI
36 W. R. Osorio, L. C. Peixoto, L. R. Garcia, N. Mangelinck-Noel, and A. Garcia, "Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys", J. Alloys Compd., 572, 97-106 (2013).   DOI
37 A. T. Tan, A. W. Tan, and F. Yusof, "Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions", Sci. Technol. Adv. Mater., (2015).
38 S. Tikale, and K. Narayan Prabhu, "Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate", J. Mater. Sci., 32(3), 2865-2886 (2021).
39 A. Singh, R. Durairaj, and K. S. How, "Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As-Reflowed Low Mass Sn-58Bi (SB) Solder Alloy", J. Adv. Res. Fluid Mech. Therm. Sci., 77(1), 69-87 (2021)   DOI
40 Y. Li, and Y. C. Chan, "Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58BiAg composite solders", J. Alloys Compd., 645, 566-576 (2015).   DOI
41 T. Nishizawa, I. Ohnuma, and K. Ishida, "Examination of the Znenr relationship between grain size and particle dispersion", Mater. Trans. JIM, 38(11), 950-956 (1997).   DOI
42 L. T. Chen, and C. M. Chen, "Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization", J. Mater. Res., 21(4), 962-969 (2006).   DOI
43 K. Suganuma, "Advances in lead-free electronics soldering", Curr. Opin. Solid State Mater. Sci., 5(1), 55-64 (2001).   DOI
44 O. Mokhtari, and H. Nishikawa, "Effects of In and Ni addition on microstructure of Sn-58Bi solder joint", J. Electron. Mater., 43(11), 4158-4170 (2014).   DOI
45 Z. Zhu, Y. C. Chan, and F. Wu, "Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing", Microelectron. Reliab., 91, 179-182 (2018).
46 J. E. Lee, K. S. Kim, and S. H. Huh, "Development of SnZn Based Low Temperature Lead-Free Solder for Improvement of Oxidation Resistance (in Kor.)", JWJ, 29(5), 16-23 (2011).
47 X. Liu, M. Huang, C. M. L. Wu, and L. Wang, "Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder", J. Mater. Sci.: Mater. Electron., 21(10), 1046-1054 (2010).   DOI
48 R. S. Sidhu, R. Aspandiar, S. Vandervoort, D. Amir, and G. Murtagian, "Impact of processing conditions and solder materials on surface mount assembly defects", JOM., 63(10), 47-51 (2011).   DOI
49 F. Wang, D. Li, Z. Zhang, M. Wu, and C. Yan, "Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier", J. Mater. Sci.: Mater. Electron., 28(24), 19051-19060 (2017).   DOI
50 C. Zhang, S. D. Liu, G. T. Qian, Z. H. O. U. Jian, and X. U. E. Feng, "Effect of Sb content on properties of Sn-Bi solders", Trans. Nonferrous Met. Soc. China, 24(1), 184-191 (2014).   DOI
51 H. Ma, and J. C. Suhling, "A review of mechanical properties of lead-free solders for electronic packaging, J. Mater. Sci., 44(5), 1141-1158 (2009).   DOI
52 Y. Wei, Y. Liu, L. Zhang, and X. Zhao, "Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy", Mater. Charact., 175, 111089 (2021).   DOI
53 J. H. Park, J. C. Park, S. Shin, and K. W. Paik, "Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers", IEEE Trans. Compon. Packaging Manuf. Technol., 9(11), 2152-2159 (2019).   DOI