• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.7
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• pp.10-20
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• 2022

Recently, metal additive manufacturing (AM) is being investigated as a new manufacturing technology. In metal AM, powder bed fusion (PBF) is a promising technology that can be used to manufacture small and complex metallic components by selectively fusing each powder layer using an energy source such as laser or an electron beam. PBF includes selective laser melting (SLM) and electron beam melting (EBM). SLM uses high power-density laser to melt and fuse metal powders. EBM is similar to SLM but melts metals using an electron beam. When these processes are applied, the mechanical properties and microstructures change due to the many parameters involved. Therefore, this study is conducted to investigate the effects of the parameters on the mechanical properties and microstructures such that the processes can be performed more economically and efficiently.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.33-42
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• 2023

Throughout all industries, eco-friendliness is being promoted worldwide with focus on suppressing the environmental impact. With recent international environment policies and regulations supported by government, the electric vehicles demand is expected to increase rapidly. Battery system itself perform an essential role in EVs technology that is arranged in cells, modules, and packs, and each of them are connected mechanically and electrically. A multifaceted approach is necessary for battery pack bonding technologies. In this paper, pros and cons of applicable bonding technologies, such as resistance welding, laser and ultrasonic bonding used in constructing electric vehicle battery packs were compared. Each bonding technique has different advantages and limitations. Therefore, several criteria must be considered when determining which bonding technology is suitable for a battery cell. In particular, the shape and production scale of battery cells are seen as important factors in selecting a bonding method. While dealing with the types and components of battery cells, package bonding technologies and general issues, we will review suitable bonding technologies and suggest future directions.

• Composites Research
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• v.18 no.6
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• pp.26-33
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• 2005

The mechanical properties of composite materials may severely degrade in the presence of damage. Especially, the high-velocity impact such as bird strike, a hailstorm, and a small piece of tire or stone during high taxing, can cause considerable damage to the structures and sub-system in spite of a very small mass. However, it is not easy to detect the damage in composite plates using a single technique or any conventional methods. In this paper, the PVDF(polyvinylidene fluoride) film sensors were used for monitoring high-velocity impact damage initiation and propagation in composite laminates. The WT(wavelet transform) and STFT(short time Fourier transform) are used to decompose the sensor signals. A ultrasonic C-scan and a digital microscope are also used to examine the extent of the damage in each case. This research shows how various sensing techniques, PVDF sensor in particular, can be used to characterize high-velocity impact damage in advanced composite.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.31-36
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• 2011

This paper investigates the ESD robustness of the stacked output driver with a 0.13um CMOS process. To represent an actual I/O system, we implemented stacked output driver circuits with pre-drivers and a rail-based power clamp. We implemented eight kinds of circuits varying pre-driver input connections and stacked driver size. The test circuits are examined with TLP measurements. It is shown that breakdown current and voltage can be increased by connecting the pre-driver input to a power supply and using stacked devices of a similar size. Based on the test results, design guideline is suggested to improve ESD robustness of the stacked output drivers.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.1
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• pp.37-42
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• 2012

LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 ${\mu}m$ and thicknesses of 50 ${\mu}m$ in our experiment. The limits and applications of this method are also presented.

• Computational Structural Engineering
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• v.10 no.2
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• pp.255-263
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• 1997

The optimum design of most structural systems used in practice requires considering design variables as discrete quantities. The present paper shows that the linear approximation method is very effective as a tool for the discrete optimum designs of unsymmetric composite laminates. The formulated design problem is subjected to a multiple in-plane loading condition due to shear and axial forces, bending and twisting moments, which is controlled by maximum strain criterion for each of the plys of a composite laminate. As an initial approach, the process of continuous variable optimization by FDM is required only once in operating discrete optimization. The nonlinear discrete optimization problem that has the discrete and continuous variables is transformed into the mixed integer programming problem by SLDP. In numerical examples, the discrete optimum solutions for the unsymmetric composite laminates consisted of six plys according to rotated stacking sequence were found, and then compared the results with the nonlinear branch and bound method to verify the efficiency of present method.

• Journal of the Korea Institute of Building Construction
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• v.15 no.4
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• pp.413-423
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• 2015

Exterior Insulation and Finishing System(EIFS) is recognized as a promising alternative for energy reduction as energy reduction ratio of apartment is to be increased from 40% to 60% in 2017. However, EIFS is not actively applied to apartment because additional construction costs and duration are required for the current existing construction method of EIFS. Therefore, this study proposes a conceptual framework for concurrent construction method of EIFS which can reduce construction costs and duration by working sequentially from frame work to exterior insulation finishing work, and then verify the method's feasibility by analyzing a case study. It has been proven from the analysis that concurrent construction method of EIFS reduces 6.7% of construction duration and 13% of construction costs compared with the conventional exiting method. The proposed method is expected to contribute to invigorated application of EIFS to apartment.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.12
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• pp.1673-1678
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• 2019

There are various networks and communication methods are used in industrial communication. Enterprises need to convert communications between industrial devices and networks for production line expansion, factory upgrades, network segmentation, and SI. This requires designers manufactured by many manufacturers to provide communication equipment for data or protocol conversion in order to connect and transmit various other mechanical devices to the network. This paper designed industrial communication gateway that can support the transformation of industrial communication protocol using multi-layered communication module. Industrial communication gateways have a structure that connects individual communication modules using RS485 communication to multiple layers. Each communication module consisted of analog and digital data card, LAN, and CAN-enabled card. The main board processor used Atmega micro-processor, and the RS485 slot was placed to have a multi-layer communication module structure. These additive layer type communication modules support analog and digital I/O functions and LAN and CAN for wide use in industrial communication control and monitoring.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.26 no.3A
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• pp.457-464
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• 2006

Fiber-reinforced composite materials due to their high specific strength, high stiffness and light weight are becoming increasingly used in many engineering industry, especially in the aerospace, marin and civil, etc. In this paper, the buckling load and mode shapes of composite laminates with elliptical cross-section including transverse shear deformations are analyzed. For solving this problems, a versatile flat shell element has been developed by combining a membrane element with drilling degree-of-freedom and a plate bending element. Also, an improved shell element has been established by the combined use of the addition of enhanced assumed strain and the substitute shear strain fields. The combined influence of shell geometry and elliptical cross-sectional parameter, fiber angle, and lay-up on the buckling loads of elliptical cylinder is examined. The critical buckling loads and mode shapes analyzed here may serve as a benchmark for future investigations.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.