• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.993-997
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• 2004

A data error inspection algorithm for wireless digital data communication was developed. Original data converted By wireless digital data error inspection algorithm. Wireless digital data is high possibility to get distortion and lose by noise and barrier on wireless. If the data check damaged and lost at receiver, can't make it clear and can't judge whether this data is right or not. Therefore, by wireless transmission data need the data error inspection algorithm in order to decrease the data distortion and lose and to monitoring the transmission data as real time. This study consists of RF station for wireless transmission, Water Level Meter station for water level measurement and Error inspection algorithm for error check of transmission data. This study is also that investigation and search for error inspection algorithm in order to wireless digital data transmission in condition of the least data's damage and lose. Designed transmitter and receiver with one - chip micro process to protect to swell the volume of circuit. Had designed RF transmitter - receiver station simply by means of ATMEL one - chip micro processing the systems. Used 10mW of the best RF power and 448MHz-449MHz on frequency band which is open to public touse free within the limited power.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.7
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• pp.14-22
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• 2016

Because fuses have many parts, human error can occur during visual inspections. This paper proposes an automatic ammunition test algorithm for preventing human error during an inspection. The automatic ammunition test algorithm consists of the following three steps. First, the image input and preprocessing step is where an inspection image is rotated using an image rotation algorithm and the image is converted to a binary image. Second, the inspection step of arming determines if the ammunition is armed using Masked Template Matching algorithm, etc. Third, the inspection step of the parts determines if the parts are omitted using an image searching algorithm, etc. The arming or parts omission of the fuse are detected efficiently using the ammunition automatic test algorithm. The ammunition automatic test algorithm is expected to help improve the safety and reliability of 40 mm grenade fuse.

• Proceedings of the Korean Information Science Society Conference
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• 1998.10c
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• pp.535-537
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• 1998

본 논문에서는 이진화된 영상에서의 2차원 정보와 그레이 영상에서의 3차원 프로파일 정보를 이용하여 BGA의 불량 상태를 시각적으로 검사하는 시스템에 대해서 기술한다. BGA의 결함을 자동으로 판정하기 위해 사용된 알고리즘은 이진 영상에서의 특징점들과 그레이영상의 3차원 프로파일 정보를 이용한 모델 정합 기술을 이용한다. 두가지 단계를 분리 검사함으로써 생산라인에서 초기에 에러를 검출해낼 수 있는 잇점이 있다. 그러나 조명이 열악한 경우에는 에러 인식율이 낮아진다.

• Journal of Advanced Marine Engineering and Technology
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• v.25 no.2
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• pp.375-382
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• 2001

In this study, an adapted Turbo Coding Algorithm for reducing communication error of a fire detection system for marine vessels, especially image transmission via power lone. Because it is necessary that this system communicate larger and faster than previous method, this study carried out enhancement a decoding speed by adaptation CRC with Turbo Code Algorithm, improvement of metric method, and reduction of decoding delay by using of Center-to-Top method. And the results are as follows: (1) Confirmed that a Turbo Code is so useful methods for reducing communication error in lots of noise environments. (2)Proposed technology in this study speed increasing method of Turbo Coding Algorithm proves 2 times faster than normal Turbo Code and communication error reducing as well in the board made by VHDL software & chips ALTERA company.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.255-255
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• 2004

일반적으로 10,000 rpm 이상의 고속, 고이송 가공이 수행되는 고속가공에서 절삭력의 급격한 증가는 치명적인 결과를 초래할 수 있다. 따라서 실제 가공에 앞서 NC code에 존재하는 에러 유무를 검출하고, 주어진 절삭 조건의 적합성을 사전에 검사하는 NC 모의 가공 시스템의 중요성이 점점 강조되고 있는 실정이다. 절삭 영역의 탐색에는 일반적으로 Z-map 방식이 사용되고 있다. Z-map 방식은 자료구조의 단순성과 완결성으로 인하여 계산속돈가 라르고 오류 발생의 가능성이 상대적으로 낮기 때문에 상용 CAM 시스템은 대부분 이 방식을 기반으로 하고 있다.(중략)

• KIPS Transactions on Computer and Communication Systems
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• v.4 no.9
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• pp.321-326
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• 2015

In this paper, we proposed an algorithm which could transmit reliable data between smart devices by using inaudible high frequency of audible frequency range and cyclic redundancy check method. The proposed method uses 18 kHz~22 kHz as high frequency which inner speaker of smart device can make a sound in audible frequency range (20 Hz~22 kHz). To increase transmission quantity of data, we send mixed various frequencies at high frequency range 1 (18.0 kHz~21.2 kHz). At the same time, to increase accuracy of transmission data, we send some mixed frequencies at high frequency range 2 (21.2 kHz~22.0 kHz) as checksum. We did experiments about data transmission between smart devices by using the proposed method to confirm data transmission speed and accuracy of the proposed method. From the experiments, we showed that the proposed method could transmit 32 bits data in 235 ms, the transmission success rate was 99.47%, and error detection by using cyclic redundancy check was 0.53%. Therefore, the proposed method will be a useful for wireless transmission technology between smart devices.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.6
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• pp.80-85
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• 2010

BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.

• Journal of the Institute of Convergence Signal Processing
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• v.16 no.3
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• pp.90-95
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• 2015

This study presents a method to test quite small-sized and light-weighted micro-drill bits which are used to make holes in printed circuit boards(PCB). After getting images of micro-drill bits through the high resolution microscope, we developed image processing algorithms to detect fiducial points, and then measured diverse factors of the drill-bit based on these points. We also developed the window-based inspection system to automatically discriminate normal and abnormal status. For the relative comparison of its performance, the system was compared with an existing inspection system using test images. Experimental results showed that the proposed system slightly improved performance, and also classified correctly some misjudged errors which were occurred in the existing system.

• Proceedings of KOSOMES biannual meeting
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• 2005.11a
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• pp.197-202
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• 2005

Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection using subpixel edge detection method in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.4
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• pp.793-799
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• 2007

Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm, because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection with subpixel edge detection in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.