Process Capability Optimization of a LED Die Bonding Using Response Surface Analysis |
Ha, Seok-Jae
(Department of Mechanical Engineering, Inha University)
Cho, Yong-Kyu (Department of Mechanical Engineering, Inha University) Cho, Myeong-Woo (Division of Mechanical Engineering, Inha University) Lee, Kwang-Cheol (Korea Photonics Technology Institute) Choi, Won-Ho (Wooree ATEC Co. LTD.) |
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