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A Study on ESD Robustness of Output Drivers for ESD Design Window Engineering  

Kim, Jung-Dong (School of Information & Communication Engineering, Sungkyunkwan University)
Lee, Gee-Du (School of Information & Communication Engineering, Sungkyunkwan University)
Choi, Yoon-Chul (School of Information & Communication Engineering, Sungkyunkwan University)
Kwon, Kee-Won (School of Information & Communication Engineering, Sungkyunkwan University)
Chun, Jung-Hoon (School of Information & Communication Engineering, Sungkyunkwan University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.48, no.12, 2011 , pp. 31-36 More about this Journal
Abstract
This paper investigates the ESD robustness of the stacked output driver with a 0.13um CMOS process. To represent an actual I/O system, we implemented stacked output driver circuits with pre-drivers and a rail-based power clamp. We implemented eight kinds of circuits varying pre-driver input connections and stacked driver size. The test circuits are examined with TLP measurements. It is shown that breakdown current and voltage can be increased by connecting the pre-driver input to a power supply and using stacked devices of a similar size. Based on the test results, design guideline is suggested to improve ESD robustness of the stacked output drivers.
Keywords
ESD; Electrostatic discharge; HBM; TLP; staked drivers;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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