• Korean Journal of Materials Research
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• v.8 no.5
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• pp.470-473
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• 1998

$As^+$ was ion-implanted onto $CoSi_{2}$ thin films formed by rapidly thermal-annealed Co/Ti bilayers. Then the specimens were drive-in annealed at 500~100$0^{\circ}C$ to form ultra-shallow $n^+$p junction diodes and to measure their 1- V characteristics. When drive-in annealed at 50$0^{\circ}C$ for 280 sec., 50 nm thick ultra-shallow junctions were formed and di¬odes showed the best 1- V characteristics with low leakage current. In particular. the leakage current was 2 orders lower than that of diodes formed by using Co monolayer. It was attributed to uniform $CoSi_{2}$/Si interfaces.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.150-150
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• 2008

고효율 LED를 얻기 위해서는 LED의 내부 양자효율과 외부 양자효율이 높아야 한다. 현재 GaN-Based LED의 내부 양자효율은 결정의 질의 개선 및 이중이종접합 또는 다중양자우물 구조와 같이 활성층의 캐리어 농도를 높이는 접합구조로 설계되어 거의 100%에 가까워졌다. 그러나 외부 양자효율은 반도체 재료의 높은 굴절률로 인하여 외부로 탈출하지 못하고 내부로 전반사 되어 반도체 내부에 갇히게 되는데 이처럼 갇힌 빛은 반도체와 중간 Interface에 TIR(total internal reflection) 또는 반사판에 의해 계속적으로 반사 된다. 그러므로 이를 해결하기 위한 플립칩 구조, 포토닉 크리스탈 등의 여러 가지 방법들이 제시되고 있지만 아직도 더 높은 외부 양자 효율의 개선을 요구하고 있다. 본 연구에서는 새로운 형태의 반사판(Al) 즉 p-GaN과 반사판 사이의 interlayer로 반사판과의 오믹 접촉을 고려한 Embo type의 NiO를 구현하여 반사된 빛의 방향을 내부반사를 줄일 수 있는 방향으로 변화시킴으로써 광 추출 효율의 향상을 기대할 수 있게 되었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.2
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• pp.104-109
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• 2019

An analytical threshold voltage model is proposed to analyze the threshold voltage roll-off and drain-induced barrier lowering (DIBL) for a junction-based double-gate (JBDG) MOSFET and a junction-less double-gate (JLDG) MOSFET. We used the series-type potential distribution function derived from the Poisson equation, and observed that it is sufficient to use n=1 due to the drastic decrease in eigenvalues when increasing the n of the series-type potential function. The threshold voltage derived from this threshold voltage model was in good agreement with the result of TCAD simulation. The threshold voltage roll-off of the JBDG MOSFET was about 57% better than that of the JLDG MOSFET for a channel length of 25 nm, channel thickness of 10 nm, and oxide thickness of 2 nm. The DIBL of the JBDG MOSFET was about 12% better than that of the JLDG MOSFET, at a gate metal work-function of 5 eV. It was also found that decreasing the work-function of the gate metal significantly reduces the DIBL.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.4
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• pp.127-134
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• 2021

In this study, the adhesive fracturing characteristics of a DCB specimen due to single and heterogeneous bonding materials under tearing load was investigated. The experiments were conducted to examine the fracturing properties of the adhesive DCB specimen. As an experimental condition, a forced displacement of 3mm/min was applied to one side while the other side was fixed. As a result of the experiment, it was found that the AL6061-T6 material was superior to the CFRP material in terms of maximum stress, specific strength, and energy release rate when compared to the adhesive fracturing property of a single material. We tested CFRP-AL, a heterogeneous bonding material, and compared its experimental results to the results from the single materials. Based on these results, CFRP-AL with a heterogeneous bonding material was observed to have the superior structural safety compared to single materials for the mode III fracture type.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.7
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• pp.2865-2871
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• 2012

In this study, the fracture behaviour of DCB(double cantilever beam) specimen with aluminum foam composite materials is analyzed by simulation. By comparing the analysis results with two models of 25 mm and 40 mm, the model with thickness of 25 mm is weaker than 40 mm at fatigue life and damage. Two models are unfavorable at 'SAE Transmission' in case of nonuniform fatigue load and rainflow matrices are weakest at 'SAE Bracket history'. In damage matrices, the model with 25 mm of thickness is weaker than the model with 40 mm of thickness but the model with 40 mm of thickness relative damage possibility is higher than in case of 25 mm. As two models are safest at 'SAE Transmission', the relative damage becomes the lowest value from 1.1 to 1.8 %. The mechanical property can be investigated by applying these analyses results with the real composite structure bonded with adhesive and analyzing fracture behaviour.

• Composites Research
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• v.29 no.2
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• pp.85-89
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• 2016

This paper aims at estimating the fracture behavior at the bonded part of composite material. CFRP is manufactured as the type of TDCB. The static analysis of Mode 1 due to the configuartion factor of m is carried out. Four kinds of specimens have the configuartion factor(m) of 2, 2.5, 3 and 3.5. As the study result, the displacements at specimens are shown to be similar each other in these four cases. At m of 3.5, the reaction force becomes highest as 412 N and is shown to be improved as much as 14% by comparing m of 2. The data on defection of the bonded interface and reaction force are thought to be contributed to the structural design of CFRP and the safe design.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.133-140
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• 2019

The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1^st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2^nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

• Journal of Satellite, Information and Communications
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• v.8 no.3
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• pp.47-51
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• 2013

In this paper, we present design and test results of a Ka-band dual-band ortho-mode transducer (OMT) for use in a feed assembly for the very small aperture terminals (VSATs). The designed ortho-mode transducer have wideband characteristics to separate the signals that have two orthogonal linear polarizations operating at 20GHz of receive frequency band and at 30GHz of transmit frequency band. In addition, in order to reduce the volume of the feed assebly, a Boifot based ortho-mode transducer has been designed with a dual-band. Experimental results for the design verification, the return loss in the receive band and in the transmit band for the horizontal polarization showed over 20dB and 21dB, respectively, and for the vertical polarization showed over 20dB and 24dB, respectively. The port isolation for the horizontal polarization and the vertical polarization showed over 43dB and 52dB, respectively, in the receive band and in the vertical band.

• Journal of the Earthquake Engineering Society of Korea
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• v.14 no.5
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• pp.41-51
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• 2010

For safe seismic evaluation and design, it is necessary to predict the plastic deformation demands of members. In the present study, a quick and reasonable method for the evaluation of member plastic deformations of dual systems was developed on the basis of results of elastic analysis, without using nonlinear analysis. Plastic deformations of beams, columns, and walls are functions of member stiffness, story drift ratio, and moment redistribution determined from elastic analysis. For dual systems with rigid connections between walls and beams, an increase in the plastic deformations of beams due to the rocking effect was considered. The proposed method was applied to 8-story dual systems and the predicted plastic deformations were compared with the results of nonlinear analysis. The results showed that the proposed method accurately predicted the member plastic deformations with simple calculations, but that for the accurate evaluation of member plastic deformations, the inelastic story drift ratio must also be predicted with accuracy. The proposed method can be applied to both the performance-based seismic design of new structures and the seismic evaluation of existing structures.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.7
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• pp.387-392
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• 2019

A technique was researched to detect bolt looseness using a transfer impedance technique (the dual piezoelectric material technique) for monitoring the structural health of a bolt joint. In order to use the single piezoelectric material technique, an expensive impedance analyzer should be used. However, in the transfer impedance technique, low-cost fault detection can be performed using a general function generator and a digital multimeter. A steel plate frame test specimen composed of bolt joints was fabricated, and the tightening torques of the bolts were loosened step by step. By using the transfer impedance method, the damage index was obtained. It was found that the presence of faults could be reasonably estimated using the damage index, which increased with the degree of bolt looseness. An experiment was performed on the same specimen using the single piezoelectric material technique, and the results showed a similar tendency. It could be possible to estimate the damage of a bolt joint at low cost by eliminating the expensive impedance analyzer. This method could be used effectively for structural health monitoring after carrying out a study to estimate the fault location and severity.