• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4378-4384
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Composites Research
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• v.20 no.6
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• pp.8-14
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• 2007

Debonding failure characteristics of the composite skin-stiffener specimens were experimentally investigated. The influences of bonding methods, types of stiffener shape and various secondary bonding parameters were evaluated. Present test results combined with the previous test results[1] showed that the failure displacement of the skin-stiffener specimens well evaluates the skin-stiffener debonding failure strength of the composite stiffened panels. The specimens with an open type stiffener had lower bending stiffness and larger failure displacement than those with a closed type stiffener. Secondary bonding and co-curing with adhesive had better failure strength than co-curing without adhesive film. Secondary bonded specimens failed by adhesive failure and co-cured specimens failed by delamination failure. As the bondline thickness was thinner, the skin-stiffener specimens had higher failure strength. The fillets had no influence on failure strength of the specimens. The influence of the surface roughness was shown according to types of stiffener shape.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.3
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• pp.130-135
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• 2002

This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.929-935
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• 1995

In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.12
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• pp.1981-1987
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• 2001

This paper documents the effect of surface treatment of aluminum on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. The optimal treatment condition of the aluminum was determined by measuring the contact angle and T-peel strength as functions of mixture ratio of acetylene gas to nitrogen gas. The mixture ratios used were 1:9, 3:7, 5:5, 7:3, and 9:1 Lap shear tests and T-peel tests were performed using surface-treated alumiunm/CFRP composites and regular alumiunm/CFRP composites. The results showed that the contact angle was minimized and the T-peel strength was maximized iota the mixture ratio of 5:5. The results also showed that the shear strength of surface-treated alumiunm/CFRP composites was 34% greater than that of regular alumiunm/CFRP composites. The T-peel strength of surface-treated alumiunm/CFRP composites was also 5 times greater than that of regular alumiunm/CFRP composites.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• The korean journal of orthodontics
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• v.39 no.4
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• pp.213-224
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• 2009

Objective: The aim of this study was to find out whether Er:YAG laser can aid in debonding ceramic brackets, and to see what kind of method will be the most appropriate for debonding. Methods: One hundred and ninety teeth, monocrystalline brackets ($MISO^{TM}$, HT, Ansan-Si, Korea), polycrystalline brackets ($Transcend^{TM}$ series 6000, 3M Untek, Monrovia, CA, USA) and the KEY Laser3 (KavoDental, Biberach, Germany) were used. Experimental groups were classified according to the type of ceramic brackets, and the amount of laser energy (0, 140, 300, 450, 600 mJ). After applying laser on the bracket at two points at 1 pulse each, the shear bond strength was measured. The effect of heat caused by laser was measured at the enamel beneath the bracket and pulp chamber. After measuring the shear bond strength, adhesive residue was evaluated and enamel surface was investigated using SEM. Results: All ceramic bracket groups showed a significant decrease in shear bond strength as the laser energy increased. The greatest average temperature change was $3.78^{\circ}C$ on the enamel beneath the bracket and $0.9^{\circ}C$ on the pulp chamber. Through SEM, crater shape holes caused by the laser was seen on the enamel and adhesive surfaces. Conclusions: If laser is applied on ceramic brackets for debonding, 300 - 450 mJ of laser energy will be safe and efficient for monocrystalline brackets ($MISO^{TM}$), and about 450 mJ for polycrystalline brackets ($Transcend^{TM}$ series 6000).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.