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Development of an Accuracy-improved Vision Inspection System for BGA Solder Ball  

Huh, Kyung-Moo (Dankook university. Dept. of electronics engineering)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SC / v.47, no.6, 2010 , pp. 80-85 More about this Journal
Abstract
BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.
Keywords
BGA Solder Ball; Vision System; Accuracy; Orientation Error;
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