• Journal of the Korean Vacuum Society
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• v.22 no.1
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• pp.31-36
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• 2013

For the simplification of doping process in amorphous carbon film, arsenic (As) ions were implanted on the nucleated silicon wafer before the growth process. Then amorphous carbon films were grown at the condition of $CH_4/H_2=5%$ by microwave plasma chemical vapour deposition. Because the implanted seeds were grown at the high temperature and the implanted ions were spread, it was possible to reduce the process steps by leaving out the annealing process. When the implanted amorphous carbon films were electrically characterized in diode configuration, field emission current of $0.1mA/cm^2$ was obtained at the applied electric field of about $2.5V/{\mu}m$. The results show that the implanted As ions were sufficiently doped by the self-annealing process by using the growth after implantation.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.2
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• pp.73-80
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• 1990

The formation of Ti-silicides with the type of substrate, the species and the concentration of dopant, and the annealing temperature was investigated with sheet resistance and thickness measurement, elemental depth profilling, and microstructure. It was directly affected by the type of substrate, the species and the concentration of dopant, and the annealing temperature. For the amorphous Si substrate, the smothness of $TiSi_2/Si$ interface was increased. Above concentr-ation of $1{\times}10^{16}ions/cm^2$, the rate of $TiSi_2/Si$ formation was decreased and the sheet resistance was increased. The initial profile of dopant according to the implantation energy was one of the factors influencing the out-diffusion of dopant. In $POCI_3$ process, this was less than in ion implantation process.

• Korean Journal of Materials Research
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• v.11 no.2
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• pp.115-119
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• 2001

The electrical properties of heavily drawn bundled Cu- Nb filamentary microcomposite wires were examined and correlated with the microstructural changes caused by thermomechanical treatments. The cross sectional shape of Nb filaments in wires fabricated by bundling and drawing appear straight or slightly curved. The different shape of Nb filaments is attributed to the break- up and cylinderization of Nb filaments during the bundling process at high temperatures. The resistivity of Cu-Nb microcomposites is predominantly controlled by electron scattering at Cu-Nb interfaces. The decrease of the conductivity below the annealing temperature of $400^{\circ}C$ is due to the increasing contribution of the scattering associated with coherency strains of needle- shaped precipitates. The slight decrease of the resistivity ratio (${\rho}_{295K}/{\rho}_{75K}$) is also due to the precipitation of Nb atoms. The increase in conductivity in Cu-Nb microcomposites at an annealing temperature of 50$0^{\circ}C$ is due to the coarsening and spheroidization of Nb filaments.

• Journal of Digital Contents Society
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• v.19 no.2
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• pp.343-349
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• 2018

The proposed hybrid algorithm combines the benefits of rapid convergence property of mean filed annealing(MFA) and the effective genetic operations of simulated annealing-like genetic algorithm(SGA). This algorithm is applied to the isotropic material stock cutting problem, especially to glass cutting in distributed computing environments base on MPI called message passing interface. The glass cutting is to place the required rectangular patterns to the given large glass sheets resulting in reducing the wasted scrap area. Our experimental results show that the heuristic method improves the performance over the conventional ones by decreasing the scrap area and maximum execution time. It is also proved that the proposed distributed algorithm maintains the convergence properties of sequential one while it achieves almost linear speedup as the problem size increases.

• Journal of the Korean Magnetics Society
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• v.17 no.5
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• pp.198-204
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• 2007

The effects of annealing temperature on electromagnetic wave absorption characteristics in $Fe_{73.5}Cu_1Nb_3Si_{15.5}B_7$ (at%) alloy flakes/polymer composite sheets available for quasi-microwave band have been investigated. The composite sheet including the magnetic flakes annealed at $425{\sim}475^{\circ}C$ for 1 h exhibited highest power loss in the GHz frequency range as compared with the sheets composed of the alloy flakes annealed at higher temperature than $475^{\circ}C$ or in as-milled state. Moreover the imaginary part of complex permeability had largest value in the GHz frequency range for the sheets including the flakes annealed at $425{\sim}475^{\circ}C$. The large value of power loss of the sheets including the magnetic flakes annealed at $425{\sim}475^{\circ}C$ was attributed to the high imaginary part of the complex permeability. However, because of its large transmission parameter $S_{21}$, the composite sheet having the magnetic flakes annealed at $525^{\circ}C$ showed low power loss.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.240-247
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• 2003

The tribological characteristics of FDTS (1H, 1H, 2H, 2H-Perflurodecyltrichlorosilane) SAM (self-assembled monolayer) and OTS (octadecyltrichlorosilane) SAM treated by high temperature annealing have been investigated from the viewpoint of stiction, adhesion and friction in micro/nano scale. From the experimental results, it was found that OTS SAM gets destroyed at 20$0^{\circ}C$ and stiction, adhesion and friction coefficient increased, but FDTS SAM was stable up to 40$0^{\circ}C$. Also, it was found that the friction coefficient of normal OTS SAM below 20$0^{\circ}C$ is lower than that of FDTS SAM in micro/nano scale, but stiction and adhesion is vice versa. This work shows the importance of surface group of self-assembled monolayer in dictating the tribological characteristics and thermal stability.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.5
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• pp.42-49
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• 2007

This paper introduces a study on reliability-driven device placement using simulated annealing algorithm which can be applicable to MCM or electronic systems embedded in a spacecraft running at thermal conduction environment. Reliability of the unit's has been predicted with the devices' junction temperatures calculated from FDM solver and optimized by simulated annealing algorithm. Simulated annealing in this paper adopts swapping devices method as a perturbation. This paper describes and compares the optimization simulation results with respect to two objective functions: minimization of failure rate and minimization of average junction temperature. Annealing temperature variation simulation case and equilibrium coefficient variation simulation case are also presented at the two respective objective functions. This paper proposes a new approach for reliability optimization of MCM and electronic systems considering those simulation results.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.106.2-106.2
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• 2012

Ti-Ni합금은 CsCl구조의 B2상, monoclinic 구조의 B19'(M)상과 rhombohedral 구조의 R상(R)이 나타난다고 알려져 있고, 이들 상의 변태에 의해 열탄성 마르텐사이트와 응력유기 마르텐사이트에 의한 형상기억효과와 초탄성 효과를 가지고 있다. 또한 Ti-Ni 합금은 우수한 형상기억특성을 가질 뿐만 아니라 생체적합성, 가공성 및 내식성 등이 뛰어나 공업분야 및 생체분야에서 폭 넓게 활용되고 있다. Ti-Ni합금의 형상기억특성은 냉간가공 후 어닐링 처리의 온도와 시간에 따른 matrix 내 Ni의 농도, 석출물의 밀도와 크기, 전위밀도와 전위주위의 응력장에 의해 영향을 받는다고 알려져 있다. 본 연구에서는 Ti-Ni합금의 형상기억 특성 및 변태온도에 미치는 영향을 조사하기 위해 다양한 냉간가공률의 시료를 제작하여 다양한 온도에서 Annealing 처리를 하여 냉간가공률 및 Annealing 온도가 형상기억특성에 미치는 영향을 조사하였다. Ti-50.4 at.% Ni 합금은 진공 아크 용해로에서 용해 하였으며, 용해된 Ingot는 열간단조 및 열간 압출한 후 냉간 인발과 중간온도에서 어닐링을 반복하면서 직경 0.5mm의 선재로 만들었다. 최종적으로 제작한 선재의 냉간가공률은 9.5%, 18.2%, 34.5%, 45% 이었다. 각 시편은 5X10-5torr의 진공으로 석영관에 진공 봉입하여 각각 673K, 723K, 783K에서 1hr 열처리 하였다. 합금의 형상기억특성과 변태온도는 DSC에 의해 조사되었다. DSC 측정 결과, 냉간가공률이 증가함에 따라 마르텐사이트 변태 온도는 감소하였고, 어닐링 온도가 증가함에 따라 마르텐사이트 변태 온도는 증가하였다. 또한 가공률이 증가하여도 R상 변태온도는 큰 변화가 없었고, Annealing온도가 증가함에 따라 R상 변태온도는 감소하였다. 또한, 형상기억특성은 인장시험기를 이용한 정하중 열싸이클 테스트를 이용하여 평가 하였다. 냉간 가공률이 증가함에 따라 안정한 형상기억특성을 나타내었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.99-99
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• 1995

• Proceedings of the Korean Magnestics Society Conference
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• 2007.12a
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• pp.200-201
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• 2007