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http://dx.doi.org/10.5762/KAIS.2012.13.10.4378

Process Capability Optimization of a LED Die Bonding Using Response Surface Analysis  

Ha, Seok-Jae (Department of Mechanical Engineering, Inha University)
Cho, Yong-Kyu (Department of Mechanical Engineering, Inha University)
Cho, Myeong-Woo (Division of Mechanical Engineering, Inha University)
Lee, Kwang-Cheol (Korea Photonics Technology Institute)
Choi, Won-Ho (Wooree ATEC Co. LTD.)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.13, no.10, 2012 , pp. 4378-4384 More about this Journal
Abstract
In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.
Keywords
LED chip package; Die bonding(or attaching); Design of experiment; Response surface analysis;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
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