• Korean Chemical Engineering Research
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• v.57 no.5
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• pp.706-713
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• 2019

In this study, basic research was conducted to provide guidelines for selecting printers and materials suitable for each application case by analyzing 3D printing method and surface characteristics of materials suitable for microfluidic system. We have studied the surface characteristics according to the materials for the two typical printing methods: The most commonly used method of Fused Deposition Modeling (FDM) printing and the relatively high resolution method of Stereolithography (SLA) printing. The FDM prints exhibited hydrophilic properties before post - treatment, regardless of the material, but showed hydrophobic properties after post - treatment with acetone vapor. It was confirmed by the observation of surface roughness using SEM that the change of the contact angle was due to the removal of the surface structure by post-treatment. SLA prints exhibited hydrophilic properties compared to FDM prints, but they were experimentally confirmed to be capable of surface modification using hydrophobic coatings. It was confirmed that it is impossible to make a transparent specimen in the FDM method. However, sufficient transparency is secured in the case of the SLA method. It is also confirmed that the electroporation chip of the digital electroporation system based on the droplet contact charging phenomenon was fabricated by the SLA method and the direct application to the microfluidic system by demonstrating the electroporation successfully.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.371-374
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• 2007

A method for metal nano powder imprinting is proposed as a patterning process for conductive tracks that is inexpensive and scalable down to the nanoscale. Conductive tracks with line widths of $0.5{\sim}20{\mu}m$ were fabricated using this method. The processing conditions were optimized to avoid various types of defects, and to increase the degree of sintering and electric conductivity of the imprinted conductive tracks. The mean electric resistivity of the conductive tracks imprinted under optimum conditions was $8.95{\mu}{\Omega}{\cdot}cm$, which is in the range required for practical applications.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.199-204
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• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.1
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• pp.21-24
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• 2020

We investigated a solution-driven Yttrium Tin Oxide (YSnO) film that was imprinted using a parallel nanostructure as a liquid crystal (LC) alignment layer. The imprinting process was conducted at the annealing temperature of 100℃. To evaluate the effect of this process, we conducted surface analyses including atomic force microscopy (AFM). During imprinting, the surface roughness was reduced, and anisotropic characteristics were observed. Planar LC alignment was observed at a pretilt angle of 0.22° on YSnO film. Surface anisotropy induced by imprinting method forces LC to align along the direction of the parallel nanostructure, which is an alternative to conventional polyimide treated using a rubbing process.

• Transactions of Materials Processing
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• v.22 no.1
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• pp.36-41
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• 2013

The present study examines the micro-pattern replication on a plastic film using ultrasonic imprinting. Ultrasonic imprinting uses ultrasonic waves to generate repetitive microscale deformation in the polymer film. The resulting deformation heat on the surface of the film causes the surface region to soften sufficiently so that a replication of the micro-pattern can be obtained. To successfully replicate the micro-pattern on a large area of polymer film, a high replication ratio is needed as well as good uniformity over the entire region. In this study, a horn design is investigated by finite element analysis and is optimized through a response surface analysis. In the ultrasonic imprinting experiments, the response surface method was also used to determine the optimal processing conditions for better replication characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.196-198
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• 2003

Classical lithography in semiconductor employs stepper technologies. Limits of this technology are clearly seen at structures below 100nm. Nano-imprinting lithography is a new method for generating patterns in submicron range at reasonable cost. In order to manufacture nano-imprinting lithography(NIL) equipment, several NIL manufacturers have been developing key technologies for realization of nano-imprinting process, recently. In this paper, we've been describe state-of-the-art and technology trends for nano-imprinting lithography equipments.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.579-584
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• 2008

A nano-imprinting stage has been widely used in various fields of nanotechnology. In this study, an analysis method of a nano-imprinting stage machine using FEM and flexible multi-body vibration has been presented. The simulation using CAE for the imprinting machine is to analyze vibration characteristics of 3-axis nano-imprinting stage and 4-axis nano-imprinting stage. Structural components such as the upper plate have been modeled with finite elements to analyze flexibility effects during the precision stage motion. In this paper flexible multi-body dynamic simulation is executed to support robust design of the precision stage mechanism.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.844-849
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• 2008

A nano-imprinting stage has been widely used in various fields of nano-technology. In this study, A 4-axis nano-imprinting stage is modeled with using the 3D-CAD Tool. Structural components such as an upper-plate, bearings and cross-roller-guides are modeled with finite elements to analyze flexibility effect during the precision stage motion. In addition, Dynamic analysis is executed to reproduce actual motion of 4-axis nano imprinting stage.

• Tribology and Lubricants
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• v.24 no.6
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• pp.326-331
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• 2008

The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size $470{\times}370\;mm^2$ LCD panel.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.148-148
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• 2004

전 세계적으로 컴퓨터 및 이동통신의 급속한 발전과 함께 전자, 통신부품을 비롯한 각종 부품들의 초소형화, 고기능화가 요구되고 있다. 이러한 추세에 따라 수 $\mu\textrm{m}$ 의 크기와 수 nm의 정밀도를 갖는 MEMS기술과 NANO 기술에 대한 연구가 활발히 전개되고 있다 MEMS 기술의 경우기존의 생산, 가공 공정과는 완전히 다른 반도체공정을 기반으로 한 리소그래피(lithography) 기술이나 전기도금(electroplating) 등의 기존 기계공학적 생산, 가공 방법을 넘어선 기술을 사용하게 되며 NANO 기술 역시 분자, 원자 단위를 기초로 한 AFM(atomic force microscope) 기술과 임프린팅(nanoimprinting) 기술 등의 새로운 기술을 접목시키는 생산 방법을 사용한다.(중략)