Effects of Catalysts on the Adhesive Properties for Flip Chip Bonding |
Min, Kyung-Eun
(Advanced Welding & Joining Technology Center, KITECH)
Lee, Jun-Sik (Advanced Welding & Joining Technology Center, KITECH) Yoo, Se-Hoon (Advanced Welding & Joining Technology Center, KITECH) Kim, Mok-Soon (School of Materials Science & Engineering, Inha University) Kim, Jun-Ki (Advanced Welding & Joining Technology Center, KITECH) |
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