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http://dx.doi.org/10.3795/KSME-A.2012.36.1.037

Solder Bump Deposition Using a Laser Beam  

Choi, Won-Suk (Dept. of Nano IT Fusion Program, Seoul National University of Science and Technology, Graduate School of NID Fusion Technology)
Kim, Jea-Woon (Dept. of Mechanical Design, Seoul National University of Science and Technology, Graduate School of Industry)
Kim, Jong-Hyeong (School of Mechanical Design & Automation Engineering, Seoul National University of Science and Technology)
Kim, Joo-Han (Dept. of Mechanical Engineering, Seoul National University of Science and Technology)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.36, no.1, 2012 , pp. 37-42 More about this Journal
Abstract
LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 ${\mu}m$ and thicknesses of 50 ${\mu}m$ in our experiment. The limits and applications of this method are also presented.
Keywords
Material Transfer; Solder Ball; IR Laser;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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1 Rho, J. H., Lee, T. M., Jo, J. D., Lee, S. H. and Kim, D. S., 2010, "A Study of Design and Manufacture of Metal Jet System for Ultra Fine Solder Ball," The Korean Society of Mechanical Engineering, pp. 339-340.
2 Lee, S. Y., Jang, J. H. and Park, J. H., 2010, " Self- Arrangement of Solder Balls by Using Droplet Microgripper and Solder Bump Creation Using the Same," The Korean Institute of Electrical Engineers, pp. 1299-1300.
3 Abtew, M. and Selvaduray, G. 2000, "Lead-free Solders in Microelectronics," Materials Science and Engineering, Vol. 27, pp. 95-141.   DOI   ScienceOn
4 Wang, C. and Holmes, A. S. 2001, "Laser-Assisted Bumping for Flip Chip Assembly," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 2, pp. 109-114.   DOI   ScienceOn
5 Kim, K. S. and Kim, J. Y., 2004, "A Study on the Ball-off of Via Balls Bonded by Solder Paste," Journal of the Korean Institute of Electrical and Electronic Material Engineers, Vol. 17, No. 6, pp. 575-579.   과학기술학회마을   DOI   ScienceOn
6 Yamada, H., Sano, T., Nakayama, T. and Miyamoto, I., 2002, "Optimization of Laser-Induced Forward Transfer Process of Metal Thin Films," Applied surface Science, pp. 411-415.
7 Tan, B., Venkatakrishnan, K. and Tok, K. G., 2003, "Selective Surface Texturing Using Femtosecond Pulsed Laser Induces Forward Transfer," Applied Surface Science, Vol. 207, pp. 365-371.   DOI   ScienceOn
8 Esrom, H., Zhang, J. Y., Kogelschatz, U. and Pedraza, A. J., 1995, "New Approach of a Laser- Induced Forward Transfer for Deposition of Patterned Thin Metal Films," Applied Surface Science, Vol. 86, pp. 202-207.   DOI   ScienceOn
9 Kim, H. D., Yun, D. Y. and Hwang, J. W., 2007, "Optimal Design of PCSB from Thermal Stress Analysis," Korean Society of Machine Tool Engineers, pp. 673-676.
10 David A. W. and Grosu, V., 2007, "The Effect of Melting-Induced Volumetric Expansion on Initiation of Laser-Induced Forward Transfer," Applied Surface Science, Vol. 253, pp. 4759-4763.   DOI   ScienceOn
11 Incopera, Dewitt, Bergman, Lavine, 2010, Fundamentals of Heat and Mass Transfer, WILEY, pp. 289-298.
12 Yilbas, B. S., Shuja, S. Z. and Khan, S. M. A., 2010, "Laser Repetitive Pulse Heating of Tool Surface," Optics & Laser Technology, Vol. 43, pp. 754-761.
13 Lee, J. H., Cho, Y. W., Chea, S. W. and Kim, Y. S., 2000, "Analysis of Temperature Distribution in Solder Bumps during Laser Fluxless Solder Bumping," Korean Institute of Metals and Materials, Vol. 38, No. 11, pp. 1528-1534.   과학기술학회마을
14 Yue, P., Feng, J. J., Liu, C. and Shen, J., 2004, "A Diffuse-Interface Method for Simulating Two-Phase Flows of Complex Fluids," Journal of Fluid Mechanics, Vol. 515, pp. 293-317.   DOI   ScienceOn
15 Lee, J., Kim, W., Ahn, D. H. and Lee, Y. H., 2001, "Laser Soldering for Chip-on-Glass Mounting in Flat Panel Display Application," Journal of ELECTRONIC MATERIALS, Vol. 30, No. 9, pp. 1255-1261.   DOI
16 Kang, H. J., Seo, J., Lee, J. H., Kim, J. O., Sin, H. W. and Kim, D. Y., 2006, "Research on Laser Soldering of Micro Solder-balls," Korean Society for Precision Engineering, pp. 661-662.   과학기술학회마을