• Korean Chemical Engineering Research
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• 제57권5호
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• pp.706-713
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• 2019

본 연구에서는 미세유체 시스템 제작에 적합한 3D 프린팅 방식 및 소재 별 표면특성 분석을 통해 각 응용 사례에 적합한 프린터 및 소재 선정에 가이드라인을 줄 수 있는 기초 연구를 수행하였다. 가장 보편적으로 사용되는 적층 방식과 해상도가 상대적으로 높은 광경화 방식에 대해 프린팅 방식과 소재에 따른 표면 특성을 살펴보았다. 적층 방식의 프린트물은 소재에 무관하게 후처리 전에는 친수성 특성을 보이나 아세톤 증기에 의한 후처리 후에는 소수성 특성을 보임을 확인할 수 있었다. SEM을 이용한 표면 조도 관찰을 통해 이러한 접촉각의 변화가 후처리에 의한 표면의 결 구조의 제거에 기인한 것임을 확인하였다. 광경화식 프린트물은 적층식 대비 친수성의 특성을 보였으나 소수성 코팅을 이용해 표면 개질이 가능함을 실험적으로 확인하였다. 두 프린팅 방식 중 투명한 재질이 요구되는 경우, 적층 방식은 투명한 시편을 만드는 것이 불가능함을 확인하였으며 광경화 방식의 경우 충분한 투명도가 확보됨을 확인하였다. 액적 접촉충전 현상에 기반한 디지털 전기천공 시스템의 electroporation chip을 광경화 방식으로 제작하였으며 성공적으로 전기천공을 시연함으로써 미세유체 시스템에 직접 적용이 가능함 또한 확인하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.371-374
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• 2007

A method for metal nano powder imprinting is proposed as a patterning process for conductive tracks that is inexpensive and scalable down to the nanoscale. Conductive tracks with line widths of $0.5{\sim}20{\mu}m$ were fabricated using this method. The processing conditions were optimized to avoid various types of defects, and to increase the degree of sintering and electric conductivity of the imprinted conductive tracks. The mean electric resistivity of the conductive tracks imprinted under optimum conditions was $8.95{\mu}{\Omega}{\cdot}cm$, which is in the range required for practical applications.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.199-204
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• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• 한국전기전자재료학회논문지
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• 제33권1호
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• pp.21-24
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• 2020

We investigated a solution-driven Yttrium Tin Oxide (YSnO) film that was imprinted using a parallel nanostructure as a liquid crystal (LC) alignment layer. The imprinting process was conducted at the annealing temperature of 100℃. To evaluate the effect of this process, we conducted surface analyses including atomic force microscopy (AFM). During imprinting, the surface roughness was reduced, and anisotropic characteristics were observed. Planar LC alignment was observed at a pretilt angle of 0.22° on YSnO film. Surface anisotropy induced by imprinting method forces LC to align along the direction of the parallel nanostructure, which is an alternative to conventional polyimide treated using a rubbing process.

• 소성∙가공
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• 제22권1호
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• pp.36-41
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• 2013

The present study examines the micro-pattern replication on a plastic film using ultrasonic imprinting. Ultrasonic imprinting uses ultrasonic waves to generate repetitive microscale deformation in the polymer film. The resulting deformation heat on the surface of the film causes the surface region to soften sufficiently so that a replication of the micro-pattern can be obtained. To successfully replicate the micro-pattern on a large area of polymer film, a high replication ratio is needed as well as good uniformity over the entire region. In this study, a horn design is investigated by finite element analysis and is optimized through a response surface analysis. In the ultrasonic imprinting experiments, the response surface method was also used to determine the optimal processing conditions for better replication characteristics.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.196-198
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• 2003

Classical lithography in semiconductor employs stepper technologies. Limits of this technology are clearly seen at structures below 100nm. Nano-imprinting lithography is a new method for generating patterns in submicron range at reasonable cost. In order to manufacture nano-imprinting lithography(NIL) equipment, several NIL manufacturers have been developing key technologies for realization of nano-imprinting process, recently. In this paper, we've been describe state-of-the-art and technology trends for nano-imprinting lithography equipments.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2008년도 춘계학술대회논문집
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• pp.579-584
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• 2008

A nano-imprinting stage has been widely used in various fields of nanotechnology. In this study, an analysis method of a nano-imprinting stage machine using FEM and flexible multi-body vibration has been presented. The simulation using CAE for the imprinting machine is to analyze vibration characteristics of 3-axis nano-imprinting stage and 4-axis nano-imprinting stage. Structural components such as the upper plate have been modeled with finite elements to analyze flexibility effects during the precision stage motion. In this paper flexible multi-body dynamic simulation is executed to support robust design of the precision stage mechanism.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.844-849
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• 2008

A nano-imprinting stage has been widely used in various fields of nano-technology. In this study, A 4-axis nano-imprinting stage is modeled with using the 3D-CAD Tool. Structural components such as an upper-plate, bearings and cross-roller-guides are modeled with finite elements to analyze flexibility effect during the precision stage motion. In addition, Dynamic analysis is executed to reproduce actual motion of 4-axis nano imprinting stage.

• Tribology and Lubricants
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• 제24권6호
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• pp.326-331
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• 2008

The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size $470{\times}370\;mm^2$ LCD panel.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.148-148
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• 2004

전 세계적으로 컴퓨터 및 이동통신의 급속한 발전과 함께 전자, 통신부품을 비롯한 각종 부품들의 초소형화, 고기능화가 요구되고 있다. 이러한 추세에 따라 수 $\mu\textrm{m}$ 의 크기와 수 nm의 정밀도를 갖는 MEMS기술과 NANO 기술에 대한 연구가 활발히 전개되고 있다 MEMS 기술의 경우기존의 생산, 가공 공정과는 완전히 다른 반도체공정을 기반으로 한 리소그래피(lithography) 기술이나 전기도금(electroplating) 등의 기존 기계공학적 생산, 가공 방법을 넘어선 기술을 사용하게 되며 NANO 기술 역시 분자, 원자 단위를 기초로 한 AFM(atomic force microscope) 기술과 임프린팅(nanoimprinting) 기술 등의 새로운 기술을 접목시키는 생산 방법을 사용한다.(중략)